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Twenty Fourth Annual Ieee Semiconductor Thermal Measurement And Management Symposium
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Book Synopsis Thermal Analysis of Power Electronic Devices Used in Renewable Energy Systems by : Alhussein Albarbar
Download or read book Thermal Analysis of Power Electronic Devices Used in Renewable Energy Systems written by Alhussein Albarbar and published by Springer. This book was released on 2017-07-19 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book analyzes the thermal characteristics of power electronic devices (PEDs) with a focus on those used in wind and solar energy systems. The authors focus on the devices used in such applications, for example boost converters and inverters under different operating conditions. The book explains in detail finite element modeling techniques, setting up measuring systems, data analysis, and PEDs’ lifetime calculations. It is appropriate reading for graduate students and researchers who focus on the design and reliability of power electronic devices.
Book Synopsis Thermal and Electro-thermal System Simulation 2020 by : Márta Rencz
Download or read book Thermal and Electro-thermal System Simulation 2020 written by Márta Rencz and published by MDPI. This book was released on 2021-01-12 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
Download or read book Heat Pipes written by Hussam Jouhara and published by Butterworth-Heinemann. This book was released on 2023-10-20 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat Pipes: Theory, Design and Applications, Seventh Edition, takes a highly practical approach to the design and selection of heat pipes, making it an essential guide for practicing engineers and an ideal text for postgraduate students. The expanded author team consolidate and update the theoretical background included in previous editions, and include new sections on recent developments in manufacturing methods, wick design and additional applications. The book serves as an introduction to the theory, design and application of the range of passive, two-phase, heat-transfer devices known as heat pipes, serving as an essential reference for those seeking a sound understanding of the principles of heat pipe technology. It provides an introduction to the basic principles of operation and design data which would permit the reader to design and fabricate a basic heat pipe. It also provides details of the various more complex configurations and designs currently available to assist in selecting such devices.This new edition has been fully updated to reflect the latest research and technologies and includes four brand new chapters on various types of heat pipe, theoretical principles of heat transfer and fluid mechanics, additive manufacturing and heat pipe heat exchangers. - Fully revised with brand new chapters on Additive Manufacturing and Heat Exchangers - Guides the reader through the design and fabrication of a heat pipe - Includes detail on more complex configurations and designs available to assist in the election of devices
Book Synopsis Annual IEEE Semiconductor Thermal Measurement and Management Symposium by :
Download or read book Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by . This book was released on 2005 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Thermal and Power Management of Integrated Circuits by : Arman Vassighi
Download or read book Thermal and Power Management of Integrated Circuits written by Arman Vassighi and published by Springer Science & Business Media. This book was released on 2006-06-01 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
Book Synopsis Light-Emitting Diode by : Jagannathan Thirumalai
Download or read book Light-Emitting Diode written by Jagannathan Thirumalai and published by BoD – Books on Demand. This book was released on 2018-09-19 with total page 170 pages. Available in PDF, EPUB and Kindle. Book excerpt: The broad vision of this book is to offer book lovers a comprehensive appraisal of topics in the global advancements of experimental facts, instrumentation, and practical applications of LED and OLED materials and their applications. The prime feature of this book is connected with LED and OLED materials approaches of fabrication, optimization limits, and their extensive technical applications. This book is comprised of seven chapters encompassing the importance of LEDs and OLEDs, the history of LEDs and OLEDs with necessary examples, the phototoxic-cum-bactericidal effect due to the usage of blue LED irradiation, DC network indoor and outdoor LED lighting, WLEDs with thermally activated delayed fluorescence emitters, tetradentate cyclometalated platinum (II) complex-based efficient organic LEDs, the impact of the use of large LED lighting loads in low-voltage networks, highly efficient OLEDs using thermally activated delayed fluorescent materials, and AlGaN deep ultraviolet LEDs. Individual chapters provide a base for the wide range of common bibliophiles in diversified fields, students, and researchers, who may conduct research pertinent to this book and will find simply explained basics as well as advanced principles of designated subjects related to these phenomena. The book was created from seven contributions from experts in the diversified fields of LED and OLED fabrication and technology from over 15 research institutes across the globe.
Book Synopsis Green Photonics and Smart Photonics by : Shien-Kuei Liaw
Download or read book Green Photonics and Smart Photonics written by Shien-Kuei Liaw and published by CRC Press. This book was released on 2022-09-01 with total page 259 pages. Available in PDF, EPUB and Kindle. Book excerpt: In recent years, many efforts have been devoted in the study, development and application of Green Photonics and Smart Photonics. This book presents recent advances, both theoretical and applications, reflecting the cutting-edge technologies and research achievements within these research fields.Green Photonics intend to develop photonics technologies that can conserve energy, reduce pollution and create renewable energy. Light emitting diodes (LEDs) and solar cells with the characteristics of sustainable and low energy consumption are addressed in this book. The term of Smart Photonics reflect intelligence of optical and optoelectronic components with high sensitivity, fast response time and/or compact size. The book explores various aspects ofsmart photonics including fiber sensors, optoelectronic devices and waveguide devices. The chapters in this edited book are written by researchers who presented quality papers at the 2015 International Symposium of Next-Generation Electronics (ISNE 2015), which was held in Taipei, Taiwan. The ISNE 2015 provided a common forum in the areas of opto-electron devices, photonics, integrated circuits, and microelectronic systems and technologies. The technical program consisted of 5 plenary talks, 23 invited talks and more than 250 contributed oral and poster presentations. After a rigorous review process, the ISNE 2015 technical program committee has selected 10 outstanding presentations and invited the authors to prepare extended chapters for inclusion in this book. Of the 10 chapters, five focus on the subject of green photonics, and the others cover smart photonics.
Book Synopsis Nanostructured Materials for Electromagnetic Interference Shielding by : Sabu Thomas
Download or read book Nanostructured Materials for Electromagnetic Interference Shielding written by Sabu Thomas and published by CRC Press. This book was released on 2021-11-01 with total page 125 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electromagnetic interference (EMI) shielding materials prevent the transmission of electromagnetic (EM) radiation by reflection and/or absorption or by suppression. Emerging nanomaterials can be used effectively for EMI shielding. This book explores all aspects of EMI materials and focuses on the most recent advances and trends in the synthesis, processing, and characterization of electromagnetic shielding materials. Fundamentals of shielding theory, the practice of electromagnetic field measuring techniques, some of the EMI standards, novel materials employed (like MXenes), and the application of these materials in various fields are discussed. Features: Provides a fundamental overview of EMI shielding and its effects on the environment and other electronics. Includes a comprehensive overview of the sources and effects of EM radiation. Explains the synthesis, characterization methods, and properties of materials used to protect against radiation. Gives insights into the physics of EMI shielding and its associated mechanisms. Examines the current state of the art and new challenges in this area. This book is aimed at researchers and engineers working in the fields of electromagnetic interference shielding, polymer science, materials science, nanotechnology, and other allied subject areas.
Book Synopsis Advanced Materials for Electromagnetic Shielding by : Maciej Jaroszewski
Download or read book Advanced Materials for Electromagnetic Shielding written by Maciej Jaroszewski and published by John Wiley & Sons. This book was released on 2018-11-29 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive review of the field of materials that shield people and sensitive electronic devices from electromagnetic fields Advanced Materials for Electromagnetic Shielding offers a thorough review of the most recent advances in the processing and characterization of the electromagnetic shielding materials. In this groundbreaking book, the authors—noted experts in the field—discuss the fundamentals of shielding theory as well as the practice of electromagnetic field measuring techniques and systems. They also explore applications of shielding materials used as absorbers of electromagnetic radiation, or as magnetic shields and explore coverage of new advanced materials for EMI shielding in aerospace applications. In addition, the text contains methods of preparation and applicability of metal foams. This comprehensive text examines the influence of technology on the micro-and macrostructure of polymers enabling their use in screening technology, technologies of shielding materials based on textiles, and analyses of its effectiveness in screening. The book also details the method of producing nanowires and their applications in EM shielding. This important resource: Explores the burgeoning market of electromagnetic shielding materials as we create, depend upon, and are exposed to more electronic devices than ever Addresses the most comprehensive issues relating to electromagnetic fields Contains information on the manufacturing, characterization methods, and properties of materials used to protect against them Discusses the important characterization techniques compared with one another, thus allowing scientists to select the best approach to a problem Written for materials scientists, electrical and electronics engineers, physicists, and industrial researchers, Advanced Materials for Electromagnetic Shielding explores all aspects in the area of electromagnetic shielding materials and examines the current state-of-the-art and new challenges in this rapidly growing area.
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Book Synopsis Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set) by :
Download or read book Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set) written by and published by World Scientific. This book was released on 2014-10-23 with total page 1397 pages. Available in PDF, EPUB and Kindle. Book excerpt: remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Book Synopsis Knowledge Innovation Through Intelligent Software Methodologies, Tools and Techniques by : H. Fujita
Download or read book Knowledge Innovation Through Intelligent Software Methodologies, Tools and Techniques written by H. Fujita and published by IOS Press. This book was released on 2020-09-30 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: Software methodologies, tools and techniques have become an ever more important part of our lives, and are crucial to the decision-making processes that affect us every day. This book presents papers from the 19th International Conference on New Trends in Intelligent Software Methodology Tools, and Techniques (SoMeT20), held in Kitakyushu, Japan from 22–24 September 2020. The SoMeT conferences bring together researchers and practitioners to share their original research results and experience of practical developments in software science and related new technologies, and this book explores new trends and theories that highlight the direction and development of intelligent software methodologies, tools and techniques. It covers newly developed techniques, enhanced methodologies, software related solutions and recently developed tools, as well as indicating the direction of future research, and the 40 revised papers included here have been selected by the SoMeT20 international reviewing committee on the basis of technical soundness, relevance, originality, significance, and clarity. The book is divided into 5 chapters: artificial intelligence techniques on software engineering, and requirement engineering; software methods for informatics, medical informatics and bio-medicine applications; applied software tools, techniques and related software engineering models; intelligent-software systems design, software quality, software evolution and validation techniques; and knowledge science and intelligent computing. Providing an overview of the state-of-the-art in software science and its supporting technology, this book will be of interest to all those working in the field.
Book Synopsis Three Dimensional System Integration by : Antonis Papanikolaou
Download or read book Three Dimensional System Integration written by Antonis Papanikolaou and published by Springer Science & Business Media. This book was released on 2010-12-07 with total page 251 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Book Synopsis Area Array Interconnection Handbook by : Karl J. Puttlitz
Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2001 with total page 1262 pages. Available in PDF, EPUB and Kindle. Book excerpt: Presents the geography, history, people, places, and economy of Tennessee.
Book Synopsis Reliability of Organic Compounds in Microelectronics and Optoelectronics by : Willem Dirk van Driel
Download or read book Reliability of Organic Compounds in Microelectronics and Optoelectronics written by Willem Dirk van Driel and published by Springer Nature. This book was released on 2022-01-31 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
Book Synopsis Boundary Elements and other Mesh Reduction Methods XLIV by : A. H.-D. Cheng
Download or read book Boundary Elements and other Mesh Reduction Methods XLIV written by A. H.-D. Cheng and published by WIT Press. This book was released on 2021-08-31 with total page 174 pages. Available in PDF, EPUB and Kindle. Book excerpt: The maturity of BEM over the last few decades has resulted in a substantial number of industrial applications of the method; this demonstrates its accuracy, robustness and ease of use. The range of applications still needs to be widened, taking into account the potentialities of the Mesh Reduction techniques in general. Theoretical developments and new formulations have been reported over the last few decades, helping to expand the range of boundary elements and other mesh reduction methods (BEM/MRM) applications as well as the type of modelled materials in response to the requirements of contemporary industrial and professional environments. As design, analysis and manufacture become more integrated, the chances are that software users will be less aware of the capabilities of the analytical techniques that are at the core of the process. This reinforces the need to retain expertise in certain specialised areas of numerical methods, such as BEM/MRM, to ensure that all new tools perform satisfactorily within the aforementioned integrated process. The papers included were presented at the 44th International Conference on Boundary Elements and other Mesh Reduction Methods and report advances in techniques that reduce or eliminate the type of meshes associated with finite elements or finite differences.
Book Synopsis Theory and Practice of Thermal Transient Testing of Electronic Components by : Marta Rencz
Download or read book Theory and Practice of Thermal Transient Testing of Electronic Components written by Marta Rencz and published by Springer Nature. This book was released on 2023-01-23 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.
