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Author :Components, Packaging, and Manufacturing Technology Society Publisher : ISBN 13 :9781424436637 Total Pages :335 pages Book Rating :4.4/5 (366 download)
Book Synopsis 2009 Twenty-Fifth Annual IEEE Semiconductor Thermal Measurement and Management Symposium by : Components, Packaging, and Manufacturing Technology Society
Download or read book 2009 Twenty-Fifth Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by Components, Packaging, and Manufacturing Technology Society and published by . This book was released on 2009 with total page 335 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 2008 Twenty-Fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium by :
Download or read book 2008 Twenty-Fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by IEEE. This book was released on 2008 with total page 204 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Download or read book Twenty Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by . This book was released on 2012 with total page 367 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Download or read book 2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by IEEE. This book was released on 2008-11-14 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium by :
Download or read book Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by . This book was released on 2004 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Twenty First Annual IEEE Semiconductor Thermal Measurement and Management Symposium by :
Download or read book Twenty First Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by . This book was released on 2005 with total page 360 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :Components, Packaging, and Manufacturing Technology Society Publisher : ISBN 13 :9781424409594 Total Pages :263 pages Book Rating :4.4/5 (95 download)
Book Synopsis Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium by : Components, Packaging, and Manufacturing Technology Society
Download or read book Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by Components, Packaging, and Manufacturing Technology Society and published by . This book was released on 2007 with total page 263 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Thermal Analysis of Power Electronic Devices Used in Renewable Energy Systems by : Alhussein Albarbar
Download or read book Thermal Analysis of Power Electronic Devices Used in Renewable Energy Systems written by Alhussein Albarbar and published by Springer. This book was released on 2017-07-19 with total page 218 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book analyzes the thermal characteristics of power electronic devices (PEDs) with a focus on those used in wind and solar energy systems. The authors focus on the devices used in such applications, for example boost converters and inverters under different operating conditions. The book explains in detail finite element modeling techniques, setting up measuring systems, data analysis, and PEDs’ lifetime calculations. It is appropriate reading for graduate students and researchers who focus on the design and reliability of power electronic devices.
Book Synopsis Reliability and Failure Analysis of High-Power LED Packaging by : Cher Ming Tan
Download or read book Reliability and Failure Analysis of High-Power LED Packaging written by Cher Ming Tan and published by Woodhead Publishing. This book was released on 2022-09-24 with total page 190 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them Describes the chemistry underlying the material degradation and its impact on LEDs Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs
Book Synopsis Thermal and Electro-Thermal System Simulation by : Márta Rencz
Download or read book Thermal and Electro-Thermal System Simulation written by Márta Rencz and published by MDPI. This book was released on 2019-11-18 with total page 222 pages. Available in PDF, EPUB and Kindle. Book excerpt: With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in the design phase. This can be done with thermal end electro-thermal design and simulation tools. This Special Issue of Energies, edited by two well-known experts of the field, Prof. Marta Rencz, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects twelve papers carefully selected for the representation of the latest results in thermal and electro-thermal system simulation. These contributions present a good survey of the latest results in one of the most topical areas in the field of electronics: The thermal and electro-thermal simulation of electronic components and systems. Several papers of this issue are extended versions of papers presented at the THERMINIC 2018 Workshop, held in Stockholm in the fall of 2018. The papers presented here deal with modeling and simulation of state-of-the-art applications that are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. Contributions covered the thermal simulation of electronic packages, electro-thermal advanced modeling in power electronics, multi-physics modeling and simulation of LEDs, and the characterization of interface materials, among other subjects.
Book Synopsis 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2011) by :
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Download or read book 2007 Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by IEEE. This book was released on 2007-01-01 with total page 261 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium by : IEEE Staff
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Book Synopsis Energy Efficient Thermal Management of Data Centers by : Yogendra Joshi
Download or read book Energy Efficient Thermal Management of Data Centers written by Yogendra Joshi and published by Springer Science & Business Media. This book was released on 2012-03-23 with total page 635 pages. Available in PDF, EPUB and Kindle. Book excerpt: Energy Efficient Thermal Management of Data Centers examines energy flow in today's data centers. Particular focus is given to the state-of-the-art thermal management and thermal design approaches now being implemented across the multiple length scales involved. The impact of future trends in information technology hardware, and emerging software paradigms such as cloud computing and virtualization, on thermal management are also addressed. The book explores computational and experimental characterization approaches for determining temperature and air flow patterns within data centers. Thermodynamic analyses using the second law to improve energy efficiency are introduced and used in proposing improvements in cooling methodologies. Reduced-order modeling and robust multi-objective design of next generation data centers are discussed.
Book Synopsis Energy-Efficient Distributed Computing Systems by : Albert Y. Zomaya
Download or read book Energy-Efficient Distributed Computing Systems written by Albert Y. Zomaya and published by John Wiley & Sons. This book was released on 2012-07-26 with total page 605 pages. Available in PDF, EPUB and Kindle. Book excerpt: The energy consumption issue in distributed computing systems raises various monetary, environmental and system performance concerns. Electricity consumption in the US doubled from 2000 to 2005. From a financial and environmental standpoint, reducing the consumption of electricity is important, yet these reforms must not lead to performance degradation of the computing systems. These contradicting constraints create a suite of complex problems that need to be resolved in order to lead to 'greener' distributed computing systems. This book brings together a group of outstanding researchers that investigate the different facets of green and energy efficient distributed computing. Key features: One of the first books of its kind Features latest research findings on emerging topics by well-known scientists Valuable research for grad students, postdocs, and researchers Research will greatly feed into other technologies and application domains
Book Synopsis Annual IEEE Semiconductor Thermal Measurement and Management Symposium by :
Download or read book Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by . This book was released on 2005 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: