Wireless Interface Technologies for 3D IC and Module Integration

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Author :
Publisher : Cambridge University Press
ISBN 13 : 110889822X
Total Pages : 338 pages
Book Rating : 4.1/5 (88 download)

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Book Synopsis Wireless Interface Technologies for 3D IC and Module Integration by : Tadahiro Kuroda

Download or read book Wireless Interface Technologies for 3D IC and Module Integration written by Tadahiro Kuroda and published by Cambridge University Press. This book was released on 2021-09-30 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt: Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.

3D Integration for VLSI Systems

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Author :
Publisher : CRC Press
ISBN 13 : 9814303828
Total Pages : 376 pages
Book Rating : 4.8/5 (143 download)

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Book Synopsis 3D Integration for VLSI Systems by : Chuan Seng Tan

Download or read book 3D Integration for VLSI Systems written by Chuan Seng Tan and published by CRC Press. This book was released on 2016-04-19 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th

3D Integration in VLSI Circuits

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Publisher : CRC Press
ISBN 13 : 1351779834
Total Pages : 217 pages
Book Rating : 4.3/5 (517 download)

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Book Synopsis 3D Integration in VLSI Circuits by : Katsuyuki Sakuma

Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2018-04-17 with total page 217 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

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Author :
Publisher : John Wiley & Sons
ISBN 13 : 111928967X
Total Pages : 465 pages
Book Rating : 4.1/5 (192 download)

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Book Synopsis 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility by : Lih-Tyng Hwang

Download or read book 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility written by Lih-Tyng Hwang and published by John Wiley & Sons. This book was released on 2018-03-28 with total page 465 pages. Available in PDF, EPUB and Kindle. Book excerpt: An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools

Wafer Level 3-D ICs Process Technology

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Author :
Publisher : Springer Science & Business Media
ISBN 13 : 0387765344
Total Pages : 365 pages
Book Rating : 4.3/5 (877 download)

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Book Synopsis Wafer Level 3-D ICs Process Technology by : Chuan Seng Tan

Download or read book Wafer Level 3-D ICs Process Technology written by Chuan Seng Tan and published by Springer Science & Business Media. This book was released on 2009-06-29 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

Three Dimensional System Integration

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Publisher : Springer Science & Business Media
ISBN 13 : 1441909621
Total Pages : 251 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis Three Dimensional System Integration by : Antonis Papanikolaou

Download or read book Three Dimensional System Integration written by Antonis Papanikolaou and published by Springer Science & Business Media. This book was released on 2010-12-07 with total page 251 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.

3D Integrated On-chip Wireless Power Delivery Interface

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Author :
Publisher :
ISBN 13 :
Total Pages : 60 pages
Book Rating : 4.:/5 (875 download)

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Book Synopsis 3D Integrated On-chip Wireless Power Delivery Interface by : Salahuddin Raju

Download or read book 3D Integrated On-chip Wireless Power Delivery Interface written by Salahuddin Raju and published by . This book was released on 2013 with total page 60 pages. Available in PDF, EPUB and Kindle. Book excerpt:

3D Stacked Chips

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Author :
Publisher : Springer
ISBN 13 : 3319204815
Total Pages : 354 pages
Book Rating : 4.3/5 (192 download)

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Book Synopsis 3D Stacked Chips by : Ibrahim (Abe) M. Elfadel

Download or read book 3D Stacked Chips written by Ibrahim (Abe) M. Elfadel and published by Springer. This book was released on 2016-05-11 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

Handbook of 3D Integration, Volume 4

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Author :
Publisher : John Wiley & Sons
ISBN 13 : 3527338551
Total Pages : 488 pages
Book Rating : 4.5/5 (273 download)

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Book Synopsis Handbook of 3D Integration, Volume 4 by : Paul D. Franzon

Download or read book Handbook of 3D Integration, Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-05-06 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

Through-Silicon Vias for 3D Integration

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Author :
Publisher : McGraw Hill Professional
ISBN 13 : 0071785159
Total Pages : 513 pages
Book Rating : 4.0/5 (717 download)

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Book Synopsis Through-Silicon Vias for 3D Integration by : John H. Lau

Download or read book Through-Silicon Vias for 3D Integration written by John H. Lau and published by McGraw Hill Professional. This book was released on 2012-08-05 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems. Coverage includes: Nanotechnology and 3D integration for the semiconductor industry TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing TSVs: mechanical, thermal, and electrical behaviors Thin-wafer strength measurement Wafer thinning and thin-wafer handling Microbumping, assembly, and reliability Microbump electromigration Transient liquid-phase bonding: C2C, C2W, and W2W 2.5D IC integration with interposers 3D IC integration with interposers Thermal management of 3D IC integration 3D IC packaging

Handbook of Wafer Bonding

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Author :
Publisher : John Wiley & Sons
ISBN 13 : 3527326464
Total Pages : 435 pages
Book Rating : 4.5/5 (273 download)

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Book Synopsis Handbook of Wafer Bonding by : Peter Ramm

Download or read book Handbook of Wafer Bonding written by Peter Ramm and published by John Wiley & Sons. This book was released on 2012-02-13 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

3D Integration in VLSI Circuits

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Author :
Publisher : CRC Press
ISBN 13 : 9781315200699
Total Pages : 217 pages
Book Rating : 4.2/5 (6 download)

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Book Synopsis 3D Integration in VLSI Circuits by : Katsuyuki Sakuma

Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2018 with total page 217 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world's leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

Design and Modeling for 3D ICs and Interposers

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Author :
Publisher : World Scientific
ISBN 13 : 9814508608
Total Pages : 379 pages
Book Rating : 4.8/5 (145 download)

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Book Synopsis Design and Modeling for 3D ICs and Interposers by : Madhavan Swaminathan

Download or read book Design and Modeling for 3D ICs and Interposers written by Madhavan Swaminathan and published by World Scientific. This book was released on 2013-11-05 with total page 379 pages. Available in PDF, EPUB and Kindle. Book excerpt: 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

3D IC Stacking Technology

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Author :
Publisher : McGraw Hill Professional
ISBN 13 : 0071741968
Total Pages : 543 pages
Book Rating : 4.0/5 (717 download)

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Book Synopsis 3D IC Stacking Technology by : Banqiu Wu

Download or read book 3D IC Stacking Technology written by Banqiu Wu and published by McGraw Hill Professional. This book was released on 2011-10-14 with total page 543 pages. Available in PDF, EPUB and Kindle. Book excerpt: The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology

MicroSystem Based on SiP Technology

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Author :
Publisher : Springer Nature
ISBN 13 : 9811900833
Total Pages : 867 pages
Book Rating : 4.8/5 (119 download)

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Book Synopsis MicroSystem Based on SiP Technology by : Suny Li

Download or read book MicroSystem Based on SiP Technology written by Suny Li and published by Springer Nature. This book was released on 2022-05-28 with total page 867 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si3P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification. Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance for the research and development of SiP projects. This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case. Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.

Wireless Technologies

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Author :
Publisher : CRC Press
ISBN 13 : 9780849379963
Total Pages : 696 pages
Book Rating : 4.3/5 (799 download)

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Book Synopsis Wireless Technologies by : Krzysztof Iniewski

Download or read book Wireless Technologies written by Krzysztof Iniewski and published by CRC Press. This book was released on 2007-10-11 with total page 696 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced concepts for wireless technologies present a vision of technology that is embedded in our surroundings and practically invisible. From established radio techniques like GSM, 802.11 or Bluetooth to more emerging technologies, such as Ultra Wide Band and smart dust motes, a common denominator for future progress is the underlying integrated circuit technology. Wireless Technologies responds to the explosive growth of standard cellular radios and radically different wireless applications by presenting new architectural and circuit solutions engineers can use to solve modern design problems. This reference addresses state-of-the art CMOS design in the context of emerging wireless applications, including 3G/4G cellular telephony, wireless sensor networks, and wireless medical application. Written by top international experts specializing in both the IC industry and academia, this carefully edited work uncovers new design opportunities in body area networks, medical implants, satellite communications, automobile radar detection, and wearable electronics. The book is divided into three sections: wireless system perspectives, chip architecture and implementation issues, and devices and technologies used to fabricate wireless integrated circuits. Contributors address key issues in the development of future silicon-based systems, such as scale of integration, ultra-low power dissipation, and the integration of heterogeneous circuit design style and processes onto one substrate. Wireless sensor network systems are now being applied in critical applications in commerce, healthcare, and security. This reference, which contains 25 practical and scientifically rigorous articles, provides the knowledge communications engineers need to design innovative methodologies at the circuit and system level.

Handbook of 3D Integration

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Author :
Publisher :
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.:/5 (69 download)

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Book Synopsis Handbook of 3D Integration by : Philip E. Garrou

Download or read book Handbook of 3D Integration written by Philip E. Garrou and published by . This book was released on 2008 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: