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Download or read book 3D Power Electronics Integration and Manufacturing (3D-PEIM), International Symposium on written by and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 3D-PEIM written by and published by . This book was released on 2018 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 : 9781665499675
Total Pages : 0 pages
Book Rating : 4.4/5 (996 download)
Download or read book 2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) written by and published by . This book was released on 2023 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 : 9781728163161
Total Pages : pages
Book Rating : 4.1/5 (631 download)
Download or read book 2021 Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) written by and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : IEEE Staff
Publisher :
ISBN 13 : 9781665499682
Total Pages : 0 pages
Book Rating : 4.4/5 (996 download)
Download or read book 2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D PEIM) written by IEEE Staff and published by . This book was released on 2023-02 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This symposium features world class experts representing a far reaching range of disciplinary perspectives to advance the development of future 3D power electronics systems The Symposium encompasses additive, embedded, co designed, and integrated packaging technologies with sessions that address mechanical, materials, reliability, and manufacturability issues using small, smart, power dense components, and modules
Author : IEEE Staff
Publisher :
ISBN 13 : 9781538660188
Total Pages : pages
Book Rating : 4.6/5 (61 download)
Download or read book 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D PEIM) written by IEEE Staff and published by . This book was released on 2018-06-25 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Advancements in 3D integrated, embedded, and additively manufactured packaging for smaller, lighter, more efficient, and sustainable power electronic products
Download or read book 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) written by and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 3D-PEIM written by and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Johannes Karl Fink
Publisher : John Wiley & Sons
ISBN 13 : 1119555310
Total Pages : 342 pages
Book Rating : 4.1/5 (195 download)
Download or read book 3D Industrial Printing with Polymers written by Johannes Karl Fink and published by John Wiley & Sons. This book was released on 2018-11-30 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt: 3D industrial printing has become mainstream in manufacturing. This unique book is the first to focus on polymers as the printing material. The scientific literature with respect to 3D printing is collated in this monograph. The book opens with a chapter on foundational issues such and presents a broad overview of 3D printing procedures and the materials used therein. In particular, the methods of 3d printing are discussed and the polymers and composites used for 3d printing are detailed. The book details the main fields of applications areas which include electric and magnetic uses, medical applications, and pharmaceutical applications. Electric and magnetic uses include electronic materials, actuators, piezoelectric materials, antennas, batteries and fuel cells. Medical applications are organ manufacturing, bone repair materials, drug-eluting coronary stents, and dental applications. The pharmaceutical applications are composite tablets, transdermal drug delivery, and patient-specific liquid capsules. A special chapter deals with the growing aircraft and automotive uses for 3D printing, such as with manufacturing of aircraft parts and aircraft cabins. In the field of cars, 3D printing is gaining importance for automotive parts (brake components, drives), for the fabrication of automotive repair systems, and even 3D printed vehicles.
Author : Akhlesh Lakhtakia
Publisher : Springer Nature
ISBN 13 : 3031398246
Total Pages : 825 pages
Book Rating : 4.0/5 (313 download)
Download or read book The Advancing World of Applied Electromagnetics written by Akhlesh Lakhtakia and published by Springer Nature. This book was released on with total page 825 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Márta Rencz
Publisher : MDPI
ISBN 13 : 3039217364
Total Pages : 222 pages
Book Rating : 4.0/5 (392 download)
Download or read book Thermal and Electro-Thermal System Simulation written by Márta Rencz and published by MDPI. This book was released on 2019-11-18 with total page 222 pages. Available in PDF, EPUB and Kindle. Book excerpt: With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in the design phase. This can be done with thermal end electro-thermal design and simulation tools. This Special Issue of Energies, edited by two well-known experts of the field, Prof. Marta Rencz, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects twelve papers carefully selected for the representation of the latest results in thermal and electro-thermal system simulation. These contributions present a good survey of the latest results in one of the most topical areas in the field of electronics: The thermal and electro-thermal simulation of electronic components and systems. Several papers of this issue are extended versions of papers presented at the THERMINIC 2018 Workshop, held in Stockholm in the fall of 2018. The papers presented here deal with modeling and simulation of state-of-the-art applications that are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. Contributions covered the thermal simulation of electronic packages, electro-thermal advanced modeling in power electronics, multi-physics modeling and simulation of LEDs, and the characterization of interface materials, among other subjects.
Author : Andrea Baschirotto
Publisher : Springer Nature
ISBN 13 : 3030252671
Total Pages : 324 pages
Book Rating : 4.0/5 (32 download)
Download or read book Next-Generation ADCs, High-Performance Power Management, and Technology Considerations for Advanced Integrated Circuits written by Andrea Baschirotto and published by Springer Nature. This book was released on 2019-10-24 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is based on the 18 tutorials presented during the 28th workshop on Advances in Analog Circuit Design. Expert designers present readers with information about a variety of topics at the frontier of analog circuit design, including next-generation analog-to-digital converters , high-performance power management systems and technology considerations for advanced IC design. For anyone involved in analog circuit research and development, this book will be a valuable summary of the state-of-the-art in these areas. Provides a summary of the state-of-the-art in analog circuit design, written by experts from industry and academia; Presents material in a tutorial-based format; Includes coverage of next-generation analog-to-digital converters, high-performance power management systems, and technology considerations for advanced IC design.
Author : Nicolas Butzen
Publisher : Springer Nature
ISBN 13 : 3030387356
Total Pages : 160 pages
Book Rating : 4.0/5 (33 download)
Download or read book Advanced Multiphasing Switched-Capacitor DC-DC Converters written by Nicolas Butzen and published by Springer Nature. This book was released on 2020-07-03 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gives a detailed analysis of switched-capacitor DC-DC converters that are entirely integrated on a single chip and establishes that these converters are mainly limited by the large parasitic coupling, the low capacitor energy density, and the fact that switched-capacitor converter topologies only have a fixed voltage conversion ratio. The authors introduce the concept of Advanced Multiphasing as a way to circumvent these limitations by having multiple out-of-phase parallel converter cores interact with each other to minimize capacitor charging losses, leading to several techniques that demonstrate record efficiency and power-density, and even a fundamentally new type of switched-capacitor topology that has a continuously-scalable conversion ratio. Provides single-source reference to the recently-developed Advanced Multiphasing concept; Enables greatly improved performance and capabilities in fully integrated switched-capacitor converters; Enables readers to design DC-DC converters, where multiple converter cores are put in parallel and actively interact with each other over several phases to improve their capabilities.
Author : Francesca Iacopi
Publisher : Springer Nature
ISBN 13 : 3031216105
Total Pages : 271 pages
Book Rating : 4.0/5 (312 download)
Download or read book More-than-Moore Devices and Integration for Semiconductors written by Francesca Iacopi and published by Springer Nature. This book was released on 2023-02-17 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.
Author : Joanna Izdebska-Podsiadły
Publisher : William Andrew
ISBN 13 : 0128183128
Total Pages : 410 pages
Book Rating : 4.1/5 (281 download)
Download or read book Polymers for 3D Printing written by Joanna Izdebska-Podsiadły and published by William Andrew. This book was released on 2022-06-05 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt: Polymers for 3D Printing: Methods, Properties, and Characteristics provides a detailed guide to polymers for 3D printing, bridging the gap between research and practice, and enabling engineers, technicians and designers to utilise and implement this technology for their products or applications. Presents the properties, attributes, and potential applications of the polymeric materials used in 3D printing Analyses and compares the available methods for 3D printing, with an emphasis on the latest cutting-edge technologies Enables the reader to select and implement the correct 3D printing technology, according to polymer properties or product requirements
Author : Alexander Birbrair
Publisher : Academic Press
ISBN 13 : 0323983987
Total Pages : 638 pages
Book Rating : 4.3/5 (239 download)
Download or read book Current Topics in iPSCs Technology written by Alexander Birbrair and published by Academic Press. This book was released on 2022-01-18 with total page 638 pages. Available in PDF, EPUB and Kindle. Book excerpt: Current Topics in iPSCs provides a deep analysis of the underlying fundamentals that support short and mid-term developments and milestones in the business of mesenchymal stem cell therapies. This volume explores the next frontier of MSC therapies and how the transformational potential of therapeutic adult cells will be realised in all therapy areas. The impacts of clinical and economic benefits are dissected throughout each of the chapters. Written by thought leaders in the field for those curious about the interface of science and business. Explores the strategy at the forefront of the science of mesenchymal stem cells Provides an overview of all therapy areas where MSC and MSC-derived products can be used therapeutically Depicts transformational changes in healthcare that enable the implementation of MSC-powered technology platforms
Author : Katsuyuki Sakuma
Publisher : CRC Press
ISBN 13 : 1351779826
Total Pages : 211 pages
Book Rating : 4.3/5 (517 download)
Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2018-04-17 with total page 211 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
