Wafer Level Micropackaging For Rf Mems Switches

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Radio Frequency Micromachined Switches, Switching Networks, and Phase Shifters

Author : Shiban Kishen Koul
Publisher : CRC Press
ISBN 13 : 1351021338
Total Pages : 305 pages
Book Rating : 4.3/5 (51 download)

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Book Synopsis Radio Frequency Micromachined Switches, Switching Networks, and Phase Shifters by : Shiban Kishen Koul

Download or read book Radio Frequency Micromachined Switches, Switching Networks, and Phase Shifters written by Shiban Kishen Koul and published by CRC Press. This book was released on 2019-05-03 with total page 305 pages. Available in PDF, EPUB and Kindle. Book excerpt: Radio Frequency Micromachined Switches, Switching Networks, and Phase Shifters discusses radio frequency microelectromechanical systems (RF MEMS)-based control components and will be useful for researchers and R&D engineers. It offers an in-depth study, performance analysis, and extensive characterization on micromachined switches and phase shifters. The reader will learn about basic design methodology and techniques to carry out extensive measurements on MEMS switches and phase shifters which include electrical, mechanical, power handling, linearity, temperature stability, reliability, and radio frequency performance. Practical examples included in the book will help readers to build high performance systems/subsystems using micromachined circuits. Key Features Provides simple design methodology of MEMS switches and switching networks including SPST to SP16T switches Gives an in-depth performance study of micromachined phase shifters. Detailed study on reliability and power handling capability of RF MEMS switches and phase shifters presented Proposes reconfigurable micromachined phase shifters Verifies a variety of MEMS switches and phase shifters experimentally

Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering

Author : Seonho Seok
Publisher : Springer
ISBN 13 : 3319778722
Total Pages : 119 pages
Book Rating : 4.3/5 (197 download)

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Book Synopsis Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering by : Seonho Seok

Download or read book Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering written by Seonho Seok and published by Springer. This book was released on 2018-04-27 with total page 119 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.

RF MEMS

Author : Gabriel M. Rebeiz
Publisher : John Wiley & Sons
ISBN 13 : 0471462888
Total Pages : 512 pages
Book Rating : 4.4/5 (714 download)

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Book Synopsis RF MEMS by : Gabriel M. Rebeiz

Download or read book RF MEMS written by Gabriel M. Rebeiz and published by John Wiley & Sons. This book was released on 2004-02-06 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ultrasmall Radio Frequency and Micro-wave Microelectromechanical systems (RF MEMs), such as switches, varactors, and phase shifters, exhibit nearly zero power consumption or loss. For this reason, they are being developed intensively by corporations worldwide for use in telecommunications equipment. This book acquaints readers with the basics of RF MEMs and describes how to design practical circuits and devices with them. The author, an acknowledged expert in the field, presents a range of real-world applications and shares many valuable tricks of the trade.

MEMS Reliability

Author : Allyson L. Hartzell
Publisher : Springer Science & Business Media
ISBN 13 : 144196018X
Total Pages : 300 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis MEMS Reliability by : Allyson L. Hartzell

Download or read book MEMS Reliability written by Allyson L. Hartzell and published by Springer Science & Business Media. This book was released on 2010-11-02 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it. MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.

Technologies for Smart Sensors and Sensor Fusion

Author : Kevin Yallup
Publisher : CRC Press
ISBN 13 : 1466595515
Total Pages : 491 pages
Book Rating : 4.4/5 (665 download)

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Book Synopsis Technologies for Smart Sensors and Sensor Fusion by : Kevin Yallup

Download or read book Technologies for Smart Sensors and Sensor Fusion written by Kevin Yallup and published by CRC Press. This book was released on 2017-12-19 with total page 491 pages. Available in PDF, EPUB and Kindle. Book excerpt: Exciting new developments are enabling sensors to go beyond the realm of simple sensing of movement or capture of images to deliver information such as location in a built environment, the sense of touch, and the presence of chemicals. These sensors unlock the potential for smarter systems, allowing machines to interact with the world around them in more intelligent and sophisticated ways. Featuring contributions from authors working at the leading edge of sensor technology, Technologies for Smart Sensors and Sensor Fusion showcases the latest advancements in sensors with biotechnology, medical science, chemical detection, environmental monitoring, automotive, and industrial applications. This valuable reference describes the increasingly varied number of sensors that can be integrated into arrays, and examines the growing availability and computational power of communication devices that support the algorithms needed to reduce the raw sensor data from multiple sensors and convert it into the information needed by the sensor array to enable rapid transmission of the results to the required point. Using both SI and US units, the text: Provides a fundamental and analytical understanding of the underlying technology for smart sensors Discusses groundbreaking software and sensor systems as well as key issues surrounding sensor fusion Exemplifies the richness and diversity of development work in the world of smart sensors and sensor fusion Offering fresh insight into the sensors of the future, Technologies for Smart Sensors and Sensor Fusion not only exposes readers to trends but also inspires innovation in smart sensor and sensor system development.

Materials, Integration and Packaging Issues for High-frequency Devices

Author :
Publisher :
ISBN 13 :
Total Pages : 256 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Materials, Integration and Packaging Issues for High-frequency Devices by :

Download or read book Materials, Integration and Packaging Issues for High-frequency Devices written by and published by . This book was released on 2003 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Nanodevices for Microwave and Millimeter Wave Applications

Author : Isabelle Huynen
Publisher : MDPI
ISBN 13 : 3039362224
Total Pages : 92 pages
Book Rating : 4.0/5 (393 download)

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Book Synopsis Nanodevices for Microwave and Millimeter Wave Applications by : Isabelle Huynen

Download or read book Nanodevices for Microwave and Millimeter Wave Applications written by Isabelle Huynen and published by MDPI. This book was released on 2020-06-16 with total page 92 pages. Available in PDF, EPUB and Kindle. Book excerpt: The microwave and millimeter wave frequency range is nowadays widely exploited in a large variety of fields including (wireless) communications, security, radar, spectroscopy, but also astronomy and biomedical, to name a few. This Special Issue focuses on the interaction between the nanoscale dimensions and centimeter to millimeter wavelengths. This interaction has been proven to be efficient for the design and fabrication of devices showing enhanced performance. Novel contributions are welcome in the field of devices based on nanoscaled geometries and materials. Applications cover, but not are limited to, electronics, sensors, signal processing, imaging and metrology, all exploiting nanoscale/nanotechnology at microwave and millimeter waves. Contributions can take the form of short communications, regular or review papers.

3D and Circuit Integration of MEMS

Author : Masayoshi Esashi
Publisher : John Wiley & Sons
ISBN 13 : 3527823255
Total Pages : 528 pages
Book Rating : 4.5/5 (278 download)

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Book Synopsis 3D and Circuit Integration of MEMS by : Masayoshi Esashi

Download or read book 3D and Circuit Integration of MEMS written by Masayoshi Esashi and published by John Wiley & Sons. This book was released on 2021-03-16 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.

Micromachining and Microfabrication Process Technology

Author :
Publisher :
ISBN 13 :
Total Pages : 632 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Micromachining and Microfabrication Process Technology by :

Download or read book Micromachining and Microfabrication Process Technology written by and published by . This book was released on 2003 with total page 632 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Nanotechnology for Telecommunications

Author : Sohail Anwar
Publisher : CRC Press
ISBN 13 : 1420053272
Total Pages : 453 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis Nanotechnology for Telecommunications by : Sohail Anwar

Download or read book Nanotechnology for Telecommunications written by Sohail Anwar and published by CRC Press. This book was released on 2017-12-19 with total page 453 pages. Available in PDF, EPUB and Kindle. Book excerpt: With its unique promise to revolutionize science, engineering, technology, and other fields, nanotechnology continues to profoundly impact associated materials, components, and systems, particularly those used in telecommunications. These developments are leading to easier convergence of related technologies, massive storage data, compact storage devices, and higher-performance computing. Nanotechnology for Telecommunications presents vital technical scientific information to help readers grasp issues and challenges associated with nanoscale telecommunication system development and commercialization—and then avail themselves of the many opportunities to be gleaned. This book provides technical information and research ideas regarding the use of nanotechnology in telecommunications and information processing, reflecting the continuing trend toward the use of optoelectronics. Nanotech will eventually lead to a technology cluster that offers a complete range of functionalities for systems used in domains including information, energy, construction, environmental, and biomedical. Describing current and future developments that hold promise for significant innovations in telecommunications, this book is organized to provide a progressive understanding of topics including: Background information on nanoscience and nanotechnology Specific applications of nanotechnology in telecommunications Nanostructured optoelectronic materials MEMS, NEMS, and their applications in communication systems Quantum dot Cellular Automata (QCA) and its applications in telecommunication systems How nonohmic nonlinear behavior affects both digital and analog signal processing Concepts regarding quantum switching and its applications in quantum networks The scale of the physical systems that use nanoscale electronic devices is still large, and that presents serious challenges to the establishment of interconnections between nanoscale devices and the outside world. Also addressing consequent social implications of nanotech, this book reviews a broad range of the nano concepts and their influence on every aspect of telecommunications. It describes the different levels of interconnections in systems and details the standardized assembly process for a broad specrum of micro-, nano-, bio-, fiber-optic, and optoelectronic components and functions. This book is a powerful tool for understanding how to harness the power of nanotech through integration of materials, processes, devices, and applications.

MOEMS Display and Imaging Systems

Author : Hakan Urey
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 : 9780819447852
Total Pages : 356 pages
Book Rating : 4.4/5 (478 download)

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Book Synopsis MOEMS Display and Imaging Systems by : Hakan Urey

Download or read book MOEMS Display and Imaging Systems written by Hakan Urey and published by SPIE-International Society for Optical Engineering. This book was released on 2003 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Microelectromechanical Systems

Author :
Publisher :
ISBN 13 :
Total Pages : 918 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Microelectromechanical Systems by :

Download or read book Microelectromechanical Systems written by and published by . This book was released on 2001 with total page 918 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Microfluidics, BioMEMS, and Medical Microsystems

Author : Society of Photo-optical Instrumentation Engineers
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 : 9780819447821
Total Pages : 410 pages
Book Rating : 4.4/5 (478 download)

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Book Synopsis Microfluidics, BioMEMS, and Medical Microsystems by : Society of Photo-optical Instrumentation Engineers

Download or read book Microfluidics, BioMEMS, and Medical Microsystems written by Society of Photo-optical Instrumentation Engineers and published by SPIE-International Society for Optical Engineering. This book was released on 2003 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Fundamentals of Microsystems Packaging

Author : Rao Tummala
Publisher : McGraw Hill Professional
ISBN 13 : 0071500596
Total Pages : 979 pages
Book Rating : 4.0/5 (715 download)

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Book Synopsis Fundamentals of Microsystems Packaging by : Rao Tummala

Download or read book Fundamentals of Microsystems Packaging written by Rao Tummala and published by McGraw Hill Professional. This book was released on 2001-05-08 with total page 979 pages. Available in PDF, EPUB and Kindle. Book excerpt: LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing

Mems Packaging

Author : Yung-cheng Lee
Publisher : World Scientific
ISBN 13 : 9813229373
Total Pages : 363 pages
Book Rating : 4.8/5 (132 download)

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Book Synopsis Mems Packaging by : Yung-cheng Lee

Download or read book Mems Packaging written by Yung-cheng Lee and published by World Scientific. This book was released on 2018-01-03 with total page 363 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.

Advanced RF MEMS

Author : Stepan Lucyszyn
Publisher : Cambridge University Press
ISBN 13 : 1139491660
Total Pages : 441 pages
Book Rating : 4.1/5 (394 download)

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Book Synopsis Advanced RF MEMS by : Stepan Lucyszyn

Download or read book Advanced RF MEMS written by Stepan Lucyszyn and published by Cambridge University Press. This book was released on 2010-08-19 with total page 441 pages. Available in PDF, EPUB and Kindle. Book excerpt: An up-to-date guide to the theory and applications of RF MEMS. With detailed information about RF MEMS technology as well as its reliability and applications, this is a comprehensive resource for professionals, researchers, and students alike. • Reviews RF MEMS technologies • Illustrates new techniques that solve long-standing problems associated with reliability and packaging • Provides the information needed to incorporate RF MEMS into commercial products • Describes current and future trends in RF MEMS, providing perspective on industry growth • Ideal for those studying or working in RF and microwave circuits, systems, microfabrication and manufacturing, production management and metrology, and performance evaluation

Practical Guide to RF-MEMS

Author : Jacopo Iannacci
Publisher : John Wiley & Sons
ISBN 13 : 3527673946
Total Pages : 374 pages
Book Rating : 4.5/5 (276 download)

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Book Synopsis Practical Guide to RF-MEMS by : Jacopo Iannacci

Download or read book Practical Guide to RF-MEMS written by Jacopo Iannacci and published by John Wiley & Sons. This book was released on 2013-08-12 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: Closes the gap between hardcore-theoretical and purely experimental RF-MEMS books. The book covers, from a practical viewpoint, the most critical steps that have to be taken in order to develop novel RF-MEMS device concepts. Prototypical RF-MEMS devices, both including lumped components and complex networks, are presented at the beginning of the book as reference examples, and these are then discussed from different perspectives with regard to design, simulation, packaging, testing, and post-fabrication modeling. Theoretical concepts are introduced when necessary to complement the practical hints given for all RF-MEMS development stages. Provides researchers and engineers with invaluable practical hints on how to develop novel RF-MEMS device concepts Covers all critical steps, dealing with design, simulation, optimization, characterization and fabrication of MEMS for radio-frequency applications Addresses frequently disregarded issues, explicitly treating the hard to predict interplay between the three-dimensional device structure and its electromagnetic functionality Bridges theory and experiment, fundamental concepts are introduced with the application in mind, and simulation results are validated against experimental results Appeals to the practice-oriented R&D reader: design and simulation examples are based on widely known software packages such as ANSYS and the hardware description language Verilog.