3d Ic Integration And Packaging

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3D IC Integration and Packaging

Author : John H. Lau
Publisher : McGraw-Hill Education
ISBN 13 : 9780071848060
Total Pages : 480 pages
Book Rating : 4.8/5 (48 download)

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Book Synopsis 3D IC Integration and Packaging by : John H. Lau

Download or read book 3D IC Integration and Packaging written by John H. Lau and published by McGraw-Hill Education. This book was released on 2015-08-27 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to 3D IC integration and packaging technology 3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail. 3D IC Integration and Packaging covers: • 3D integration for semiconductor IC packaging• Through-silicon vias modeling and testing• Stress sensors for thin-wafer handling and strength measurement• Package substrate technologies• Microbump fabrication, assembly, and reliability• 3D Si integration• 2.5D/3D IC integration• 3D IC integration with passive interposer• Thermal management of 2.5D/3D IC integration• Embedded 3D hybrid integration• 3D LED and IC integration• 3D MEMS and IC integration• 3D CMOS image sensors and IC integration• PoP, chip-to-chip interconnects, and embedded fan-out WLP

3D IC Integration and Packaging

Author : John H. Lau
Publisher : McGraw Hill Professional
ISBN 13 : 007184807X
Total Pages : 512 pages
Book Rating : 4.0/5 (718 download)

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Book Synopsis 3D IC Integration and Packaging by : John H. Lau

Download or read book 3D IC Integration and Packaging written by John H. Lau and published by McGraw Hill Professional. This book was released on 2015-07-06 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to 3D IC integration and packaging technology 3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail. 3D IC Integration and Packaging covers: • 3D integration for semiconductor IC packaging• Through-silicon vias modeling and testing• Stress sensors for thin-wafer handling and strength measurement• Package substrate technologies• Microbump fabrication, assembly, and reliability• 3D Si integration• 2.5D/3D IC integration• 3D IC integration with passive interposer• Thermal management of 2.5D/3D IC integration• Embedded 3D hybrid integration• 3D LED and IC integration• 3D MEMS and IC integration• 3D CMOS image sensors and IC integration• PoP, chip-to-chip interconnects, and embedded fan-out WLP

Through-Silicon Vias for 3D Integration

Author : John H. Lau
Publisher : McGraw Hill Professional
ISBN 13 : 0071785159
Total Pages : 513 pages
Book Rating : 4.0/5 (717 download)

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Book Synopsis Through-Silicon Vias for 3D Integration by : John H. Lau

Download or read book Through-Silicon Vias for 3D Integration written by John H. Lau and published by McGraw Hill Professional. This book was released on 2012-08-05 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems. Coverage includes: Nanotechnology and 3D integration for the semiconductor industry TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing TSVs: mechanical, thermal, and electrical behaviors Thin-wafer strength measurement Wafer thinning and thin-wafer handling Microbumping, assembly, and reliability Microbump electromigration Transient liquid-phase bonding: C2C, C2W, and W2W 2.5D IC integration with interposers 3D IC integration with interposers Thermal management of 3D IC integration 3D IC packaging

Design and Modeling for 3D ICs and Interposers

Author : Madhavan Swaminathan
Publisher : World Scientific
ISBN 13 : 9814508608
Total Pages : 379 pages
Book Rating : 4.8/5 (145 download)

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Book Synopsis Design and Modeling for 3D ICs and Interposers by : Madhavan Swaminathan

Download or read book Design and Modeling for 3D ICs and Interposers written by Madhavan Swaminathan and published by World Scientific. This book was released on 2013-11-05 with total page 379 pages. Available in PDF, EPUB and Kindle. Book excerpt: 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

Semiconductor Advanced Packaging

Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811613761
Total Pages : 513 pages
Book Rating : 4.8/5 (116 download)

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Book Synopsis Semiconductor Advanced Packaging by : John H. Lau

Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

Author : Lih-Tyng Hwang
Publisher : John Wiley & Sons
ISBN 13 : 1119289661
Total Pages : 464 pages
Book Rating : 4.1/5 (192 download)

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Book Synopsis 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility by : Lih-Tyng Hwang

Download or read book 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility written by Lih-Tyng Hwang and published by John Wiley & Sons. This book was released on 2018-03-29 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools

Handbook of 3D Integration, Volume 1

Author : Philip Garrou
Publisher : John Wiley & Sons
ISBN 13 : 352762306X
Total Pages : 798 pages
Book Rating : 4.5/5 (276 download)

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Book Synopsis Handbook of 3D Integration, Volume 1 by : Philip Garrou

Download or read book Handbook of 3D Integration, Volume 1 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2011-09-22 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.

3D Integration in VLSI Circuits

Author : Katsuyuki Sakuma
Publisher : CRC Press
ISBN 13 : 1351779826
Total Pages : 219 pages
Book Rating : 4.3/5 (517 download)

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Book Synopsis 3D Integration in VLSI Circuits by : Katsuyuki Sakuma

Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2018-04-17 with total page 219 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Author : John H. Lau
Publisher : McGraw Hill Professional
ISBN 13 : 007175380X
Total Pages : 640 pages
Book Rating : 4.0/5 (717 download)

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Book Synopsis Reliability of RoHS-Compliant 2D and 3D IC Interconnects by : John H. Lau

Download or read book Reliability of RoHS-Compliant 2D and 3D IC Interconnects written by John H. Lau and published by McGraw Hill Professional. This book was released on 2010-10-22 with total page 640 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource. Covers reliability of: 2D and 3D IC lead-free interconnects CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints Lead-free (SACX) solder joints Low-temperature lead-free (SnBiAg) solder joints Solder joints with voids, high strain rate, and high ramp rate VCSEL and LED lead-free interconnects 3D LED and 3D MEMS with TSVs Chip-to-wafer (C2W) bonding and lead-free interconnects Wafer-to-wafer (W2W) bonding and lead-free interconnects 3D IC chip stacking with low-temperature bonding TSV interposers and lead-free interconnects Electromigration of lead-free microbumps for 3D IC integration

Design And Modeling For 3d Ics And Interposers

Author : Swaminathan Madhavan
Publisher : World Scientific
ISBN 13 : 9814508616
Total Pages : 380 pages
Book Rating : 4.8/5 (145 download)

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Book Synopsis Design And Modeling For 3d Ics And Interposers by : Swaminathan Madhavan

Download or read book Design And Modeling For 3d Ics And Interposers written by Swaminathan Madhavan and published by World Scientific. This book was released on 2013-11-05 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt: 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

Handbook of 3D Integration, Volume 4

Author : Paul D. Franzon
Publisher : John Wiley & Sons
ISBN 13 : 3527697047
Total Pages : 265 pages
Book Rating : 4.5/5 (276 download)

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Book Synopsis Handbook of 3D Integration, Volume 4 by : Paul D. Franzon

Download or read book Handbook of 3D Integration, Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-01-25 with total page 265 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

Wafer Level 3-D ICs Process Technology

Author : Chuan Seng Tan
Publisher : Springer Science & Business Media
ISBN 13 : 0387765344
Total Pages : 365 pages
Book Rating : 4.3/5 (877 download)

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Book Synopsis Wafer Level 3-D ICs Process Technology by : Chuan Seng Tan

Download or read book Wafer Level 3-D ICs Process Technology written by Chuan Seng Tan and published by Springer Science & Business Media. This book was released on 2009-06-29 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

3D Integration for VLSI Systems

Author : Chuan Seng Tan
Publisher : CRC Press
ISBN 13 : 9814303828
Total Pages : 376 pages
Book Rating : 4.8/5 (143 download)

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Book Synopsis 3D Integration for VLSI Systems by : Chuan Seng Tan

Download or read book 3D Integration for VLSI Systems written by Chuan Seng Tan and published by CRC Press. This book was released on 2016-04-19 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th

Handbook of 3D Integration, Volume 4

Author : Paul D. Franzon
Publisher : John Wiley & Sons
ISBN 13 : 3527338551
Total Pages : 488 pages
Book Rating : 4.5/5 (273 download)

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Book Synopsis Handbook of 3D Integration, Volume 4 by : Paul D. Franzon

Download or read book Handbook of 3D Integration, Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-05-06 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

Wireless Interface Technologies for 3D IC and Module Integration

Author : Tadahiro Kuroda
Publisher : Cambridge University Press
ISBN 13 : 110884121X
Total Pages : 337 pages
Book Rating : 4.1/5 (88 download)

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Book Synopsis Wireless Interface Technologies for 3D IC and Module Integration by : Tadahiro Kuroda

Download or read book Wireless Interface Technologies for 3D IC and Module Integration written by Tadahiro Kuroda and published by Cambridge University Press. This book was released on 2021-09-30 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.

3D Integration in VLSI Circuits

Author : Katsuyuki Sakuma
Publisher : CRC Press
ISBN 13 : 9781315200699
Total Pages : 217 pages
Book Rating : 4.2/5 (6 download)

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Book Synopsis 3D Integration in VLSI Circuits by : Katsuyuki Sakuma

Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2018 with total page 217 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world's leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

Advances In 3d Integrated Circuits And Systems

Author : Yu Hao
Publisher : World Scientific
ISBN 13 : 9814699039
Total Pages : 392 pages
Book Rating : 4.8/5 (146 download)

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Book Synopsis Advances In 3d Integrated Circuits And Systems by : Yu Hao

Download or read book Advances In 3d Integrated Circuits And Systems written by Yu Hao and published by World Scientific. This book was released on 2015-08-28 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: 3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.