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Transient Analysis Of Coupled Transmission Lines Using Scattering Parameter Based Macromodel
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Book Synopsis Transient Analysis of Coupled Transmission Lines Using Scattering Parameter Based Macromodel by : Jimmy Shinn-Hwa Wang
Download or read book Transient Analysis of Coupled Transmission Lines Using Scattering Parameter Based Macromodel written by Jimmy Shinn-Hwa Wang and published by . This book was released on 1994 with total page 32 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Transient Analysis of Coupled Transmission Lines Characterized with Frequency-dependent Losses Or Measured Scattering-parameter Data and Optimal Design of Self-damped Interconnects by : Jimmy Shinn-Hwa Wang
Download or read book Transient Analysis of Coupled Transmission Lines Characterized with Frequency-dependent Losses Or Measured Scattering-parameter Data and Optimal Design of Self-damped Interconnects written by Jimmy Shinn-Hwa Wang and published by . This book was released on 1995 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Scattering Parameter Based Macromodel for Transient Analysis of Interconnect Networks with Nonlinear Terminations by : Haifang Liao
Download or read book Scattering Parameter Based Macromodel for Transient Analysis of Interconnect Networks with Nonlinear Terminations written by Haifang Liao and published by . This book was released on 1995 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis A Novel Approach for the Transient Simulation of the Coupled Transmission Lines Characterized with the Frequency-dependent Losses Using Scattering-Parameter Based Macromodel by : Jimmy Shinn-Hwa Wang
Download or read book A Novel Approach for the Transient Simulation of the Coupled Transmission Lines Characterized with the Frequency-dependent Losses Using Scattering-Parameter Based Macromodel written by Jimmy Shinn-Hwa Wang and published by . This book was released on 1994 with total page 32 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Transient Analysis of Interconnect Networks Characterized by Measuring Scattering-parameter Data by : Jimmy Shinn-Hwa Wang
Download or read book Transient Analysis of Interconnect Networks Characterized by Measuring Scattering-parameter Data written by Jimmy Shinn-Hwa Wang and published by . This book was released on 1995 with total page 32 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electrical Performance of Electronic Packaging by :
Download or read book Electrical Performance of Electronic Packaging written by and published by . This book was released on 2004 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Scattering Parameter Transient Analysis of Interconnect Networks with Nonlinear Terminations Using Recursive Convolution by : Haifang Liao
Download or read book Scattering Parameter Transient Analysis of Interconnect Networks with Nonlinear Terminations Using Recursive Convolution written by Haifang Liao and published by . This book was released on 1993 with total page 22 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 1995 IEEE International Conference on Computer Design by :
Download or read book 1995 IEEE International Conference on Computer Design written by and published by . This book was released on 1995 with total page 744 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings written by and published by . This book was released on 1997 with total page 828 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Low Power VLSI Design and Technology by : Gary K. Yeap
Download or read book Low Power VLSI Design and Technology written by Gary K. Yeap and published by World Scientific. This book was released on 1996 with total page 136 pages. Available in PDF, EPUB and Kindle. Book excerpt: Low-power and low-energy VLSI has become an important issue in today's consumer electronics.This book is a collection of pioneering applied research papers in low power VLSI design and technology.A comprehensive introductory chapter presents the current status of the industry and academic research in the area of low power VLSI design and technology.Other topics cover logic synthesis, floorplanning, circuit design and analysis, from the perspective of low power requirements.The readers will have a sampling of some key problems in this area as the low power solutions span the entire spectrum of the design process. The book also provides excellent references on up-to-date research and development issues with practical solution techniques.
Book Synopsis Electrical Modeling and Design for 3D System Integration by : Er-Ping Li
Download or read book Electrical Modeling and Design for 3D System Integration written by Er-Ping Li and published by John Wiley & Sons. This book was released on 2012-03-19 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
Book Synopsis Sensitivity Analysis Based on Scattering Parameter Macromodel by : Yanhua Sun
Download or read book Sensitivity Analysis Based on Scattering Parameter Macromodel written by Yanhua Sun and published by . This book was released on 1995 with total page 88 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Extracting Time-of-flight Delay from Scattering Parameter Based Macromodel by : Haifang Liao
Download or read book Extracting Time-of-flight Delay from Scattering Parameter Based Macromodel written by Haifang Liao and published by . This book was released on 1993 with total page 18 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :IEEE Circuits and Systems Society Publisher :Institute of Electrical & Electronics Engineers(IEEE) ISBN 13 : Total Pages :778 pages Book Rating :4.:/5 (318 download)
Book Synopsis 31st ACM/IEEE Design Automation Conference by : IEEE Circuits and Systems Society
Download or read book 31st ACM/IEEE Design Automation Conference written by IEEE Circuits and Systems Society and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1994 with total page 778 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electrical & Electronics Abstracts by :
Download or read book Electrical & Electronics Abstracts written by and published by . This book was released on 1997 with total page 2240 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Index to IEEE Publications by : Institute of Electrical and Electronics Engineers
Download or read book Index to IEEE Publications written by Institute of Electrical and Electronics Engineers and published by . This book was released on 1995 with total page 1318 pages. Available in PDF, EPUB and Kindle. Book excerpt: Issues for 1973- cover the entire IEEE technical literature.
Book Synopsis Dissertation Abstracts International by :
Download or read book Dissertation Abstracts International written by and published by . This book was released on 2007 with total page 924 pages. Available in PDF, EPUB and Kindle. Book excerpt:
