Download Twenty Sixth Annual Ieee Semiconductor Thermal Measurement And Management Symposium Proceedings 2010 full books in PDF, epub, and Kindle. Read online Twenty Sixth Annual Ieee Semiconductor Thermal Measurement And Management Symposium Proceedings 2010 ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Book Synopsis Thermal Analysis of Power Electronic Devices Used in Renewable Energy Systems by : Alhussein Albarbar
Download or read book Thermal Analysis of Power Electronic Devices Used in Renewable Energy Systems written by Alhussein Albarbar and published by Springer. This book was released on 2017-07-19 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book analyzes the thermal characteristics of power electronic devices (PEDs) with a focus on those used in wind and solar energy systems. The authors focus on the devices used in such applications, for example boost converters and inverters under different operating conditions. The book explains in detail finite element modeling techniques, setting up measuring systems, data analysis, and PEDs’ lifetime calculations. It is appropriate reading for graduate students and researchers who focus on the design and reliability of power electronic devices.
Book Synopsis Heat Pipes and Solid Sorption Transformations by : L.L Vasiliev
Download or read book Heat Pipes and Solid Sorption Transformations written by L.L Vasiliev and published by CRC Press. This book was released on 2013-05-08 with total page 539 pages. Available in PDF, EPUB and Kindle. Book excerpt: Developing clean energy and utilizing waste energy has become increasingly vital. Research targeting the advancement of thermally powered adsorption cooling technologies has progressed in the past few decades, and the awareness of fuel cells and thermally activated (heat pipe heat exchangers) adsorption systems using natural refrigerants and/or alternatives to hydrofluorocarbon-based refrigerants is becoming ever more important. Heat Pipes and Solid Sorption Transformations: Fundamentals and Practical Applications concentrates on state-of-the-art adsorption research and technologies for relevant applications based on the use of efficient heat transfer devices—heat pipe and two-phase thermosyphons—with the objectives of energy efficiency and sustainability. This book also discusses heat pipe thermal control as it relates to spacecraft applications. The first few chapters of Heat Pipes and Solid Sorption Transformations: Fundamentals and Practical Applications focus on heating and cooling, the principles of adsorption, adsorption dynamics, and the availability of three-phase boundaries. Other chapters cover successful heat pipe applications and heat-pipe-based thermal control of fuel cells, solid sorption transformers, and electronic components and air-condition devices. The final chapters summarize the achievements in the field of heat and mass transfer study in heat pipes with variable properties such as gas loaded heat pipes. Several configurations of thermosyphons are showcased, with suggested applications. A number of examples of equipment using the thermosyphon technology are presented and, in the final chapter, the concept of flow boiling and flow condensation heat transfer in micochannels is analyzed in detail.
Book Synopsis Energy-Efficient Distributed Computing Systems by : Albert Y. Zomaya
Download or read book Energy-Efficient Distributed Computing Systems written by Albert Y. Zomaya and published by John Wiley & Sons. This book was released on 2012-07-26 with total page 605 pages. Available in PDF, EPUB and Kindle. Book excerpt: The energy consumption issue in distributed computing systems raises various monetary, environmental and system performance concerns. Electricity consumption in the US doubled from 2000 to 2005. From a financial and environmental standpoint, reducing the consumption of electricity is important, yet these reforms must not lead to performance degradation of the computing systems. These contradicting constraints create a suite of complex problems that need to be resolved in order to lead to 'greener' distributed computing systems. This book brings together a group of outstanding researchers that investigate the different facets of green and energy efficient distributed computing. Key features: One of the first books of its kind Features latest research findings on emerging topics by well-known scientists Valuable research for grad students, postdocs, and researchers Research will greatly feed into other technologies and application domains
Book Synopsis Thermal and Electro-Thermal System Simulation by : Márta Rencz
Download or read book Thermal and Electro-Thermal System Simulation written by Márta Rencz and published by MDPI. This book was released on 2019-11-18 with total page 222 pages. Available in PDF, EPUB and Kindle. Book excerpt: With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in the design phase. This can be done with thermal end electro-thermal design and simulation tools. This Special Issue of Energies, edited by two well-known experts of the field, Prof. Marta Rencz, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects twelve papers carefully selected for the representation of the latest results in thermal and electro-thermal system simulation. These contributions present a good survey of the latest results in one of the most topical areas in the field of electronics: The thermal and electro-thermal simulation of electronic components and systems. Several papers of this issue are extended versions of papers presented at the THERMINIC 2018 Workshop, held in Stockholm in the fall of 2018. The papers presented here deal with modeling and simulation of state-of-the-art applications that are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. Contributions covered the thermal simulation of electronic packages, electro-thermal advanced modeling in power electronics, multi-physics modeling and simulation of LEDs, and the characterization of interface materials, among other subjects.
Download or read book Mechanical Engineering Series written by and published by Science Network. This book was released on 2006 with total page 67 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Architecture of Computing Systems -- ARCS 2013 by : Hana Kubatova
Download or read book Architecture of Computing Systems -- ARCS 2013 written by Hana Kubatova and published by Springer. This book was released on 2013-02-12 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 26th International Conference on Architecture of Computing Systems, ARCS 2013, held in Prague, Czech Republic, in February 2013. The 29 papers presented were carefully reviewed and selected from 73 submissions. The topics covered are computer architecture topics such as multi-cores, memory systems, and parallel computing, adaptive system architectures such as reconfigurable systems in hardware and software, customization and application specific accelerators in heterogeneous architectures, organic and autonomic computing including both theoretical and practical results on self-organization, self-configuration, self-optimization, self-healing, and self-protection techniques, operating systems including but not limited to scheduling, memory management, power management, RTOS, energy-awareness, and green computing.
Book Synopsis Approximate Computing by : Weiqiang Liu
Download or read book Approximate Computing written by Weiqiang Liu and published by Springer Nature. This book was released on 2022-08-22 with total page 607 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explores the technological developments at various levels of abstraction, of the new paradigm of approximate computing. The authors describe in a single-source the state-of-the-art, covering the entire spectrum of research activities in approximate computing, bridging device, circuit, architecture, and system levels. Content includes tutorials, reviews and surveys of current theoretical/experimental results, design methodologies and applications developed in approximate computing for a wide scope of readership and specialists. Serves as a single-source reference to state-of-the-art of approximate computing; Covers broad range of topics, from circuits to applications; Includes contributions by leading researchers, from academia and industry.
Download or read book Heat Pipes written by Hussam Jouhara and published by Butterworth-Heinemann. This book was released on 2023-10-20 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat Pipes: Theory, Design and Applications, Seventh Edition, takes a highly practical approach to the design and selection of heat pipes, making it an essential guide for practicing engineers and an ideal text for postgraduate students. The expanded author team consolidate and update the theoretical background included in previous editions, and include new sections on recent developments in manufacturing methods, wick design and additional applications. The book serves as an introduction to the theory, design and application of the range of passive, two-phase, heat-transfer devices known as heat pipes, serving as an essential reference for those seeking a sound understanding of the principles of heat pipe technology. It provides an introduction to the basic principles of operation and design data which would permit the reader to design and fabricate a basic heat pipe. It also provides details of the various more complex configurations and designs currently available to assist in selecting such devices.This new edition has been fully updated to reflect the latest research and technologies and includes four brand new chapters on various types of heat pipe, theoretical principles of heat transfer and fluid mechanics, additive manufacturing and heat pipe heat exchangers. - Fully revised with brand new chapters on Additive Manufacturing and Heat Exchangers - Guides the reader through the design and fabrication of a heat pipe - Includes detail on more complex configurations and designs available to assist in the election of devices
Book Synopsis Semiconductor Nanocrystals and Metal Nanoparticles by : Tupei Chen
Download or read book Semiconductor Nanocrystals and Metal Nanoparticles written by Tupei Chen and published by CRC Press. This book was released on 2016-10-14 with total page 732 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor nanocrystals and metal nanoparticles are the building blocks of the next generation of electronic, optoelectronic, and photonic devices. Covering this rapidly developing and interdisciplinary field, the book examines in detail the physical properties and device applications of semiconductor nanocrystals and metal nanoparticles. It begins with a review of the synthesis and characterization of various semiconductor nanocrystals and metal nanoparticles and goes on to discuss in detail their optical, light emission, and electrical properties. It then illustrates some exciting applications of nanoelectronic devices (memristors and single-electron devices) and optoelectronic devices (UV detectors, quantum dot lasers, and solar cells), as well as other applications (gas sensors and metallic nanopastes for power electronics packaging). Focuses on a new class of materials that exhibit fascinating physical properties and have many exciting device applications. Presents an overview of synthesis strategies and characterization techniques for various semiconductor nanocrystal and metal nanoparticles. Examines in detail the optical/optoelectronic properties, light emission properties, and electrical properties of semiconductor nanocrystals and metal nanoparticles. Reviews applications in nanoelectronic devices, optoelectronic devices, and photonic devices.
Download or read book Heat Exchangers written by Jovan Mitrovic and published by BoD – Books on Demand. This book was released on 2012-03-09 with total page 602 pages. Available in PDF, EPUB and Kindle. Book excerpt: Selecting and bringing together matter provided by specialists, this project offers comprehensive information on particular cases of heat exchangers. The selection was guided by actual and future demands of applied research and industry, mainly focusing on the efficient use and conversion energy in changing environment. Beside the questions of thermodynamic basics, the book addresses several important issues, such as conceptions, design, operations, fouling and cleaning of heat exchangers. It includes also storage of thermal energy and geothermal energy use, directly or by application of heat pumps. The contributions are thematically grouped in sections and the content of each section is introduced by summarising the main objectives of the encompassed chapters. The book is not necessarily intended to be an elementary source of the knowledge in the area it covers, but rather a mentor while pursuing detailed solutions of specific technical problems which face engineers and technicians engaged in research and development in the fields of heat transfer and heat exchangers.
Book Synopsis Annual IEEE Semiconductor Thermal Measurement and Management Symposium by :
Download or read book Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by . This book was released on 2005 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Theory and Practice of Thermal Transient Testing of Electronic Components by : Marta Rencz
Download or read book Theory and Practice of Thermal Transient Testing of Electronic Components written by Marta Rencz and published by Springer Nature. This book was released on 2023-01-23 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.
Book Synopsis Physical Design for 3D Integrated Circuits by : Aida Todri-Sanial
Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 409 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Book Synopsis AlGaN/GaN-HEMT power amplifiers with optimized power-added efficiency for X-band applications by : Jutta Kühn
Download or read book AlGaN/GaN-HEMT power amplifiers with optimized power-added efficiency for X-band applications written by Jutta Kühn and published by KIT Scientific Publishing. This book was released on 2011 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: This work has arisen out of the strong demand for a superior power-added efficiency (PAE) of AlGaN/GaN high electron mobility transistor (HEMT) high-power amplifiers (HPAs) that are part of any advanced wireless multifunctional RF-system with limited prime energy. Different concepts and approaches on device and design level for PAE improvements are analyzed, e.g. structural and layout changes of the GaN transistor and advanced circuit design techniques for PAE improvements of GaN HEMT HPAs.
Book Synopsis Encyclopedia of Packaging Materials, Processes, and Mechanics by : Avram Bar-Cohen
Download or read book Encyclopedia of Packaging Materials, Processes, and Mechanics written by Avram Bar-Cohen and published by World Scientific. This book was released on 2019 with total page 1079 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories. The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications"--Publisher's website
Download or read book Advances in Heat Transfer written by and published by Academic Press. This book was released on 2015-10-27 with total page 462 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Heat Transfer fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in traditional journals or texts. The articles, which serve as a broad review for experts in the field are also of great interest to non-specialists who need to keep up-to-date with the results of the latest research. This serial is essential reading for all mechanical, chemical, and industrial engineers working in the field of heat transfer, or in graduate schools or industry. - Compiles the expert opinions of leaders in the industry - Fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in traditional journals or texts - Essential reading for all mechanical, chemical, and industrial engineers working in the field of heat transfer, or in graduate schools or industry
Book Synopsis Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set) by :
Download or read book Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set) written by and published by World Scientific. This book was released on 2014-10-23 with total page 1397 pages. Available in PDF, EPUB and Kindle. Book excerpt: remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
