Thin-film Inductors for Multi-megaherts Power Conversion

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ISBN 13 :
Total Pages : 392 pages
Book Rating : 4.:/5 (843 download)

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Book Synopsis Thin-film Inductors for Multi-megaherts Power Conversion by : Jizheng Qiu

Download or read book Thin-film Inductors for Multi-megaherts Power Conversion written by Jizheng Qiu and published by . This book was released on 2013 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Magnetic components are required in most efficient dc-dc power converters. Power converters using a switching frequency in the multi-megahertz range (1-100 MHz) have been developed for miniaturization. However, the high switching frequency involves challenges in circuit and magnetic component design. Air-core inductors are used in most high-frequency converters. Howerver, magnetic-core inductors are sitll attractive because they provide the opportunity to miniaturize the inductor size while maintaining low loss, whereas air-core inductors require substantial thickness to obtain good performance. Advanced magnetic materials are required for magnetic-core inductors to operate efficiently in the high frequency range. Miniaturized thin-film power inductors for high-frequency dc-dc power conversion are investigated. Co-Zr-O, an advanced nanogranular thin-film magnetic material, exhibits high saturation flux density (>1 T), high resistivity, and low hysteresis loss. Low-profile thin-film inductors with this advanced magnetic material are expected to demonstrate high power density and high efficiency, and be suitable for multi-megahertz power applications. A high-frequency resistivity measurement method is developed to better predict the loss in multilayer thin-film magnetic material for inductor design. Two types of microfabricated inductors are investigated: a "pot-cor" inductor which has two magnetic layers surrounding the winding layer in the middle, and a toroidal inductor which has two conductor layers surrounding the magnetic layer in the middle. A new category of anisotropic thin-film magnetic material, named radially anisotropic magnetic material, with a radial easy axis and circumferential hard axis, is introduced and developed to be used in thin-film toroidal inductors. Loss models, inductor design methods, co-optimization of magnetics with circuits, fabrication, and measurements are studied in this thesis."

Microfabricated Thin-film Inductors for High-frequency DC-DC Power Conversion

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ISBN 13 :
Total Pages : 230 pages
Book Rating : 4.:/5 (74 download)

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Book Synopsis Microfabricated Thin-film Inductors for High-frequency DC-DC Power Conversion by : Di Yao

Download or read book Microfabricated Thin-film Inductors for High-frequency DC-DC Power Conversion written by Di Yao and published by . This book was released on 2011 with total page 230 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Micro-fabricated Racetrack Inductors with Thin-film Magnetic Cores for On-chip Power Conversion

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ISBN 13 :
Total Pages : 288 pages
Book Rating : 4.:/5 (881 download)

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Book Synopsis Micro-fabricated Racetrack Inductors with Thin-film Magnetic Cores for On-chip Power Conversion by : Daniel Vincent Harburg

Download or read book Micro-fabricated Racetrack Inductors with Thin-film Magnetic Cores for On-chip Power Conversion written by Daniel Vincent Harburg and published by . This book was released on 2014 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt: The accelerating trend to miniaturize electronic systems and devices is placing large demands on the components responsible for delivering electrical power to these systems. Most power conversion circuits require magnetic components (inductors and transformers) in order to operate at high efficiencies; these components, however, have not yet been widely miniaturized and integrated with electronic components that are fabricated in a CMOS process and are most often realized as discrete off-chip components. Improved on-chip inductors are therefore required to realize a monolithic Power Supply On-Chip (PwrSoC) for electronic systems where size and efficiency are of critical importance. This thesis presents design, modeling, optimization, and micro-fabrication techniques for building chip-scale racetrack power inductors with thin-film magnetic cores. Our inductors are designed for high-power-density and high efficiency dc-dc converters which transfer 25 W of power at frequencies between 5 and 30 MHz. The dc-dc converter is designed to serve as a high-input-voltage solid-state lighting driver. Magnetic components on silicon substrates with sputtered Co-Zr-O magnetic cores are optimized using a series of models that characterize each inductor loss mechanism. The optimized designs were fabricated and tested at small-signal levels and in the high-frequency power converter. The converter achieves an 89% conversion efficiency at 5 MHz with an inductor power density of 1 W/mm2 of substrate area. Small-signal measurements of the inductors are compared with modeled predictions to validate the design optimization approach. Fabricated components achieve inductance values of 1.2 [mu]H and peak quality factors of 15.1 at 8.3 MHz.

Multi-Wafer Rotating MEMS Machines

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Publisher : Springer Science & Business Media
ISBN 13 : 0387777474
Total Pages : 469 pages
Book Rating : 4.3/5 (877 download)

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Book Synopsis Multi-Wafer Rotating MEMS Machines by : Jeffrey Lang

Download or read book Multi-Wafer Rotating MEMS Machines written by Jeffrey Lang and published by Springer Science & Business Media. This book was released on 2009-09-18 with total page 469 pages. Available in PDF, EPUB and Kindle. Book excerpt: The collaboration and research that was developed to produce the MIT Gas Turbine Engine are described in this book. Both the engine and generator are fabricated from silicon using a combination of bulk and surface microfabrication technologies. The book discusses the technical details that have gone into producing the engine and the overall systems-level tradeoffs, in particular its motor compressors and turbine generators, and the decisions that have been made.

Power Electronics Technology and Applications II

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Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 608 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis Power Electronics Technology and Applications II by : Fred C. Lee

Download or read book Power Electronics Technology and Applications II written by Fred C. Lee and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1997 with total page 608 pages. Available in PDF, EPUB and Kindle. Book excerpt: A sequel to Power Electronics Technology and Applications, this text is targeted specifically towards the needs of practicing design engineers. The focus is to provide the practicing engineer with up-to-date technology and emerging applications.

Three-Dimensional Integrated Circuit Design

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Publisher : Springer Science & Business Media
ISBN 13 : 144190784X
Total Pages : 292 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis Three-Dimensional Integrated Circuit Design by : Yuan Xie

Download or read book Three-Dimensional Integrated Circuit Design written by Yuan Xie and published by Springer Science & Business Media. This book was released on 2009-12-02 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).

Integrated Magnetics for Future DC-DC Microprocessor Power Delivery

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Publisher :
ISBN 13 :
Total Pages : 288 pages
Book Rating : 4.:/5 (795 download)

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Book Synopsis Integrated Magnetics for Future DC-DC Microprocessor Power Delivery by : Brice Jamieson

Download or read book Integrated Magnetics for Future DC-DC Microprocessor Power Delivery written by Brice Jamieson and published by . This book was released on 2010 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated, switched-mode DC-DC converters are becoming widely adopted for in-package or on-chip power supply applications, however a limiting factor in their development is the relatively large size of passive components which are necessary in such a converter. By increasing the switching frequency above 100 MHz, a significant reduction in the inductance necessary for such a converter may be achieved and as a result a dramatic reduction in micro-inductor sizes may be afforded. Although considerable work has been done in the field of high-frequency micro-inductors on silicon, most of these devices have attempted to increase the inductance of such a structure at the expense of current-handling capacity, resulting in a low-power device. High-power micro-inductors, additionally, have only recently achieved a 100 Mhz operation frequency at the expense of significant losses in the thin-film magnetic enhancement layers used in these structures. If a high-power device is to successfully operate at 100 MHz with low loss, a combination of improved device design and novel magnetic thin-films is necessary. The goal of this work is to define the parameters of a high-frequency, power micro-inductor suitable for integration into an on-chip power conversion module. To achieve this goal, device and material models were developed for the first time to characterise these devices. Magnetic thin-films were characterized to ascertain the suitability of an electrodeposited thin-film as a replacement for RF-sputtered materials, desirable for the ability of an electrodeposited material to be plated in conformally thicker layers to achieve the required power density. Thin-film models were developed to extend the high-frequency permeability spectrum to account for the conductive seed layer present in an electrodeposited thin-film and the effects of shape and material thickness on anisotropy and permeability were modelled. These material models were verified against experimentally measured thin-films and determined to accurately predict the parameters of a thin-film material when it is integrated into a bounded geometry such as would be present in a micro-inductor. Device models were developed which analyze the inductance and loss in a micro-inductor structure, taking into account the shape-dependent anisotropy model and the presence of magnetic core-closure structures deposited to close the flux path between magnetic planes in a structure. The presence of gap in these core-closures is also considered which considers the cases of a non-magnetic and a magnetic gap. These models were verified against finite-element analysis as well as against fabricated micro-inductors. Finally, optimised stripline micro-inductors were fabricated and characterised for high-current and for high-frequency operation. Comparing these devices to the values expected from the device model, it is seen that the effects of shape and thickness predicted by the analytic models are seen in the fabricated structures, as well as a dependency of these on the magnitude of the AC current through the micro-inductors.

Improving the Performance of Passive Components of the Power Electronics at High Switching Frequency

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ISBN 13 :
Total Pages : 154 pages
Book Rating : 4.5/5 (381 download)

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Book Synopsis Improving the Performance of Passive Components of the Power Electronics at High Switching Frequency by : Abdulrhman Alshaabani

Download or read book Improving the Performance of Passive Components of the Power Electronics at High Switching Frequency written by Abdulrhman Alshaabani and published by . This book was released on 2021 with total page 154 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power converters have an important role in modern electric and electronic systems due to different voltage and power level requirements. Magnetic components are considered to be essential elements of the power converters. Storing the energy, filtering the signal, and transferring the energy are the main tasks of the magnetic components in the power converters. With developing the technology of power switches, the power converter can be operated at high frequencies. However, the magnetic components are suffering from their parasitic capacitance at high frequencies. Modeling the parasitic capacitance of the magnetic components is crucial to design power converters at high frequency. To date, the researches that have been conducted to modeling the parasitic capacitance have mainly targeted the low power applications with very high frequencies and high power with multi-layer transformers. Consequently, there remains a blank in the body of knowledge regarding modeling the parasitic capacitance of a single-layer inductor with a magnetic core at medium power. The relation between the number of turns and the parasitic capacitance of the single-layer inductors with the magnetic core should be considered. Moreover, improving the magnetic components by reducing parasitic capacitance is essential. By using the technique of reducing the parasitic capacitance, the resonant frequency of the magnetic components can be shifted to a higher frequency besides improving the impedance of the inductor. Therefore, this dissertation contributes in four main parts: (1) Modeling the parasitic capacitance of a single-layer inductor with a magnetic core. (2) Reducing the parasitic capacitance using the technique of magnetic coupling. (3) Selecting the appropriate range of high operating frequency for power converter applications. (4) Estimating the parasitic capacitance of interleaved coupled two-phase inductors.For the first part, a new approach to determining the total parasitic capacitance of a single-layer inductor with the magnetic core at a medium frequency range that is below the first resonant frequency is presented in this research. The proposed analytical approach can obtain the parasitic capacitance between the winding and core based on the physical structure of the inductor. The analytical approach depends on approximating the rod wire shape to a square shape. The total equivalent parasitic capacitance is derived. The results are verified by finite element analysis and experimental measurements using an impedance network analyzer.The second part of this research presents a technique for improving the performance of an inductor at high frequencies through mitigating effects caused by the parasitic capacitance. This technique adds a small capacitor to the coupled windings of the inductor to reduce the parasitic capacitance of the inductor. The relationship between the parasitic capacitance, magnetic coupling coefficient, and the small capacitor is introduced. The method to size the reduction capacitor is detailed in this research. The results of applying this technique show an improvement in the inductance impedance by 40 dB and shifting the resonant frequency to a higher frequency when ? = 0.97. The experimental results validated the effectiveness of the proposed technique. Moreover, a new methodology to properly select the highest operating frequency for the magnetic components in power electronics devices is presented in this research. Several parameters of the magnetic components such as the resonant frequency and the losses of the magnetic core are taken under consideration. The results of this methodology prove the maintaining the efficiency with reducing the volume of the magnetic core by 70%.Finally, the parasitic capacitance of the interleaved two-phase coupled-inductors is introduced in this research. Besides estimating the parasitic capacitance, the method of determining the size of the interleaved two-phase coupled inductors of boost converter is explained. The result shows the reduction of the size of the two-phase coupled inductors by using the proposed selecting suitable high operating frequency methodology. Moreover, the efficiency of the interleaved coupled inductors boost converter is maintained with reducing the volume by 60% and increasing the operating frequency by doubling the frequency.

Integrated Inductors with Micro-patterned Magnetic Thin Films for RF and Power Applications

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ISBN 13 :
Total Pages : 73 pages
Book Rating : 4.:/5 (875 download)

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Book Synopsis Integrated Inductors with Micro-patterned Magnetic Thin Films for RF and Power Applications by : Hao Wu

Download or read book Integrated Inductors with Micro-patterned Magnetic Thin Films for RF and Power Applications written by Hao Wu and published by . This book was released on 2013 with total page 73 pages. Available in PDF, EPUB and Kindle. Book excerpt: With increasing demand for System on Chip (SoC) and System in Package (SiP) design in computer and communication technologies, integrated inductor which is an essential passive component has been widely used in numerous integrated circuits (ICs) such as in voltage regulators and RF circuits. In this work, soft ferromagnetic core material, amorphous Co-Zr-Ta-B, was incorporated into on-chip and in-package inductors in order to scale down inductors and improve inductors performance in both inductance density and quality factor. With two layers of 500 nm Co-Zr-Ta-B films a 3.5X increase in inductance and a 3.9X increase in quality factor over inductors without magnetic films were measured at frequencies as high as 1 GHz. By laminating technology, up to 9.1X increase in inductance and more than 5X increase in quality factor (Q) were obtained from stripline inductors incorporated with 50 nm by 10 laminated films with a peak Q at 300 MHz. It was also demonstrated that this peak Q can be pushed towards high frequency as far as 1GHz by a combination of patterning magnetic films into fine bars and laminations. The role of magnetic vias in magnetic flux and eddy current control was investigated by both simulation and experiment using different patterning techniques and by altering the magnetic via width. Finger-shaped magnetic vias were designed and integrated into on-chip RF inductors improving the frequency of peak quality factor from 400 MHz to 800 MHz without sacrificing inductance enhancement. Eddy current and magnetic flux density in different areas of magnetic vias were analyzed by HFSS 3D EM simulation. With optimized magnetic vias, high frequency response of up to 2 GHz was achieved. Furthermore, the effect of applied magnetic field on on-chip inductors was investigated for high power applications. It was observed that as applied magnetic field along the hard axis (HA) increases, inductance maintains similar value initially at low fields, but decreases at larger fields until the magnetic films become saturated. The high frequency quality factor showed an opposite trend which is correlated to the reduction of ferromagnetic resonant absorption in the magnetic film. In addition, experiments showed that this field-dependent inductance change varied with different patterned magnetic film structures, including bars/slots and fingers structures. Magnetic properties of Co-Zr-Ta-B films on standard organic package substrates including ABF and polyimide were also characterized. Effects of substrate roughness and stress were analyzed and simulated which provide strategies for integrating Co-Zr-Ta-B into package inductors and improving inductors performance. Stripline and spiral inductors with Co-Zr-Ta-B films were fabricated on both ABF and polyimide substrates. Maximum 90% inductance increase in hundreds MHz frequency range were achieved in stripline inductors which are suitable for power delivery applications. Spiral inductors with Co-Zr-Ta-B films showed 18% inductance increase with quality factor of 4 at frequency up to 3 GHz.

Design and Optimisation of Micro-fabricated Inductors for High-frequency Power Converters

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Publisher :
ISBN 13 :
Total Pages : 241 pages
Book Rating : 4.:/5 (795 download)

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Book Synopsis Design and Optimisation of Micro-fabricated Inductors for High-frequency Power Converters by : Ronan Thomas Meere

Download or read book Design and Optimisation of Micro-fabricated Inductors for High-frequency Power Converters written by Ronan Thomas Meere and published by . This book was released on 2010 with total page 241 pages. Available in PDF, EPUB and Kindle. Book excerpt: Trends in the miniaturisation of electronic products, especially in the portable products area, has sparked considerable interest in the miniaturisation of the energy processing electronics i.e. the power conversion circuits such as the switched mode power supply (SMPS). Unlike digital electronics which have benefited from miniaturisation and integration in microelectronics, power conversion electronics have not significantly reduced in size. This is directly due to the fact that power conversion requires energy storage components such as inductors and capacitors. The value of the inductors and capacitors required can be reduced if the switching frequency of the power converter is increased. In order to miniaturise the power converter, the switching frequency must be increased so that passive components can be miniaturised and integrated. Traditionally the inductive components have been difficult to integrate on chip. This work focused on the design and fabrication of integrated inductors-on-silicon for very high frequency power conversion (20 {u2013} 100 MHz). Initially an analytical model for micro-inductors which was developed in previous work was used to design inductors for operation up to 20 MHz. The designs selected for fabrication had a footprint area between 5 {u2013} 9 mm2 and a predicted device efficiency of 90% and above. These models were validated by finite element analysis before fabrication. The fabricated prototypes displayed a low loss of inductance to 20 MHz and current handling ability to 0.5 A. The micro-inductors were then interfaced with a high frequency dc-dc converter (20 {u2013} 100 MHz) developed by NXP Semiconductor, and achieved an inductor efficiency of 93% at 20 MHz. The maximum converter efficiency with the micro-inductor was measured to be 78.5%, which to date is highest quoted inductor-on-silicon device efficiency in a converter application at 20 MHz. Circuit equivalent lumped-element models of the micro-inductor for use in circuit simulation software were also developed. This equivalent circuit model includes elements such as capacitance, which are not accounted for in the previously developed analytical model. The initial micro-inductor devices performance was found to be comparable to commercial chip inductors for inductor efficiency when used in a converter. However, if the micro-inductor technology is to compete as a viable alternative to commercial devices, it needed to reduce its footprint area dramatically. This was achieved by using an optimisation software engine to find the inductor designs with maximum efficiency for a given footprint area. The footprint of these optimised devices ranged from 0.5 {u2013} 2.5 mm2 for a range of inductances to 200 nH. A range of optimised devices were fabricated and the measured optimised devices displayed a low loss of inductance to tens of MHz and good current handling capability. However, measured dc resistance was found to be substantially higher than design, due to issues in the fabrication process. The fabricated inductors also highlighted the trade-offs that are introduced in micro-inductor performance vs. footprint area. This design trade-off was also reflected in micro-inductor performance in a converter. An optimised 2.5 mm2 area device was tested in a dc-dc converter at 20 MHz, which resulted in a slightly lower peak micro-inductor efficiency of 90.5% than the previous larger devices. The fabricated optimised micro-inductors achieve an inductance density (inductance per unit area) ranging from 66 - 110 nH/mm2 and display current handling ability of 500mA for the 2.5 mm2, 250mA for the 1.3 mm2 and 150mA for the 0.5 mm2 area device. For inductors aimed at power conversion applications, this work shows a significant improvement to what is reported in literature - in high frequency operation to tens of MHz, inductance density and current handling.

GaN Transistors for Efficient Power Conversion

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Publisher : John Wiley & Sons
ISBN 13 : 1119594421
Total Pages : 470 pages
Book Rating : 4.1/5 (195 download)

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Book Synopsis GaN Transistors for Efficient Power Conversion by : Alex Lidow

Download or read book GaN Transistors for Efficient Power Conversion written by Alex Lidow and published by John Wiley & Sons. This book was released on 2019-08-12 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt: An up-to-date, practical guide on upgrading from silicon to GaN, and how to use GaN transistors in power conversion systems design This updated, third edition of a popular book on GaN transistors for efficient power conversion has been substantially expanded to keep students and practicing power conversion engineers ahead of the learning curve in GaN technology advancements. Acknowledging that GaN transistors are not one-to-one replacements for the current MOSFET technology, this book serves as a practical guide for understanding basic GaN transistor construction, characteristics, and applications. Included are discussions on the fundamental physics of these power semiconductors, layout, and other circuit design considerations, as well as specific application examples demonstrating design techniques when employing GaN devices. GaN Transistors for Efficient Power Conversion, 3rd Edition brings key updates to the chapters of Driving GaN Transistors; Modeling, Simulation, and Measurement of GaN Transistors; DC-DC Power Conversion; Envelope Tracking; and Highly Resonant Wireless Energy Transfer. It also offers new chapters on Thermal Management, Multilevel Converters, and Lidar, and revises many others throughout. Written by leaders in the power semiconductor field and industry pioneers in GaN power transistor technology and applications Updated with 35% new material, including three new chapters on Thermal Management, Multilevel Converters, Wireless Power, and Lidar Features practical guidance on formulating specific circuit designs when constructing power conversion systems using GaN transistors A valuable resource for professional engineers, systems designers, and electrical engineering students who need to fully understand the state-of-the-art GaN Transistors for Efficient Power Conversion, 3rd Edition is an essential learning tool and reference guide that enables power conversion engineers to design energy-efficient, smaller, and more cost-effective products using GaN transistors.

Proceedings

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ISBN 13 :
Total Pages : 424 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Proceedings by :

Download or read book Proceedings written by and published by . This book was released on 2004 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Power Systems-On-Chip

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Publisher : John Wiley & Sons
ISBN 13 : 1119377684
Total Pages : 346 pages
Book Rating : 4.1/5 (193 download)

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Book Synopsis Power Systems-On-Chip by : Bruno Allard

Download or read book Power Systems-On-Chip written by Bruno Allard and published by John Wiley & Sons. This book was released on 2016-11-22 with total page 346 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book gathers the major issues involved in the practical design of Power Management solutions in wireless products as Internet-of-things. Presentation is not about state-of-the-art but about appropriation of validated recent technologies by practicing engineers. The book delivers insights on major trade-offs and a presentation of examples as a cookbook. The content is segmented in chapters to make access easier for the lay-person.

Science Abstracts

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ISBN 13 :
Total Pages : 1990 pages
Book Rating : 4.3/5 (243 download)

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Book Synopsis Science Abstracts by :

Download or read book Science Abstracts written by and published by . This book was released on 1995 with total page 1990 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Electrical & Electronics Abstracts

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ISBN 13 :
Total Pages : 1948 pages
Book Rating : 4.3/5 (243 download)

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Book Synopsis Electrical & Electronics Abstracts by :

Download or read book Electrical & Electronics Abstracts written by and published by . This book was released on 1997 with total page 1948 pages. Available in PDF, EPUB and Kindle. Book excerpt:

IEICE Transactions on Electronics

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ISBN 13 :
Total Pages : 428 pages
Book Rating : 4.:/5 (31 download)

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Book Synopsis IEICE Transactions on Electronics by :

Download or read book IEICE Transactions on Electronics written by and published by . This book was released on 2008 with total page 428 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Materials for Advanced Packaging

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Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 974 pages
Book Rating : 4.3/5 (194 download)

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Book Synopsis Materials for Advanced Packaging by : Daniel Lu

Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.