Thermo Mechanical Stress Analysis And Interfacial Reliability For Through Silicon Vias In Three Dimensional Interconnect Structures

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Carbon Nanotubes for Interconnects

Author : Aida Todri-Sanial
Publisher : Springer
ISBN 13 : 3319297465
Total Pages : 340 pages
Book Rating : 4.3/5 (192 download)

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Book Synopsis Carbon Nanotubes for Interconnects by : Aida Todri-Sanial

Download or read book Carbon Nanotubes for Interconnects written by Aida Todri-Sanial and published by Springer. This book was released on 2016-07-09 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

Strain-Engineered MOSFETs

Author : C.K. Maiti
Publisher : CRC Press
ISBN 13 : 1466503475
Total Pages : 311 pages
Book Rating : 4.4/5 (665 download)

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Book Synopsis Strain-Engineered MOSFETs by : C.K. Maiti

Download or read book Strain-Engineered MOSFETs written by C.K. Maiti and published by CRC Press. This book was released on 2018-10-03 with total page 311 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently strain engineering is the main technique used to enhance the performance of advanced silicon-based metal-oxide-semiconductor field-effect transistors (MOSFETs). Written from an engineering application standpoint, Strain-Engineered MOSFETs introduces promising strain techniques to fabricate strain-engineered MOSFETs and to methods to assess the applications of these techniques. The book provides the background and physical insight needed to understand new and future developments in the modeling and design of n- and p-MOSFETs at nanoscale. This book focuses on recent developments in strain-engineered MOSFETS implemented in high-mobility substrates such as, Ge, SiGe, strained-Si, ultrathin germanium-on-insulator platforms, combined with high-k insulators and metal-gate. It covers the materials aspects, principles, and design of advanced devices, fabrication, and applications. It also presents a full technology computer aided design (TCAD) methodology for strain-engineering in Si-CMOS technology involving data flow from process simulation to process variability simulation via device simulation and generation of SPICE process compact models for manufacturing for yield optimization. Microelectronics fabrication is facing serious challenges due to the introduction of new materials in manufacturing and fundamental limitations of nanoscale devices that result in increasing unpredictability in the characteristics of the devices. The down scaling of CMOS technologies has brought about the increased variability of key parameters affecting the performance of integrated circuits. This book provides a single text that combines coverage of the strain-engineered MOSFETS and their modeling using TCAD, making it a tool for process technology development and the design of strain-engineered MOSFETs.

Design for Manufacturability

Author : Artur Balasinski
Publisher : Springer Science & Business Media
ISBN 13 : 1461417619
Total Pages : 283 pages
Book Rating : 4.4/5 (614 download)

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Book Synopsis Design for Manufacturability by : Artur Balasinski

Download or read book Design for Manufacturability written by Artur Balasinski and published by Springer Science & Business Media. This book was released on 2013-10-05 with total page 283 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

Author : Sung Kyu Lim
Publisher : Springer Science & Business Media
ISBN 13 : 1441995420
Total Pages : 573 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis Design for High Performance, Low Power, and Reliable 3D Integrated Circuits by : Sung Kyu Lim

Download or read book Design for High Performance, Low Power, and Reliable 3D Integrated Circuits written by Sung Kyu Lim and published by Springer Science & Business Media. This book was released on 2012-11-27 with total page 573 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.

Through Silicon Vias

Author : Brajesh Kumar Kaushik
Publisher : CRC Press
ISBN 13 : 131535179X
Total Pages : 165 pages
Book Rating : 4.3/5 (153 download)

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Book Synopsis Through Silicon Vias by : Brajesh Kumar Kaushik

Download or read book Through Silicon Vias written by Brajesh Kumar Kaushik and published by CRC Press. This book was released on 2016-11-30 with total page 165 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

More than Moore Technologies for Next Generation Computer Design

Author : Rasit O. Topaloglu
Publisher : Springer
ISBN 13 : 1493921630
Total Pages : 225 pages
Book Rating : 4.4/5 (939 download)

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Book Synopsis More than Moore Technologies for Next Generation Computer Design by : Rasit O. Topaloglu

Download or read book More than Moore Technologies for Next Generation Computer Design written by Rasit O. Topaloglu and published by Springer. This book was released on 2015-02-09 with total page 225 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore's Law”. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.

3D Microelectronic Packaging

Author : Yan Li
Publisher : Springer
ISBN 13 : 3319445863
Total Pages : 465 pages
Book Rating : 4.3/5 (194 download)

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Book Synopsis 3D Microelectronic Packaging by : Yan Li

Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer. This book was released on 2017-01-20 with total page 465 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

Metrology and Diagnostic Techniques for Nanoelectronics

Author : Zhiyong Ma
Publisher : CRC Press
ISBN 13 : 135173394X
Total Pages : 889 pages
Book Rating : 4.3/5 (517 download)

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Book Synopsis Metrology and Diagnostic Techniques for Nanoelectronics by : Zhiyong Ma

Download or read book Metrology and Diagnostic Techniques for Nanoelectronics written by Zhiyong Ma and published by CRC Press. This book was released on 2017-03-27 with total page 889 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.

More-than-Moore Devices and Integration for Semiconductors

Author : Francesca Iacopi
Publisher : Springer Nature
ISBN 13 : 3031216105
Total Pages : 271 pages
Book Rating : 4.0/5 (312 download)

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Book Synopsis More-than-Moore Devices and Integration for Semiconductors by : Francesca Iacopi

Download or read book More-than-Moore Devices and Integration for Semiconductors written by Francesca Iacopi and published by Springer Nature. This book was released on 2023-02-17 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.

Small Scale Deformation using Advanced Nanoindentation Techniques

Author : Ting Tsui
Publisher : MDPI
ISBN 13 : 303897966X
Total Pages : 168 pages
Book Rating : 4.0/5 (389 download)

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Book Synopsis Small Scale Deformation using Advanced Nanoindentation Techniques by : Ting Tsui

Download or read book Small Scale Deformation using Advanced Nanoindentation Techniques written by Ting Tsui and published by MDPI. This book was released on 2019-06-11 with total page 168 pages. Available in PDF, EPUB and Kindle. Book excerpt: Small scale mechanical deformations have gained a significant interest over the past few decades, driven by the advances in integrated circuits and microelectromechanical systems. One of the most powerful and versatile characterization methods is the nanoindentation technique. The capabilities of these depth-sensing instruments have been improved considerably. They can perform experiments in vacuum and at high temperatures, such as in-situ SEM and TEM nanoindenters. This allows researchers to visualize mechanical deformations and dislocations motion in real time. Time-dependent behavior of soft materials has also been studied in recent research works. This Special Issue on "Small Scale Deformation using Advanced Nanoindentation Techniques"; will provide a forum for researchers from the academic and industrial communities to present advances in the field of small scale contact mechanics. Materials of interest include metals, glass, and ceramics. Manuscripts related to deformations of biomaterials and biological related specimens are also welcome. Topics of interest include, but are not limited to: Small scale facture Nanoscale plasticity and creep Size-dependent deformation phenomena Deformation of biological cells Mechanical properties of cellular and sub-cellular components Novel mechanical properties characterization techniques New modeling methods Environmentally controlled nanoindentation In-situ SEM and TEM indentation

Advanced Packaging

Author :
Publisher :
ISBN 13 :
Total Pages : 36 pages
Book Rating : 4./5 ( download)

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Book Synopsis Advanced Packaging by :

Download or read book Advanced Packaging written by and published by . This book was released on 2008-11 with total page 36 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.

ISTFA 2012

Author : ASM International
Publisher : ASM International
ISBN 13 : 1615039953
Total Pages : 643 pages
Book Rating : 4.6/5 (15 download)

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Book Synopsis ISTFA 2012 by : ASM International

Download or read book ISTFA 2012 written by ASM International and published by ASM International. This book was released on 2012 with total page 643 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Strain Effect in Semiconductors

Author : Yongke Sun
Publisher : Springer Science & Business Media
ISBN 13 : 1441905529
Total Pages : 353 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis Strain Effect in Semiconductors by : Yongke Sun

Download or read book Strain Effect in Semiconductors written by Yongke Sun and published by Springer Science & Business Media. This book was released on 2009-11-14 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt: Strain Effect in Semiconductors: Theory and Device Applications presents the fundamentals and applications of strain in semiconductors and semiconductor devices that is relevant for strain-enhanced advanced CMOS technology and strain-based piezoresistive MEMS transducers. Discusses relevant applications of strain while also focusing on the fundamental physics pertaining to bulk, planar, and scaled nano-devices. Hence, this book is relevant for current strained Si logic technology as well as for understanding the physics and scaling for future strained nano-scale devices.

Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology

Author : Luciano Lavagno
Publisher : CRC Press
ISBN 13 : 1482254611
Total Pages : 798 pages
Book Rating : 4.4/5 (822 download)

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Book Synopsis Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology by : Luciano Lavagno

Download or read book Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology written by Luciano Lavagno and published by CRC Press. This book was released on 2017-02-03 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.

Metals Abstracts

Author :
Publisher :
ISBN 13 :
Total Pages : 1014 pages
Book Rating : 4.E/5 ( download)

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Book Synopsis Metals Abstracts by :

Download or read book Metals Abstracts written by and published by . This book was released on 1999 with total page 1014 pages. Available in PDF, EPUB and Kindle. Book excerpt:

High-Performance Polymer...

Author : Guy Rabilloud
Publisher : Editions OPHRYS
ISBN 13 : 9782710810957
Total Pages : 596 pages
Book Rating : 4.8/5 (19 download)

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Book Synopsis High-Performance Polymer... by : Guy Rabilloud

Download or read book High-Performance Polymer... written by Guy Rabilloud and published by Editions OPHRYS. This book was released on with total page 596 pages. Available in PDF, EPUB and Kindle. Book excerpt:

3D Microelectronic Packaging

Author : Yan Li
Publisher : Springer
ISBN 13 : 9783319445847
Total Pages : 560 pages
Book Rating : 4.4/5 (458 download)

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Book Synopsis 3D Microelectronic Packaging by : Yan Li

Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer. This book was released on 2016-10-29 with total page 560 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.