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Author :
Publisher :
ISBN 13 :
Total Pages : 194 pages
Book Rating : 4.3/5 (91 download)
Download or read book IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings]. written by and published by . This book was released on 1998 with total page 194 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Don Millard
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 504 pages
Book Rating : 4.:/5 (318 download)
Download or read book Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 13-15, 1997, Austin, TX, USA written by Don Millard and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1997 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt: The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufacturing, and packaging technology.
Author : Ch36205
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 : 9780780345232
Total Pages : 500 pages
Book Rating : 4.3/5 (452 download)
Download or read book 1998 23rd IEEE - CPMT International Electronics Manufacturing Technology Symposium written by Ch36205 and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1998 with total page 500 pages. Available in PDF, EPUB and Kindle. Book excerpt: The IEMT is an international forum for presenting research, development and applications of manufacturing technology and systems for use in the manufacture of electronic components, assemblies, and systems.
Author : Jia-Wei Chang
Publisher : Springer Nature
ISBN 13 : 9811601151
Total Pages : 2343 pages
Book Rating : 4.8/5 (116 download)
Download or read book Frontier Computing written by Jia-Wei Chang and published by Springer Nature. This book was released on 2022-01-01 with total page 2343 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers the proceedings of the 10th International Conference on Frontier Computing, held in Singapore, on July 10–13, 2020, and provides comprehensive coverage of the latest advances and trends in information technology, science, and engineering. It addresses a number of broad themes, including communication networks, business intelligence and knowledge management, web intelligence, and related fields that inspire the development of information technology. The respective contributions cover a wide range of topics: database and data mining, networking and communications, web and Internet of things, embedded systems, soft computing, social network analysis, security and privacy, optical communication, and ubiquitous/pervasive computing. Many of the papers outline promising future research directions, and the book benefits students, researchers, and professionals alike. Further, it offers a useful reference guide for newcomers to the field.
Author :
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 520 pages
Book Rating : 4.:/5 (318 download)
Download or read book Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1996 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 370 pages
Book Rating : 4.0/5 ( download)
Download or read book IEEE/CPMT International Electronics Manufacturing Technology Symposium written by and published by . This book was released on 2004 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Karl J. Puttlitz
Publisher : Springer Science & Business Media
ISBN 13 : 1461513898
Total Pages : 1250 pages
Book Rating : 4.4/5 (615 download)
Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Author : Yan Li
Publisher : Springer Nature
ISBN 13 : 9811570906
Total Pages : 629 pages
Book Rating : 4.8/5 (115 download)
Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer Nature. This book was released on 2020-11-23 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Author : Masayoshi Esashi
Publisher : John Wiley & Sons
ISBN 13 : 3527823255
Total Pages : 528 pages
Book Rating : 4.5/5 (278 download)
Download or read book 3D and Circuit Integration of MEMS written by Masayoshi Esashi and published by John Wiley & Sons. This book was released on 2021-03-16 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Author : Erlend Alfnes
Publisher : Springer Nature
ISBN 13 : 3031436628
Total Pages : 842 pages
Book Rating : 4.0/5 (314 download)
Download or read book Advances in Production Management Systems. Production Management Systems for Responsible Manufacturing, Service, and Logistics Futures written by Erlend Alfnes and published by Springer Nature. This book was released on 2023-09-13 with total page 842 pages. Available in PDF, EPUB and Kindle. Book excerpt: This 4-volume set, IFIP AICT 689-692, constitutes the refereed proceedings of the International IFIP WG 5.7 Conference on Advances in Production Management Systems, APMS 2023, held in Trondheim, Norway, during September 17–21, 2023. The 213 full papers presented in these volumes were carefully reviewed and selected from a total of 224 submissions. They were organized in topical sections as follows: Part I : Lean Management in the Industry 4.0 Era; Crossroads and Paradoxes in the Digital Lean Manufacturing World; Digital Transformation Approaches in Production Management; Managing Digitalization of Production Systems; Workforce Evolutionary Pathways in Smart Manufacturing Systems; Next Generation Human-Centered Manufacturing and Logistics Systems for the Operator 5.0; and SME 5.0: Exploring Pathways to the Next Level of Intelligent, Sustainable, and Human-Centered SMEs. Part II : Digitally Enabled and Sustainable Service and Operations Management in PSS Lifecycle; Exploring Digital Servitization in Manufacturing; Everything-as-a-Service (XaaS) Business Models in the Manufacturing Industry; Digital Twin Concepts in Production and Services; Experiential Learning in Engineering Education; Lean in Healthcare; Additive Manufacturing in Operations and Supply Chain Management; and Applications of Artificial Intelligence in Manufacturing. Part III : Towards Next-Generation Production and SCM in Yard and Construction Industries; Transforming Engineer-to-Order Projects, Supply Chains and Ecosystems; Modelling Supply Chain and Production Systems; Advances in Dynamic Scheduling Technologies for Smart Manufacturing; and Smart Production Planning and Control. Part IV : Circular Manufacturing and Industrial Eco-Efficiency; Smart Manufacturing to Support Circular Economy; Product Information Management and Extended Producer Responsibility; Product and Asset Life Cycle Management for Sustainable and Resilient Manufacturing Systems; Sustainable Mass Customization in the Era of Industry 5.0; Food and Bio-Manufacturing; Battery Production Development and Management; Operations and SCM in Energy-Intensive Production for a Sustainable Future; and Resilience Management in Supply Chains.
Author : Nam P. Suh
Publisher : Oxford University Press, USA
ISBN 13 : 0195178769
Total Pages : 313 pages
Book Rating : 4.1/5 (951 download)
Download or read book Complexity written by Nam P. Suh and published by Oxford University Press, USA. This book was released on 2005 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: Suh (mechanical engineering, Massachusetts, Institute of Technology) offers a general theoretical framework that may be used to solve complexity problems in engineering, science, and even in certain nontechnical areas.
Author : Chong Leong, Gan
Publisher : Springer Nature
ISBN 13 : 3031267087
Total Pages : 223 pages
Book Rating : 4.0/5 (312 download)
Download or read book Interconnect Reliability in Advanced Memory Device Packaging written by Chong Leong, Gan and published by Springer Nature. This book was released on 2023-05-30 with total page 223 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
Author : Peter Ramm
Publisher : John Wiley & Sons
ISBN 13 : 3527326464
Total Pages : 435 pages
Book Rating : 4.5/5 (273 download)
Download or read book Handbook of Wafer Bonding written by Peter Ramm and published by John Wiley & Sons. This book was released on 2012-02-13 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Author : Dimitrios A. Lamprou
Publisher : MDPI
ISBN 13 : 3039364235
Total Pages : 436 pages
Book Rating : 4.0/5 (393 download)
Download or read book 3D Printing of Pharmaceuticals and Drug Delivery Devices written by Dimitrios A. Lamprou and published by MDPI. This book was released on 2020-07-01 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 3D printing (3DP) process was patented in 1986; however, only in the last decade has it begun to be used for medical applications, as well as in the fields of prosthetics, bio-fabrication, and pharmaceutical printing. 3DP or additive manufacturing (AM) is a family of technologies that implement layer-by-layer processes in order to fabricate physical models based on a computer aided design (CAD) model. 3D printing permits the fabrication of high degrees of complexity with great reproducibility in a fast and cost-effective fashion. 3DP technology offers a new paradigm for the direct manufacture of individual dosage forms and has the potential to allow for variations in size and geometry as well as control dose and release behavior. Furthermore, the low cost and ease of use of 3DP systems means that the possibility of manufacturing medicines and medical devices at the point of dispensing or at the point of use could become a reality. 3DP thus offers the perfect innovative manufacturing route to address the critical capability gap that hinders the widespread exploitation of personalized medicines for molecules that are currently not easy to deliver. This Special Issue will address new developments in the area of 3D printing and bioprinting for drug delivery applications, covering the recent advantages and future directions of additive manufacturing for pharmaceutical products.
Author : Christopher Corti
Publisher : CRC Press
ISBN 13 : 1420065262
Total Pages : 446 pages
Book Rating : 4.4/5 (2 download)
Download or read book Gold written by Christopher Corti and published by CRC Press. This book was released on 2009-12-02 with total page 446 pages. Available in PDF, EPUB and Kindle. Book excerpt: Gold is used in a wide range of industrial and medical applications and accounts for over 10 percent of the annual demand for metal, worth billions of dollars annually. While much has been written about the mystique and trade of gold, very little has been written about the science and technology in which it is involved. Edited by two respected auth
Author : James E. Morris
Publisher : Springer
ISBN 13 : 3319903624
Total Pages : 1007 pages
Book Rating : 4.3/5 (199 download)
Download or read book Nanopackaging written by James E. Morris and published by Springer. This book was released on 2018-09-22 with total page 1007 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Author : Stefan Voß
Publisher : Springer Science & Business Media
ISBN 13 : 3790823619
Total Pages : 482 pages
Book Rating : 4.7/5 (98 download)
Download or read book Logistik Management written by Stefan Voß and published by Springer Science & Business Media. This book was released on 2009-08-21 with total page 482 pages. Available in PDF, EPUB and Kindle. Book excerpt: Die Globalisierung und Virtualisierung von Geschäftsbeziehungen vergrößert die Bedeutung und die Komplexität logistischer Herausforderungen. Das Management logistischer Netzwerke wird zu einem wesentlichen Wettbewerbsfaktor für Unternehmen. Das Buch wie die gleichnamige Tagung (September 2009) haben zum Ziel, den internationalen Gedankenaustausch und die Diskussion zwischen Wissenschaft und Praxis gezielt zu fördern, damit Strategien, Methoden und Werkzeuge entwickelt werden können, die es ermöglichen, den wachsenden Anforderungen gerecht zu werden.
