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2005 International Conference On Integrated Circuit Design And Technology
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Author :International Conference on Integrated Circuit Design and Technology Publisher : ISBN 13 : Total Pages : pages Book Rating :4.:/5 (11 download)
Book Synopsis 2005 International Conference on Integrated Circuit Design and Technology by : International Conference on Integrated Circuit Design and Technology
Download or read book 2005 International Conference on Integrated Circuit Design and Technology written by International Conference on Integrated Circuit Design and Technology and published by . This book was released on 2005 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :International Conference on Integrated Circuit Design and Technology Publisher : ISBN 13 :9781509099719 Total Pages : pages Book Rating :4.0/5 (997 download)
Book Synopsis 2005 International Conference on Integrated Circuit Design and Technology : ICICDT : Austin, Texas, May 9-11, 2005 by : International Conference on Integrated Circuit Design and Technology
Download or read book 2005 International Conference on Integrated Circuit Design and Technology : ICICDT : Austin, Texas, May 9-11, 2005 written by International Conference on Integrated Circuit Design and Technology and published by . This book was released on 2005 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 2005 International Conference on Integrated Circuit Design and Technology by :
Download or read book 2005 International Conference on Integrated Circuit Design and Technology written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2005 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: Issues for 2009- cataloged as a serial in LC
Book Synopsis Importante collection de tableaux de maîtres anciens et modernes et dessins by :
Download or read book Importante collection de tableaux de maîtres anciens et modernes et dessins written by and published by . This book was released on 1868 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis On-Chip Current Sensors for Reliable, Secure, and Low-Power Integrated Circuits by : Rodrigo Possamai Bastos
Download or read book On-Chip Current Sensors for Reliable, Secure, and Low-Power Integrated Circuits written by Rodrigo Possamai Bastos and published by Springer Nature. This book was released on 2019-09-30 with total page 162 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with insight into an alternative approach for enhancing the reliability, security, and low power features of integrated circuit designs, related to transient faults, hardware Trojans, and power consumption. The authors explain how the addition of integrated sensors enables the detection of ionizing particles and how this information can be processed at a high layer. The discussion also includes a variety of applications, such as the detection of hardware Trojans and fault attacks, and how sensors can operate to provide different body bias levels and reduce power costs. Readers can benefit from these sensors-based approaches through designs with fast response time, non-intrusive integration on gate-level and reasonable design costs.
Book Synopsis Built-in Fault-Tolerant Computing Paradigm for Resilient Large-Scale Chip Design by : Xiaowei Li
Download or read book Built-in Fault-Tolerant Computing Paradigm for Resilient Large-Scale Chip Design written by Xiaowei Li and published by Springer Nature. This book was released on 2023-03-01 with total page 318 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the end of Dennard scaling and Moore’s law, IC chips, especially large-scale ones, now face more reliability challenges, and reliability has become one of the mainstay merits of VLSI designs. In this context, this book presents a built-in on-chip fault-tolerant computing paradigm that seeks to combine fault detection, fault diagnosis, and error recovery in large-scale VLSI design in a unified manner so as to minimize resource overhead and performance penalties. Following this computing paradigm, we propose a holistic solution based on three key components: self-test, self-diagnosis and self-repair, or “3S” for short. We then explore the use of 3S for general IC designs, general-purpose processors, network-on-chip (NoC) and deep learning accelerators, and present prototypes to demonstrate how 3S responds to in-field silicon degradation and recovery under various runtime faults caused by aging, process variations, or radical particles. Moreover, we demonstrate that 3S not only offers a powerful backbone for various on-chip fault-tolerant designs and implementations, but also has farther-reaching implications such as maintaining graceful performance degradation, mitigating the impact of verification blind spots, and improving chip yield. This book is the outcome of extensive fault-tolerant computing research pursued at the State Key Lab of Processors, Institute of Computing Technology, Chinese Academy of Sciences over the past decade. The proposed built-in on-chip fault-tolerant computing paradigm has been verified in a broad range of scenarios, from small processors in satellite computers to large processors in HPCs. Hopefully, it will provide an alternative yet effective solution to the growing reliability challenges for large-scale VLSI designs.
Book Synopsis Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation by : Nadine Azemard
Download or read book Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation written by Nadine Azemard and published by Springer Science & Business Media. This book was released on 2007-08-21 with total page 595 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume features the refereed proceedings of the 17th International Workshop on Power and Timing Modeling, Optimization and Simulation. Papers cover high level design, low power design techniques, low power analog circuits, statistical static timing analysis, power modeling and optimization, low power routing optimization, security and asynchronous design, low power applications, modeling and optimization, and more.
Book Synopsis Intelligent Communication, Control and Devices by : Sushabhan Choudhury
Download or read book Intelligent Communication, Control and Devices written by Sushabhan Choudhury and published by Springer Nature. This book was released on 2021-07-23 with total page 421 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the integration of intelligent communication systems, control systems and devices related to all aspects of engineering and sciences. It includes high-quality research papers from the 4th International Conference on Intelligent Communication, Control and Devices (ICICCD 2020), organized by the Department of Electronics, Instrumentation and Control Engineering at the University of Petroleum and Energy Studies, Dehradun, India during 27–28 November 2020. The topics covered are a range of recent advances in intelligent communication, intelligent control, and intelligent devices.
Book Synopsis Three-Dimensional Design Methodologies for Tree-based FPGA Architecture by : Vinod Pangracious
Download or read book Three-Dimensional Design Methodologies for Tree-based FPGA Architecture written by Vinod Pangracious and published by Springer. This book was released on 2015-06-25 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.
Book Synopsis Manufacturability Aware Routing in Nanometer VLSI by : David Z. Pan
Download or read book Manufacturability Aware Routing in Nanometer VLSI written by David Z. Pan and published by Now Publishers Inc. This book was released on 2010-05-04 with total page 110 pages. Available in PDF, EPUB and Kindle. Book excerpt: This paper surveys key research challenges and recent results of manufacturability aware routing in nanometer VLSI designs. The manufacturing challenges have their root causes from various integrated circuit (IC) manufacturing processes and steps, e.g., deep sub-wavelength lithography, random defects, via voids, chemical-mechanical polishing, and antenna-effects. They may result in both functional and parametric yield losses. The manufacturability aware routing can be performed at different routing stages including global routing, track routing, and detail routing, guided by both manufacturing process models and manufacturing-friendly rules. The manufacturability/yield optimization can be performed through both correct-by-construction (i.e., optimization during routing) as well as construct-by-correction (i.e., post-routing optimization). This paper will provide a holistic view of key design for manufacturability issues in nanometer VLSI routing.
Book Synopsis Three Dimensional System Integration by : Antonis Papanikolaou
Download or read book Three Dimensional System Integration written by Antonis Papanikolaou and published by Springer Science & Business Media. This book was released on 2010-12-07 with total page 246 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Author :Institute of Electrical and Electronics Engineers, Central Texas Section Staff Publisher : ISBN 13 : Total Pages : pages Book Rating :4.:/5 (11 download)
Book Synopsis 2004 International Conference on Integrated Circuit Design and Technology: ICICDT: Austin, Texas, May 17-20, 2004 by : Institute of Electrical and Electronics Engineers, Central Texas Section Staff
Download or read book 2004 International Conference on Integrated Circuit Design and Technology: ICICDT: Austin, Texas, May 17-20, 2004 written by Institute of Electrical and Electronics Engineers, Central Texas Section Staff and published by . This book was released on 2004 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Design of 3D Integrated Circuits and Systems by : Rohit Sharma
Download or read book Design of 3D Integrated Circuits and Systems written by Rohit Sharma and published by CRC Press. This book was released on 2018-09-03 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Book Synopsis Integrated Circuit Design and Technology, 2007. ICICDT '07. IEEE International Conference on by : Institute of Electrical and Electronics Engineers
Download or read book Integrated Circuit Design and Technology, 2007. ICICDT '07. IEEE International Conference on written by Institute of Electrical and Electronics Engineers and published by . This book was released on 2007 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Innovations in Embedded and Real-Time Systems Engineering for Communication by : Virtanen, Seppo
Download or read book Innovations in Embedded and Real-Time Systems Engineering for Communication written by Virtanen, Seppo and published by IGI Global. This book was released on 2012-04-30 with total page 378 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This book has collected the latest research within the field of real-time systems engineering, and will serve as a vital reference compendium for practitioners and academics"--Provided by publisher.
Book Synopsis 2004 International Conference on Integrated Circuit Design and Technology by :
Download or read book 2004 International Conference on Integrated Circuit Design and Technology written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2004-01-01 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Three-Dimensional Integrated Circuit Design by : Vasilis F. Pavlidis
Download or read book Three-Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 768 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
