1995 International Conference On Multichip Modules

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Proceedings of the 1995 International Conference on Parallel Processing

Author : Dharma P. Agrawal
Publisher : CRC Press
ISBN 13 : 9780849326189
Total Pages : 174 pages
Book Rating : 4.3/5 (261 download)

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Book Synopsis Proceedings of the 1995 International Conference on Parallel Processing by : Dharma P. Agrawal

Download or read book Proceedings of the 1995 International Conference on Parallel Processing written by Dharma P. Agrawal and published by CRC Press. This book was released on 1995-08-08 with total page 174 pages. Available in PDF, EPUB and Kindle. Book excerpt: This set of technical books contains all the information presented at the 1995 International Conference on Parallel Processing. This conference, held August 14 - 18, featured over 100 lectures from more than 300 contributors, and included three panel sessions and three keynote addresses. The international authorship includes experts from around the globe, from Texas to Tokyo, from Leiden to London. Compiled by faculty at the University of Illinois and sponsored by Penn State University, these Proceedings are a comprehensive look at all that's new in the field of parallel processing.

Proceedings of the 1995 International Conference on Parallel Processing

Author : Prithviraj Banerjee
Publisher : CRC Press
ISBN 13 : 9780849326158
Total Pages : 260 pages
Book Rating : 4.3/5 (261 download)

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Book Synopsis Proceedings of the 1995 International Conference on Parallel Processing by : Prithviraj Banerjee

Download or read book Proceedings of the 1995 International Conference on Parallel Processing written by Prithviraj Banerjee and published by CRC Press. This book was released on 1995-08-08 with total page 260 pages. Available in PDF, EPUB and Kindle. Book excerpt: This set of technical books contains all the information presented at the 1995 International Conference on Parallel Processing. This conference, held August 14 - 18, featured over 100 lectures from more than 300 contributors, and included three panel sessions and three keynote addresses. The international authorship includes experts from around the globe, from Texas to Tokyo, from Leiden to London. Compiled by faculty at the University of Illinois and sponsored by Penn State University, these Proceedings are a comprehensive look at all that's new in the field of parallel processing.

1995 International Symposium on Microelectronics

Author : International Symposium on Microelectronics
Publisher :
ISBN 13 : 9780930815448
Total Pages : 584 pages
Book Rating : 4.8/5 (154 download)

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Book Synopsis 1995 International Symposium on Microelectronics by : International Symposium on Microelectronics

Download or read book 1995 International Symposium on Microelectronics written by International Symposium on Microelectronics and published by . This book was released on 1995 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Proceedings, 1996 International Conference on Multichip Modules

Author :
Publisher :
ISBN 13 :
Total Pages : 440 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Proceedings, 1996 International Conference on Multichip Modules by :

Download or read book Proceedings, 1996 International Conference on Multichip Modules written by and published by . This book was released on 1996 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt:

1995 International Symposium on Microelectronics

Author :
Publisher :
ISBN 13 :
Total Pages : 588 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis 1995 International Symposium on Microelectronics by :

Download or read book 1995 International Symposium on Microelectronics written by and published by . This book was released on 1995 with total page 588 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Proceedings of the Fifth International Symposium on Diamond Materials

Author : Electrochemical Society. Meeting
Publisher : The Electrochemical Society
ISBN 13 : 9781566771856
Total Pages : 718 pages
Book Rating : 4.7/5 (718 download)

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Book Synopsis Proceedings of the Fifth International Symposium on Diamond Materials by : Electrochemical Society. Meeting

Download or read book Proceedings of the Fifth International Symposium on Diamond Materials written by Electrochemical Society. Meeting and published by The Electrochemical Society. This book was released on 1998 with total page 718 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Microelectronic Packaging

Author : M. Datta
Publisher : CRC Press
ISBN 13 : 020347368X
Total Pages : 564 pages
Book Rating : 4.2/5 (34 download)

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Book Synopsis Microelectronic Packaging by : M. Datta

Download or read book Microelectronic Packaging written by M. Datta and published by CRC Press. This book was released on 2004-12-20 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.

Area Array Interconnection Handbook

Author : Karl J. Puttlitz
Publisher : Springer Science & Business Media
ISBN 13 : 1461513898
Total Pages : 1250 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Area Array Interconnection Handbook by : Karl J. Puttlitz

Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.

Microelectronics Packaging Handbook

Author : R.R. Tummala
Publisher : Springer Science & Business Media
ISBN 13 : 1461560373
Total Pages : 1060 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Microelectronics Packaging Handbook by : R.R. Tummala

Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Advanced Electronic Packaging

Author : Richard K. Ulrich
Publisher : John Wiley & Sons
ISBN 13 : 0471466093
Total Pages : 852 pages
Book Rating : 4.4/5 (714 download)

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Book Synopsis Advanced Electronic Packaging by : Richard K. Ulrich

Download or read book Advanced Electronic Packaging written by Richard K. Ulrich and published by John Wiley & Sons. This book was released on 2006-02-24 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt: As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

Proceedings of the ... International Symposium on Microelectronics

Author :
Publisher :
ISBN 13 :
Total Pages : 992 pages
Book Rating : 4.3/5 (91 download)

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Download or read book Proceedings of the ... International Symposium on Microelectronics written by and published by . This book was released on 2002 with total page 992 pages. Available in PDF, EPUB and Kindle. Book excerpt:

MEMS and Microstructures in Aerospace Applications

Author : Robert Osiander
Publisher : CRC Press
ISBN 13 : 1420027743
Total Pages : 400 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis MEMS and Microstructures in Aerospace Applications by : Robert Osiander

Download or read book MEMS and Microstructures in Aerospace Applications written by Robert Osiander and published by CRC Press. This book was released on 2018-10-03 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: The promise of MEMS for aerospace applications has been germinating for years, and current advances bring the field to the very cusp of fruition. Reliability is chief among the challenges limiting the deployment of MEMS technologies in space, as the requirement of zero failure during the mission is quite stringent for this burgeoning field. MEMS and Microstructures in Aerospace Applications provides all the necessary tools to overcome these obstacles and take MEMS from the lab bench to beyond the exosphere. The book begins with an overview of MEMS development and provides several demonstrations of past and current examples of MEMS in space. From this platform, the discussion builds to fabrication technologies; the effect of space environmental factors on MEMS devices; and micro technologies for space systems, instrumentation, communications, thermal control, guidance navigation and control, and propulsion. Subsequent chapters explore factors common to all of the described systems, such as MEMS packaging, handling and contamination control, material selection for specific applications, reliability practices for design and application, and assurance practices. Edited and contributed by an outstanding team of leading experts from industry, academia, and national laboratories, MEMS and Microstructures in Aerospace Applications illuminates the path toward qualifying and integrating MEMS devices and instruments into future space missions and developing innovative satellite systems.

National Semiconductor Metrology Program

Author : National Semiconductor Metrology Program (U.S.)
Publisher :
ISBN 13 :
Total Pages : 108 pages
Book Rating : 4.3/5 ( download)

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Book Synopsis National Semiconductor Metrology Program by : National Semiconductor Metrology Program (U.S.)

Download or read book National Semiconductor Metrology Program written by National Semiconductor Metrology Program (U.S.) and published by . This book was released on 1996 with total page 108 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Materials for Advanced Packaging

Author : Daniel Lu
Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 974 pages
Book Rating : 4.3/5 (194 download)

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Book Synopsis Materials for Advanced Packaging by : Daniel Lu

Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Future Energy Conferences and Symposia

Author :
Publisher :
ISBN 13 :
Total Pages : 672 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis Future Energy Conferences and Symposia by :

Download or read book Future Energy Conferences and Symposia written by and published by . This book was released on 1994 with total page 672 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Handbook of Adhesives and Sealants

Author : Philippe Cognard
Publisher : Elsevier
ISBN 13 : 0080534090
Total Pages : 511 pages
Book Rating : 4.0/5 (85 download)

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Book Synopsis Handbook of Adhesives and Sealants by : Philippe Cognard

Download or read book Handbook of Adhesives and Sealants written by Philippe Cognard and published by Elsevier. This book was released on 2005-07-14 with total page 511 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Adhesives and Sealants is the most comprehensive Adhesives and Sealants Handbook ever published, with the cooperation of around 35 authors from all over the world – each one a specialist in their field. It will include 80 chapters dealing with general information, theory of bonding and sealing, design of bonding parts, technical characteristics, chemistry, types of adhesives, application, equipment, controls, standards etc. Industrial applications such as automotive, aeronautics, building and civil engineering, electronics, packaging, wood, furniture, metals, plastics and composites, textiles, footwear etc. - Over 1,000 real-life examples illustrate the do's and don'ts of using adhesives - Every scientific and technical issue concerning every chemical type in every industry - Designed to help solve problems quickly, the content is structured to allow readers to navigate this comprehensive resource in 4 different ways

The VLSI Handbook

Author : Wai-Kai Chen
Publisher : CRC Press
ISBN 13 : 9781420049671
Total Pages : 1788 pages
Book Rating : 4.0/5 (496 download)

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Book Synopsis The VLSI Handbook by : Wai-Kai Chen

Download or read book The VLSI Handbook written by Wai-Kai Chen and published by CRC Press. This book was released on 2019-07-17 with total page 1788 pages. Available in PDF, EPUB and Kindle. Book excerpt: Over the years, the fundamentals of VLSI technology have evolved to include a wide range of topics and a broad range of practices. To encompass such a vast amount of knowledge, The VLSI Handbook focuses on the key concepts, models, and equations that enable the electrical engineer to analyze, design, and predict the behavior of very large-scale integrated circuits. It provides the most up-to-date information on IC technology you can find. Using frequent examples, the Handbook stresses the fundamental theory behind professional applications. Focusing not only on the traditional design methods, it contains all relevant sources of information and tools to assist you in performing your job. This includes software, databases, standards, seminars, conferences and more. The VLSI Handbook answers all your needs in one comprehensive volume at a level that will enlighten and refresh the knowledge of experienced engineers and educate the novice. This one-source reference keeps you current on new techniques and procedures and serves as a review for standard practice. It will be your first choice when looking for a solution.