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Wafer Scale Integration Iii
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Book Synopsis Wafer Scale Integration, III by : Mariagiovanna Sami
Download or read book Wafer Scale Integration, III written by Mariagiovanna Sami and published by North Holland. This book was released on 1990 with total page 518 pages. Available in PDF, EPUB and Kindle. Book excerpt: The purpose of this book is to give an up-to-date presentation of architectures and technologies for wafer-scale integration. As such, it is an overview of the work of the leading research centers active in this area, and an outline of expected evolution and progress in the subject. New technological solutions are envisioned; while the use of optical technologies for interconnections promises to overcome one of the main restrictions to architectures on a wafer, the extension of quick-prototyping solutions to the wafer dimension allows the introduction of wafer-scale systems in educational environments as well as in applications where a quick result and limited production would make traditional silicon solutions unacceptable. Regarding architectures and their applications, three different lines of approach can be identified. Evolutive solutions are proposed, mainly concerning array architectures and restructuring techniques. Innovative architectures are presented, several papers dealing with neural nets. There are also architectures designed not just for experimental reasons but for industrial production. Overall, non-numerical applications predominate.
Author :Earl E. Swartzlander Jr. Publisher :Springer Science & Business Media ISBN 13 :1461316219 Total Pages :515 pages Book Rating :4.4/5 (613 download)
Book Synopsis Wafer Scale Integration by : Earl E. Swartzlander Jr.
Download or read book Wafer Scale Integration written by Earl E. Swartzlander Jr. and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 515 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.
Book Synopsis Wafer Level 3-D ICs Process Technology by : Chuan Seng Tan
Download or read book Wafer Level 3-D ICs Process Technology written by Chuan Seng Tan and published by Springer Science & Business Media. This book was released on 2009-06-29 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Book Synopsis Wafer-Level Integrated Systems by : Stuart K. Tewksbury
Download or read book Wafer-Level Integrated Systems written by Stuart K. Tewksbury and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: From the perspective of complex systems, conventional Ie's can be regarded as "discrete" devices interconnected according to system design objectives imposed at the circuit board level and higher levels in the system implementation hierarchy. However, silicon monolithic circuits have progressed to such complex functions that a transition from a philosophy of integrated circuits (Ie's) to one of integrated sys tems is necessary. Wafer-scale integration has played an important role over the past few years in highlighting the system level issues which will most significantly impact the implementation of complex monolithic systems and system components. Rather than being a revolutionary approach, wafer-scale integration will evolve naturally from VLSI as defect avoidance, fault tolerance and testing are introduced into VLSI circuits. Successful introduction of defect avoidance, for example, relaxes limits imposed by yield and cost on Ie dimensions, allowing the monolithic circuit's area to be chosen according to the natural partitioning of a system into individual functions rather than imposing area limits due to defect densities. The term "wafer level" is perhaps more appropriate than "wafer-scale". A "wafer-level" monolithic system component may have dimensions ranging from conventional yield-limited Ie dimensions to full wafer dimensions. In this sense, "wafer-scale" merely represents the obvious upper practical limit imposed by wafer sizes on the area of monolithic circuits. The transition to monolithic, wafer-level integrated systems will require a mapping of the full range of system design issues onto the design of monolithic circuit.
Download or read book Dielectrics for Nanosystems written by and published by The Electrochemical Society. This book was released on 2004 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis New Computing Techniques In Physics Research Ii - Proceedings Of The Second International Workshop On Software Engineering Artificial Intelligence And Expert Systems In High Energy And Nuclear Physics by : Denis Perret-gallix
Download or read book New Computing Techniques In Physics Research Ii - Proceedings Of The Second International Workshop On Software Engineering Artificial Intelligence And Expert Systems In High Energy And Nuclear Physics written by Denis Perret-gallix and published by World Scientific. This book was released on 1992-09-04 with total page 802 pages. Available in PDF, EPUB and Kindle. Book excerpt: A vivid example of the growing need for frontier physics experiments to make use of frontier technology is in the field of Artificial Intelligence (AI) and related themes.By AI we are referring here to the use of computers to deal with complex objects in an environment based on specific rules (Symbolic Manipulation), to assist groups of developers in the design, coding and maintenance of large packages (Software Engineering), to mimic human reasoning and strategy with knowledge bases to make a diagnosis of equipment (Expert Systems) or to implement a model of the brain to solve pattern recognition problems (Neural Networks). These techniques, developed some time ago by AI researchers, are confronted by down-to-earth problems arising in high-energy and nuclear physics. However, similar situations exist in other 'big sciences' such as space research or plasma physics, and common solutions can be applied.The magnitude and complexity of the experiments on the horizon for the end of the century clearly call for the application of AI techniques. Solutions are sought through international collaboration between research and industry.
Book Synopsis Wafer Scale Integration, II by : R. M. Lea
Download or read book Wafer Scale Integration, II written by R. M. Lea and published by North Holland. This book was released on 1988 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Wafer-Level Testing and Test During Burn-In for Integrated Circuits by : Sudarshan Bahukudumbi
Download or read book Wafer-Level Testing and Test During Burn-In for Integrated Circuits written by Sudarshan Bahukudumbi and published by Artech House. This book was released on 2010 with total page 198 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wafer-level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form. Burn-in is a temperature/bias reliability stress test used in detecting and screening out potential early life device failures. This hands-on resource provides a comprehensive analysis of these methods, showing how wafer-level testing during burn-in (WLTBI) helps lower product cost in semiconductor manufacturing. Engineers learn how to implement the testing of integrated circuits at the wafer-level under various resource constraints. Moreover, this unique book helps practitioners address the issue of enabling next generation products with previous generation testers. Practitioners also find expert insights on current industry trends in WLTBI test solutions.
Book Synopsis Coherent Optics for Access Networks by : Zhensheng Jia
Download or read book Coherent Optics for Access Networks written by Zhensheng Jia and published by CRC Press. This book was released on 2019-10-28 with total page 123 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book will highlight the motivation for coherent optics in access and introduce digital coherent optical system in detail, including advanced modulation formats, architecture of modulation and detection, and DSP flow for both transmitter and receiver. This book will also demonstrate potential approaches to re-design and re-engineer the digital coherent concept from long-haul and metro solutions to the access network, leveraging reduction in complexity and cost as well as the benefits of capacity increases and operational improvements. This book will illustrate the details on optimization of the digital, optical, and electrical complexity and standardization and interoperability.
Book Synopsis Semiconductor Wafer Bonding 10: Science, Technology, and Applications by :
Download or read book Semiconductor Wafer Bonding 10: Science, Technology, and Applications written by and published by The Electrochemical Society. This book was released on 2008-10 with total page 588 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.
Book Synopsis Defect and Fault Tolerance in VLSI Systems by : C.H. Stapper
Download or read book Defect and Fault Tolerance in VLSI Systems written by C.H. Stapper and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI systems, and wafer scale integrated circuits. In 1987, Dr. W. Moore organized an "International Workshop on Designing for Yield" at Oxford University. Edited papers of that workshop were published in reference [II. The participants in that workshop agreed that meetings of this type should he con tinued. preferahly on a yearly hasis. It was Dr. I. Koren who organized the "IEEE Inter national Workshop on Defect and Fault Tolerance in VLSI Systems" in Springfield Massachusetts the next year. Selected papers from that workshop were puhlished as the first volume of this series [21.
Book Synopsis Integrated Interconnect Technologies for 3D Nanoelectronic Systems by : Muhannad S. Bakir
Download or read book Integrated Interconnect Technologies for 3D Nanoelectronic Systems written by Muhannad S. Bakir and published by Artech House. This book was released on 2008-11-30 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Book Synopsis DIGITAL ELECTRONICS AND LOGIC DESIGN by : B. SOMANATHAN NAIR
Download or read book DIGITAL ELECTRONICS AND LOGIC DESIGN written by B. SOMANATHAN NAIR and published by PHI Learning Pvt. Ltd.. This book was released on 2002-01-01 with total page 452 pages. Available in PDF, EPUB and Kindle. Book excerpt: Designed as a textbook for undergraduate students in Electrical Engineering, Electronics, Computer Science, and Information Technology, this up-to-date, well-organized study gives an exhaustive treatment of the basic principles of Digital Electronics and Logic Design. It aims at bridging the gap between these two subjects. The many years of teaching undergraduate and postgraduate students of engineering that Professor Somanathan Nair has done is reflected in the in-depth analysis and student-friendly approach of this book. Concepts are illustrated with the help of a large number of diagrams so that students can comprehend the subject with ease. Worked-out examples within the text illustrate the concepts discussed, and questions at the end of each chapter drill the students in self-study.
Book Synopsis Handbook of 3D Integration, Volume 3 by : Philip Garrou
Download or read book Handbook of 3D Integration, Volume 3 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2014-07-21 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.
Author :Philip C. Treleaven Publisher :Springer Science & Business Media ISBN 13 :9783540182030 Total Pages :506 pages Book Rating :4.1/5 (82 download)
Book Synopsis Future Parallel Computers by : Philip C. Treleaven
Download or read book Future Parallel Computers written by Philip C. Treleaven and published by Springer Science & Business Media. This book was released on 1987-08-12 with total page 506 pages. Available in PDF, EPUB and Kindle. Book excerpt: Organized by the University of Pisa on behalf of the European Strategic Programme for Research and Development in Information Technology (ESPRIT)
Download or read book NANO-CHIPS 2030 written by Boris Murmann and published by Springer Nature. This book was released on 2020-06-08 with total page 597 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this book, a global team of experts from academia, research institutes and industry presents their vision on how new nano-chip architectures will enable the performance and energy efficiency needed for AI-driven advancements in autonomous mobility, healthcare, and man-machine cooperation. Recent reviews of the status quo, as presented in CHIPS 2020 (Springer), have prompted the need for an urgent reassessment of opportunities in nanoelectronic information technology. As such, this book explores the foundations of a new era in nanoelectronics that will drive progress in intelligent chip systems for energy-efficient information technology, on-chip deep learning for data analytics, and quantum computing. Given its scope, this book provides a timely compendium that hopes to inspire and shape the future of nanoelectronics in the decades to come.
Book Synopsis Soft Configurable Wafer Scale Integration by : M. G. Blatt
Download or read book Soft Configurable Wafer Scale Integration written by M. G. Blatt and published by . This book was released on 1990 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt: The redundancy models constrain wafer yield by system requirements such as the minimum number of working circuit units, and whether these working units are distributed evenly around the wafer. Choice of redundancy model significantly affects the resulting wafer yield."
