Read Books Online and Download eBooks, EPub, PDF, Mobi, Kindle, Text Full Free.
17th Annual Ieee Semi Advanced Semiconductor Manufacturing Conference And Workshop
Download 17th Annual Ieee Semi Advanced Semiconductor Manufacturing Conference And Workshop full books in PDF, epub, and Kindle. Read online 17th Annual Ieee Semi Advanced Semiconductor Manufacturing Conference And Workshop ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Book Synopsis IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop by :
Download or read book IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1992 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book System on Package written by Rao Tummala and published by McGraw Hill Professional. This book was released on 2007-07-22 with total page 807 pages. Available in PDF, EPUB and Kindle. Book excerpt: System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Download or read book CleanRooms written by and published by . This book was released on 2008-01 with total page 48 pages. Available in PDF, EPUB and Kindle. Book excerpt: A central resource of technology and methods for environments where the control of contamination is critical.
Download or read book CleanRooms written by and published by . This book was released on 2008-04 with total page 48 pages. Available in PDF, EPUB and Kindle. Book excerpt: A central resource of technology and methods for environments where the control of contamination is critical.
Book Synopsis Handbook of Semiconductor Manufacturing Technology by : Yoshio Nishi
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2000-08-09 with total page 1186 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Handbook of Semiconductor Manufacturing Technology describes the individual processes and manufacturing control, support, and infrastructure technologies of silicon-based integrated-circuit manufacturing, many of which are also applicable for building devices on other semiconductor substrates. Discussing ion implantation, rapid thermal processing, photomask fabrication, chip testing, and plasma etching, the editors explore current and anticipated equipment, devices, materials, and practices of silicon-based manufacturing. The book includes a foreword by Jack S. Kilby, cowinner of the Nobel Prize in Physics 2000 "for his part in the invention of the integrated circuit."
Book Synopsis Direct Copper Interconnection for Advanced Semiconductor Technology by : Dongkai Shangguan
Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 549 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Book Synopsis Advanced Information Networking and Applications by : Leonard Barolli
Download or read book Advanced Information Networking and Applications written by Leonard Barolli and published by Springer Nature. This book was released on 2023-03-14 with total page 710 pages. Available in PDF, EPUB and Kindle. Book excerpt: Networks of today are going through a rapid evolution and there are many emerging areas of information networking and their applications. Heterogeneous networking supported by recent technological advances in low power wireless communications along with silicon integration of various functionalities such as sensing, communications, intelligence and actuations are emerging as a critically important disruptive computer class based on a new platform, networking structure and interface that enable novel, low cost and high volume applications. Several of such applications have been difficult to realize because of many interconnections problems. To fulfill their large range of applications different kinds of networks need to collaborate and wired and next generation wireless systems should be integrated in order to develop high performance computing solutions to problems arising from the complexities of these networks. This volume covers the theory, design and applications of computer networks, distributed computing and information systems. The aim of the volume “Advanced Information Networking and Applications” is to provide latest research findings, innovative research results, methods and development techniques from both theoretical and practical perspectives related to the emerging areas of information networking and applications.
Download or read book CleanRooms written by and published by . This book was released on 2008-03 with total page 56 pages. Available in PDF, EPUB and Kindle. Book excerpt: A central resource of technology and methods for environments where the control of contamination is critical.
Book Synopsis Handbook of Production Scheduling by : Jeffrey W. Herrmann
Download or read book Handbook of Production Scheduling written by Jeffrey W. Herrmann and published by Springer Science & Business Media. This book was released on 2006-08-18 with total page 331 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book concentrates on real-world production scheduling in factories and industrial settings. It includes industry case studies that use innovative techniques as well as academic research results that can be used to improve production scheduling. Its purpose is to present scheduling principles, advanced tools, and examples of innovative scheduling systems to persons who could use this information to improve their own production scheduling.
Book Synopsis Advances in Visual Computing by : Richard Boyle
Download or read book Advances in Visual Computing written by Richard Boyle and published by Springer. This book was released on 2006-11-17 with total page 936 pages. Available in PDF, EPUB and Kindle. Book excerpt: The two volume set LNCS 4291 and LNCS 4292 constitutes the refereed proceedings of the Second International Symposium on Visual Computing, ISVC 2006, held in Lake Tahoe, NV, USA in November 2006. The 65 revised full papers and 56 poster papers presented together with 57 papers of ten special tracks were carefully reviewed and selected from more than 280 submissions. The papers cover the four main areas of visual computing.
Book Synopsis Finishing of Advanced Ceramics and Glasses by : Robert Sabia
Download or read book Finishing of Advanced Ceramics and Glasses written by Robert Sabia and published by . This book was released on 1999 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Solid State Technology written by and published by . This book was released on 2001 with total page 876 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Artificial Intelligence in Manufacturing by : Masoud Soroush
Download or read book Artificial Intelligence in Manufacturing written by Masoud Soroush and published by Elsevier. This book was released on 2024-01-22 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt: Artificial Intelligence in Manufacturing: Applications and Case Studies provides detailed technical descriptions of emerging applications of AI in manufacturing using case studies to explain implementation. Artificial intelligence is increasingly being applied to all engineering disciplines, producing insights into how we understand the world and allowing us to create products in new ways. This book unlocks the advantages of this technology for manufacturing by drawing on work by leading researchers who have successfully used it in a range of applications. Processes including additive manufacturing, pharmaceutical manufacturing, painting, chemical engineering and machinery maintenance are all addressed. Case studies, worked examples, basic introductory material and step-by-step instructions on methods make the work accessible to a large group of interested professionals. - Explains innovative computational tools and methods in a practical and systematic way - Addresses a wide range of manufacturing types, including additive, chemical and pharmaceutical - Includes case studies from industry that describe how to overcome the challenges of implementing these methods in practice
Download or read book Forthcoming Books written by Rose Arny and published by . This book was released on 2001-06 with total page 1736 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Industrial Communication Technology Handbook by : Richard Zurawski
Download or read book Industrial Communication Technology Handbook written by Richard Zurawski and published by CRC Press. This book was released on 2017-12-19 with total page 1756 pages. Available in PDF, EPUB and Kindle. Book excerpt: Featuring contributions from major technology vendors, industry consortia, and government and private research establishments, the Industrial Communication Technology Handbook, Second Edition provides comprehensive and authoritative coverage of wire- and wireless-based specialized communication networks used in plant and factory automation, automotive applications, avionics, building automation, energy and power systems, train applications, and more. New to the Second Edition: 46 brand-new chapters and 21 substantially revised chapters Inclusion of the latest, most significant developments in specialized communication technologies and systems Addition of new application domains for specialized networks The Industrial Communication Technology Handbook, Second Edition supplies readers with a thorough understanding of the application-specific requirements for communication services and their supporting technologies. It is useful to a broad spectrum of professionals involved in the conception, design, development, standardization, and use of specialized communication networks as well as academic institutions engaged in engineering education and vocational training.
Download or read book IEEE Circuits & Devices written by and published by . This book was released on 2004 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advanced Nanoscale MOSFET Architectures by : Kalyan Biswas
Download or read book Advanced Nanoscale MOSFET Architectures written by Kalyan Biswas and published by John Wiley & Sons. This book was released on 2024-05-29 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: Comprehensive reference on the fundamental principles and basic physics dictating metal–oxide–semiconductor field-effect transistor (MOSFET) operation Advanced Nanoscale MOSFET Architectures provides an in-depth review of modern metal–oxide–semiconductor field-effect transistor (MOSFET) device technologies and advancements, with information on their operation, various architectures, fabrication, materials, modeling and simulation methods, circuit applications, and other aspects related to nanoscale MOSFET technology. The text begins with an introduction to the foundational technology before moving on to describe challenges associated with the scaling of nanoscale devices. Other topics covered include device physics and operation, strain engineering for highly scaled MOSFETs, tunnel FET, graphene based field effect transistors, and more. The text also compares silicon bulk and devices, nanosheet transistors and introduces low-power circuit design using advanced MOSFETs. Additional topics covered include: High-k gate dielectrics and metal gate electrodes for multi-gate MOSFETs, covering gate stack processing and metal gate modification Strain engineering in 3D complementary metal-oxide semiconductors (CMOS) and its scaling impact, and strain engineering in silicon–germanium (SiGe) FinFET and its challenges and future perspectives TCAD simulation of multi-gate MOSFET, covering model calibration and device performance for analog and RF applications Description of the design of an analog amplifier circuit using digital CMOS technology of SCL for ultra-low power VLSI applications Advanced Nanoscale MOSFET Architectures helps readers understand device physics and design of new structures and material compositions, making it an important resource for the researchers and professionals who are carrying out research in the field, along with students in related programs of study.
