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The Thermal Design Of High Temperature Electronic Parts And Equipments
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Book Synopsis High Temperature Electronics by : F. Patrick McCluskey
Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 1996-12-13 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Book Synopsis Advanced Thermal Design of Electronic Equipment by : Ralph Remsburg
Download or read book Advanced Thermal Design of Electronic Equipment written by Ralph Remsburg and published by Springer Science & Business Media. This book was released on 1998-02-28 with total page 632 pages. Available in PDF, EPUB and Kindle. Book excerpt: With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits on-time product introduction and reliability in the field. This book serves as a reference for engineers who must predict the thermal performance of a company's latest product as well as the technicians who must quickly solve the problem of an overheating chip in a product that is already on the shelves.
Book Synopsis Guide Manual of Cooling Methods for Electronic Equipment by : United States. Navy Department. Bureau of Ships
Download or read book Guide Manual of Cooling Methods for Electronic Equipment written by United States. Navy Department. Bureau of Ships and published by . This book was released on 1956 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Guide Manual of Cooling Methods for Electronic Equipment by : Cornell Aeronautical Laboratory
Download or read book Guide Manual of Cooling Methods for Electronic Equipment written by Cornell Aeronautical Laboratory and published by . This book was released on 1956 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Thermal Design of Electronic Equipment by : Ralph Remsburg
Download or read book Thermal Design of Electronic Equipment written by Ralph Remsburg and published by CRC Press. This book was released on 2017-12-19 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Book Synopsis Design Manual of Natural Methods of Cooling Electronic Equipment by : James P. Welsh
Download or read book Design Manual of Natural Methods of Cooling Electronic Equipment written by James P. Welsh and published by . This book was released on 1962 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Design Manual of Natural Methods of Cooling Electronic Equipment by : United States. Ships Bureau
Download or read book Design Manual of Natural Methods of Cooling Electronic Equipment written by United States. Ships Bureau and published by . This book was released on 1962 with total page 208 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Reliability Design Handbook by : United States. Naval Ship Systems Command
Download or read book Reliability Design Handbook written by United States. Naval Ship Systems Command and published by . This book was released on 1963 with total page 810 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Heat Transfer in Miniaturized Electronic Equipment by : Cornell Aeronautical Laboratory
Download or read book Heat Transfer in Miniaturized Electronic Equipment written by Cornell Aeronautical Laboratory and published by . This book was released on 1955 with total page 100 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis U.S. Government Research Reports by :
Download or read book U.S. Government Research Reports written by and published by . This book was released on 1963 with total page 168 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Reliability Stress and Failure Rate Data for Electronic Equipment by : United States. Department of Defense
Download or read book Reliability Stress and Failure Rate Data for Electronic Equipment written by United States. Department of Defense and published by . This book was released on 1962 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings written by and published by . This book was released on 1964 with total page 736 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Handbook of Applied Thermal Design by : Eric C. Guyer
Download or read book Handbook of Applied Thermal Design written by Eric C. Guyer and published by CRC Press. This book was released on 1999-02-01 with total page 710 pages. Available in PDF, EPUB and Kindle. Book excerpt: Gives a foundation to the four principle facets of thermal design: heat transfer analysis, materials performance, heating and cooling technology, and instrumentation and control. The focus is on providing practical thermal design and development guidance across the spectrum of problem analysis, material applications, equipment specification, and sensor and control selection.
Download or read book Heat Transfer written by Younes Shabany and published by CRC Press. This book was released on 2009-12-17 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
Book Synopsis Proceedings [held] April 16-19, 1963 by : Pei Moo Ku
Download or read book Proceedings [held] April 16-19, 1963 written by Pei Moo Ku and published by . This book was released on 1963 with total page 728 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability 91 written by R.H. Matthews and published by CRC Press. This book was released on 2018-05-04 with total page 713 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a collection of papers presented at the International Conference on Reliability Techniques and their Application.Reliability 91, 10-12 June 1991 was held at the Royal Lancaster Hotel, London, UK, organised by SRD (the Safety and Reliability Consultants of AEA Technology) and the institution of Quality Assurance (IQA), and supported by the European Safety and Reliability Association (ESRA).
Book Synopsis NEL Reliability Bibliography by : United States. Navy. Electronics Laboratory
Download or read book NEL Reliability Bibliography written by United States. Navy. Electronics Laboratory and published by . This book was released on 1956 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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