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3d Integration For Noc Based Soc Architectures
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Book Synopsis 3D Integration for NoC-based SoC Architectures by : Abbas Sheibanyrad
Download or read book 3D Integration for NoC-based SoC Architectures written by Abbas Sheibanyrad and published by Springer Science & Business Media. This book was released on 2010-11-08 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
Book Synopsis Design and Test Strategies for 2D/3D Integration for NoC-based Multicore Architectures by : Kanchan Manna
Download or read book Design and Test Strategies for 2D/3D Integration for NoC-based Multicore Architectures written by Kanchan Manna and published by Springer Nature. This book was released on 2019-12-20 with total page 167 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers various aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems. It gives a complete account of the state-of-the-art and emerging techniques for near optimal mapping and test scheduling for NoC-based multicores. The authors describe the use of the Integer Line Programming (ILP) technique for smaller benchmarks and a Particle Swarm Optimization (PSO) to get a near optimal mapping and test schedule for bigger benchmarks. The PSO-based approach is also augmented with several innovative techniques to get the best possible solution. The tradeoff between performance (communication or test time) of the system and thermal-safety is also discussed, based on designer specifications. Provides a single-source reference to design and test for circuit and system-level approaches to (NoC) based multicore systems; Gives a complete account of the state-of-the-art and emerging techniques for near optimal mapping and test scheduling in (NoC) based multicore systems; Organizes chapters systematically and hierarchically, rather than in an ad hoc manner, covering aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems.
Book Synopsis Interconnect-Centric Design for Advanced SOC and NOC by : Jari Nurmi
Download or read book Interconnect-Centric Design for Advanced SOC and NOC written by Jari Nurmi and published by Springer Science & Business Media. This book was released on 2006-03-20 with total page 450 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications.
Book Synopsis 3D Interconnect Architectures for Heterogeneous Technologies by : Lennart Bamberg
Download or read book 3D Interconnect Architectures for Heterogeneous Technologies written by Lennart Bamberg and published by Springer Nature. This book was released on 2022-06-27 with total page 403 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.
Book Synopsis Handbook of 3D Integration, Volume 4 by : Paul D. Franzon
Download or read book Handbook of 3D Integration, Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-01-25 with total page 265 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Book Synopsis Designing 2D and 3D Network-on-Chip Architectures by : Konstantinos Tatas
Download or read book Designing 2D and 3D Network-on-Chip Architectures written by Konstantinos Tatas and published by Springer Science & Business Media. This book was released on 2013-10-08 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.
Book Synopsis Wireless Interface Technologies for 3D IC and Module Integration by : Tadahiro Kuroda
Download or read book Wireless Interface Technologies for 3D IC and Module Integration written by Tadahiro Kuroda and published by Cambridge University Press. This book was released on 2021-09-30 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.
Book Synopsis Advances In 3d Integrated Circuits And Systems by : Yu Hao
Download or read book Advances In 3d Integrated Circuits And Systems written by Yu Hao and published by World Scientific. This book was released on 2015-08-28 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: 3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.
Download or read book Network-on-Chip written by Santanu Kundu and published by CRC Press. This book was released on 2018-09-03 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems.
Book Synopsis Network-on-Chip Security and Privacy by : Prabhat Mishra
Download or read book Network-on-Chip Security and Privacy written by Prabhat Mishra and published by Springer Nature. This book was released on 2021-06-04 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides comprehensive coverage of Network-on-Chip (NoC) security vulnerabilities and state-of-the-art countermeasures, with contributions from System-on-Chip (SoC) designers, academic researchers and hardware security experts. Readers will gain a clear understanding of the existing security solutions for on-chip communication architectures and how they can be utilized effectively to design secure and trustworthy systems.
Book Synopsis Communication and Signal Processing by : Faouzi Derbel
Download or read book Communication and Signal Processing written by Faouzi Derbel and published by Walter de Gruyter GmbH & Co KG. This book was released on 2018-07-23 with total page 249 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book elaborates selected, extended and peer reviewed papers on Communication and Signal Proceesing. As Vol. 8 of the series on "Advances on Signals, Systems and Devices" it presents main topics such as: content based video retrieval, wireless communication systems, biometry and medical imaging, adaptive and smart antennae.
Book Synopsis Analyse et caractérisation des couplages substrat et de la connectique dans les by : Fengyuan Sun
Download or read book Analyse et caractérisation des couplages substrat et de la connectique dans les written by Fengyuan Sun and published by Editions Publibook. This book was released on 2016-09-09 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proposal of doubling the number of transistors on an IC chip (with minimum costs and subtle innovations) every 24 months by Gordon Moore in 1965 (the so-called called Moore's law) has been the most powerful driver for the emphasis of the microelectronics industry in the past 50 years. This law enhances lithography scaling and integration, in 2D, of all functions on a single chip, increasingly through system-on-chip (SOC). On the other hand, the integration of all these functions can be achieved through 3D integrations . Generally speaking, 3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and mostly the TSV (through-silicon via) separates 3D IC packaging from 3D IC/Si integrations since the latter two uses TSVs, but 3D IC packaging does not. TSV (with a new concept that every chip or interposer could have two surfaces with circuits) is the heart of 3D IC/Si integrations. Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. 3D Si integration is the right way to go and compete with Moore's law (more than Moore versus more Moore). However, it is still a long way to go. In this book, Fengyuan SUN proposes new substrate network extraction techniques. Using this latter, the substrate coupling and loss in IC's can be analyzed. He implements some Green/TLM (Transmission Line Matrix) algorithms in MATLAB. It permits to extract impedances between any number of embedded contacts or/and TSVS. He does investigate models of high aspect ratio TSV, on both analytical and numerical methods electromagnetic simulations. This model enables to extract substrate and TSV impedance, S parameters and parasitic elements, considering the variable resistivity of the substrate. It is full compatible with SPICE-like solvers and should allow an investigation in depth of TSV impact on circuit performance.
Book Synopsis Scalable Multi-core Architectures by : Dimitrios Soudris
Download or read book Scalable Multi-core Architectures written by Dimitrios Soudris and published by Springer Science & Business Media. This book was released on 2011-10-17 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: As Moore’s law continues to unfold, two important trends have recently emerged. First, the growth of chip capacity is translated into a corresponding increase of number of cores. Second, the parallelization of the computation and 3D integration technologies lead to distributed memory architectures. This book describes recent research that addresses urgent challenges in many-core architectures and application mapping. It addresses the architectural design of many core chips, memory and data management, power management, design and programming methodologies. It also describes how new techniques have been applied in various industrial case studies.
Book Synopsis Design of 3D Integrated Circuits and Systems by : Rohit Sharma
Download or read book Design of 3D Integrated Circuits and Systems written by Rohit Sharma and published by CRC Press. This book was released on 2018-09-03 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Book Synopsis Physical Design for 3D Integrated Circuits by : Aida Todri-Sanial
Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 529 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Book Synopsis Mobile 3D Graphics SoC by : Hoi-Jun Yoo
Download or read book Mobile 3D Graphics SoC written by Hoi-Jun Yoo and published by John Wiley & Sons. This book was released on 2010-04-27 with total page 352 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first book to explain the principals behind mobile 3D hardware implementation, helping readers understand advanced algorithms, produce low-cost, low-power SoCs, or become familiar with embedded systems As mobile broadcasting and entertainment applications evolve, there is increasing interest in 3D graphics within the field of mobile electronics, particularly for handheld devices. In Mobile 3D Graphics SoC, Yoo provides a comprehensive understanding of the algorithms of mobile 3D graphics and their real chip implementation methods. 3D graphics SoC (System on a Chip) architecture and its interaction with embedded system software are explained with numerous examples. Yoo divides the book into three sections: general methodology of low power SoC, design of low power 3D graphics SoC, and silicon implementation of 3D graphics SoCs and their application to mobile electronics. Full examples are presented at various levels such as system level design and circuit level optimization along with design technology. Yoo incorporates many real chip examples, including many commercial 3D graphics chips, and provides cross-comparisons of various architectures and their performance. Furthermore, while advanced 3D graphics techniques are well understood and supported by industry standards, this is less true in the emerging mobile applications and games market. This book redresses this imbalance, providing an in-depth look at the new OpenGL ES (The Standard for Embedded Accelerated 3D Graphics), and shows what these new embedded systems graphics libraries can provide for 3D graphics and games developers.
Book Synopsis Arbitrary Modeling of TSVs for 3D Integrated Circuits by : Khaled Salah
Download or read book Arbitrary Modeling of TSVs for 3D Integrated Circuits written by Khaled Salah and published by Springer. This book was released on 2014-08-21 with total page 181 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
