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Author :
Publisher :
ISBN 13 :
Total Pages : 772 pages
Book Rating : 4.:/5 (334 download)
Download or read book Publications in Engineering written by and published by . This book was released on 1999 with total page 772 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : British Library. Document Supply Centre
Publisher :
ISBN 13 :
Total Pages : 844 pages
Book Rating : 4.F/5 ( download)
Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 1999 with total page 844 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Rose Arny
Publisher :
ISBN 13 :
Total Pages : 2180 pages
Book Rating : 4.3/5 (91 download)
Download or read book Forthcoming Books written by Rose Arny and published by . This book was released on 1998-06 with total page 2180 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : IEEE
Publisher :
ISBN 13 : 9780780345249
Total Pages : 500 pages
Book Rating : 4.3/5 (452 download)
Download or read book 1998 Ieee/Cpmt 23rd Electronics Manufacturing Technology, Iemt written by IEEE and published by . This book was released on 1998-11 with total page 500 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : E. Ajith Amerasekera
Publisher : John Wiley & Sons
ISBN 13 :
Total Pages : 434 pages
Book Rating : 4.3/5 (91 download)
Download or read book ESD in Silicon Integrated Circuits written by E. Ajith Amerasekera and published by John Wiley & Sons. This book was released on 2002-05-22 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: * Examines the various methods available for circuit protection, including coverage of the newly developed ESD circuit protection schemes for VLSI circuits. * Provides guidance on the implementation of circuit protection measures. * Includes new sections on ESD design rules, layout approaches, package effects, and circuit concepts. * Reviews the new Charged Device Model (CDM) test method and evaluates design requirements necessary for circuit protection.
Author :
Publisher :
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.:/5 (637 download)
Download or read book Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium written by and published by . This book was released on 1998 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811613761
Total Pages : 513 pages
Book Rating : 4.8/5 (116 download)
Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Author : P. Singh
Publisher : Springer Science & Business Media
ISBN 13 : 9780412105913
Total Pages : 398 pages
Book Rating : 4.1/5 (59 download)
Download or read book Failure Modes and Mechanisms in Electronic Packages written by P. Singh and published by Springer Science & Business Media. This book was released on 1997-11-30 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Author : Kim S. Siow
Publisher : Springer
ISBN 13 : 3319992562
Total Pages : 292 pages
Book Rating : 4.3/5 (199 download)
Download or read book Die-Attach Materials for High Temperature Applications in Microelectronics Packaging written by Kim S. Siow and published by Springer. This book was released on 2019-01-29 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Author : Massimo Alioto
Publisher : Springer
ISBN 13 : 3319514822
Total Pages : 527 pages
Book Rating : 4.3/5 (195 download)
Download or read book Enabling the Internet of Things written by Massimo Alioto and published by Springer. This book was released on 2017-01-23 with total page 527 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers the first comprehensive view on integrated circuit and system design for the Internet of Things (IoT), and in particular for the tiny nodes at its edge. The authors provide a fresh perspective on how the IoT will evolve based on recent and foreseeable trends in the semiconductor industry, highlighting the key challenges, as well as the opportunities for circuit and system innovation to address them. This book describes what the IoT really means from the design point of view, and how the constraints imposed by applications translate into integrated circuit requirements and design guidelines. Chapter contributions equally come from industry and academia. After providing a system perspective on IoT nodes, this book focuses on state-of-the-art design techniques for IoT applications, encompassing the fundamental sub-systems encountered in Systems on Chip for IoT: ultra-low power digital architectures and circuits low- and zero-leakage memories (including emerging technologies) circuits for hardware security and authentication System on Chip design methodologies on-chip power management and energy harvesting ultra-low power analog interfaces and analog-digital conversion short-range radios miniaturized battery technologies packaging and assembly of IoT integrated systems (on silicon and non-silicon substrates). As a common thread, all chapters conclude with a prospective view on the foreseeable evolution of the related technologies for IoT. The concepts developed throughout the book are exemplified by two IoT node system demonstrations from industry. The unique balance between breadth and depth of this book: enables expert readers quickly to develop an understanding of the specific challenges and state-of-the-art solutions for IoT, as well as their evolution in the foreseeable future provides non-experts with a comprehensive introduction to integrated circuit design for IoT, and serves as an excellent starting point for further learning, thanks to the broad coverage of topics and selected references makes it very well suited for practicing engineers and scientists working in the hardware and chip design for IoT, and as textbook for senior undergraduate, graduate and postgraduate students ( familiar with analog and digital circuits).
Author : Karine Melissa
Publisher :
ISBN 13 : 9781300244493
Total Pages : 38 pages
Book Rating : 4.2/5 (444 download)
Download or read book YNG LGCY Magazine written by Karine Melissa and published by . This book was released on 2021-06-23 with total page 38 pages. Available in PDF, EPUB and Kindle. Book excerpt: YNG LGCY MAGAZINE empowers youth through highlighting accomplishments, featuring young entrepreneurs and go-getters, sharing resources for parents, and producing fashion events and workshops to do so.
Author : Stefan Schneegass
Publisher : Springer
ISBN 13 : 3319501240
Total Pages : 397 pages
Book Rating : 4.3/5 (195 download)
Download or read book Smart Textiles written by Stefan Schneegass and published by Springer. This book was released on 2017-01-26 with total page 397 pages. Available in PDF, EPUB and Kindle. Book excerpt: From a holistic perspective, this handbook explores the design, development and production of smart textiles and textile electronics, breaking with the traditional silo-structure of smart textile research and development. Leading experts from different domains including textile production, electrical engineering, interaction design and human-computer interaction (HCI) address production processes in their entirety by exploring important concepts and topics like textile manufacturing, sensor and actuator development for textiles, the integration of electronics into textiles and the interaction with textiles. In addition, different application scenarios, where smart textiles play a key role, are presented too. Smart Textiles would be an ideal resource for researchers, designers and academics who are interested in understanding the overall process in creating viable smart textiles.
Author : Deborah D.L. Chung
Publisher : Springer Science & Business Media
ISBN 13 : 1447137329
Total Pages : 297 pages
Book Rating : 4.4/5 (471 download)
Download or read book Composite Materials written by Deborah D.L. Chung and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 297 pages. Available in PDF, EPUB and Kindle. Book excerpt: Composite Materials is a modern reference book, tutorial in style, covering functions of composites relating to applications in electronic packaging, thermal management, smart structures and other timely technologies rarely covered in existing books on composites. It also treats materials with polymer, metal, cement, carbon and ceramics matrices, contrasting with others that emphasise polymer-matrix composites. This functional approach will be useful to both practitioners and students. A good selection of example problems, solutions and figures, together with a new and vibrant approach, provides a valuable reference source for all engineers working with composite materials.
Author : F. Patrick McCluskey
Publisher : CRC Press
ISBN 13 : 9780849396236
Total Pages : 354 pages
Book Rating : 4.3/5 (962 download)
Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 1996-12-13 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Author : Pradeep Kumar Singh
Publisher : Springer Nature
ISBN 13 : 9811582971
Total Pages : 846 pages
Book Rating : 4.8/5 (115 download)
Download or read book Recent Innovations in Computing written by Pradeep Kumar Singh and published by Springer Nature. This book was released on 2021-01-12 with total page 846 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book features selected papers presented at the 3rd International Conference on Recent Innovations in Computing (ICRIC 2020), held on 20–21 March 2020 at the Central University of Jammu, India, and organized by the university’s Department of Computer Science & Information Technology. It includes the latest research in the areas of software engineering, cloud computing, computer networks and Internet technologies, artificial intelligence, information security, database and distributed computing, and digital India.
Author : Purnendu Ghosh
Publisher : Springer
ISBN 13 : 9811001197
Total Pages : 459 pages
Book Rating : 4.8/5 (11 download)
Download or read book The Mind of an Engineer written by Purnendu Ghosh and published by Springer. This book was released on 2015-11-27 with total page 459 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Indian National Academy of Engineering (INAE) promotes the endeavour of the practitioners of engineering and technology and related sciences to solve the problems of national importance. The book is an initiative of the INAE and a reflection of the experiences of some of the Fellows of the INAE in the fields of science, technology and engineering. The book is about the reminiscences, eureka moments, inspirations, challenges and opportunities in the journey the professionals took toward self-realisation and the goals they achieved. The book contains 58 articles on diverse topics that truly reflects the way the meaningful mind of an engineer works.
Author : Clemens J.M. Lasance
Publisher : Springer Science & Business Media
ISBN 13 : 1461450918
Total Pages : 550 pages
Book Rating : 4.4/5 (614 download)
Download or read book Thermal Management for LED Applications written by Clemens J.M. Lasance and published by Springer Science & Business Media. This book was released on 2013-09-17 with total page 550 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.
