The Interfacial Thermal Conductance of Epitaxial Metal-semiconductor Interfaces

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ISBN 13 : 9780355466003
Total Pages : 147 pages
Book Rating : 4.4/5 (66 download)

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Book Synopsis The Interfacial Thermal Conductance of Epitaxial Metal-semiconductor Interfaces by : Ning Ye

Download or read book The Interfacial Thermal Conductance of Epitaxial Metal-semiconductor Interfaces written by Ning Ye and published by . This book was released on 2017 with total page 147 pages. Available in PDF, EPUB and Kindle. Book excerpt: Understanding heat transport at nanometer and sub-nanometer lengthscales is critical to solving a wide range of technological challenges related to thermal management and energy conversion. In particular, finite Interfacial Thermal Conductance (ITC) often dominates transport whenever multiple interfaces are closely spaced together or when heat originates from sources that are highly confined by interfaces. Examples of the former include superlattices, thin films, quantum cascade lasers, and high density nanocomposites. Examples of the latter include FinFET transistors, phase-change memory, and the plasmonic transducer of a heat-assisted magnetic recording head. An understanding of the physics of such interfaces is still lacking, in part because experimental investigations to-date have not bothered to carefully control the structure of interfaces studied, and also because the most advanced theories have not been compared to the most robust experimental data. ☐ This thesis aims to resolve this by investigating ITC between a range of clean and structurally well-characterized metal-semiconductor interfaces using the Time-Domain Thermoreflectance (TDTR) experimental technique, and by providing theoretical/computational comparisons to the experimental data where possible. By studying the interfaces between a variety of materials systems, each with unique aspects to their tunability, I have been able to answer a number of outstanding questions regarding the importance of interfacial quality (epitaxial/non-epitaxial interfaces), semiconductor doping, matching of acoustic and optical phonon band structure, and the role of phonon transport mechanisms apart from direct elastic transmission on ITC. In particular, we are able to comment on the suitability of the diffuse mismatch model (DMM) to describe the transport across epitaxial interfaces. ☐ To accomplish this goal, I studied interfacial thermal transport across CoSi2, TiSi2, NiSi and PtSi - Si(100) and Si(111), (silicides-silicon), interfaces with varying levels of disorder (epitaxial and non-epitaxial). The ITC values of silicides-silicon interfaces observed in this study are higher than those of other metallic interfaces to Si found in literature. Most surprisingly, it is experimentally found that ITC values are independent of interfacial quality and substrate orientation. Computationally, it is found that the non-equilibrium atomistic Green's Function technique (NEGF), which is specically designed to simulate coherent elastic phonon transport across interfaces, significantly underpredicts ITC values for CoSi2-Si interfaces, suggesting that energy transport does not occur purely by coherent transmission of phonons, even for epitaxial interfaces. In contrast, the Diffuse Mismatch Model closely mimics the experimentally observed ITC values for CoSi2-Si, NiSi-Si and TiSi2-Si interfaces, and only slightly overestimating the same for PtSi-Si interfaces. Furthermore, the results also show that ITC is independent of degenerate doping up to doping levels of 1*10^19 cm-3, indicating there is no significant direct electronic transport or transport effects which depend on long-range metal-semiconductor band alignment. ☐ Then, I study the effect of phonon band structure on ITC through measurements of epitaxial NiAl1-xGax-GaAs interfaces for varying levels of alloy composition, which independently tunes the mass of the metal's heavy atom without much affect on the lattice structure or interatomic force constants. The ITC values are found to linearly increase with increasing Ga content, consistent with the disappearance of a phonon band gap in NiAl1-xGax films with increasing Ga content, which enhances the phonon transmission coefficients due to a better density of states overlap between the two (NiAl1-xGax, GaAs) materials. ☐ Finally, I study a unique subset of epitaxial rocksalt interfaces between the Group IV metal nitrides (TiN, ZrN, and HfN) to MgO substrates as well as ScN layers. Prior to the currrent study, TiN-MgO was the only measured interface of this type, and maintained the record for the highest reported ITC for a metal-semiconductor interface. By varying the Group IV metal, the mass of the metal's light atom was independently tuned, allowing the ability to tune the acoustic phonon frequencies in the metal without significant effect to optical phonon band structure. We find that the ITC of all the studied interfaces are quite high, significantly exceeding the DMM predictions, and in the case of XN-ScN interfaces even exceed the radiative limit for elastic phonon transport. The results imply that mechanisms such as anharmonic phonon transmission, strong cross-interfacial electron phonon coupling, or direct electric transmission are required to explain the transport. The TiN-ScN interface conductance is the highest room temperature metal-dielectric conductance ever reported.

Semiconductor Mounting Interface Thermal Conductance - Experimental Program and Results

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ISBN 13 :
Total Pages : 184 pages
Book Rating : 4.:/5 (796 download)

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Book Synopsis Semiconductor Mounting Interface Thermal Conductance - Experimental Program and Results by : Thomas H. Poyer

Download or read book Semiconductor Mounting Interface Thermal Conductance - Experimental Program and Results written by Thomas H. Poyer and published by . This book was released on 1971 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Physics and Chemistry of III-V Compound Semiconductor Interfaces

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Publisher : Springer
ISBN 13 :
Total Pages : 488 pages
Book Rating : 4.:/5 (45 download)

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Book Synopsis Physics and Chemistry of III-V Compound Semiconductor Interfaces by : Carl W. Wilmsen

Download or read book Physics and Chemistry of III-V Compound Semiconductor Interfaces written by Carl W. Wilmsen and published by Springer. This book was released on 1985-08 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: The application of the 111-V compound semiconductors to device fabrica tion has grown considerably in the last few years. This process has been stimulated, in part, by the advancement in the understanding of the interface physics and chemistry of the III-V's. The literature on this subject is spread over the last 15 years and appears in many journals and conference proceedings. Understanding this literature requires consider able effort by the seasoned researcher, and even more for those starting out in the field or by engineers and scientists who wish to apply this knowledge to the fabrication of devices. The purpose of this book is to bring together much of the fundamental and practical knowledge on the physics and chemistry of the 111-V compounds with metals and dielectrics. The authors of this book have endeavored to provide concise overviews of these areas with many tahles ancI grarhs whic. h c. omr>are and summarize the literature. In this way, the book serves as both an insightful treatise on III-V interfaces and a handy reference to the literature. The selection of authors was mandated by the desire to include both fundamental and practical approaches, covering device and material aspects of the interfaces. All of the authors are recognized experts on III-V interfaces and each has worked for many years in his subject area. This experience is projected in the breadth of understanding in each chapter.

III-V Nitride Semiconductors

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Publisher : CRC Press
ISBN 13 : 1000715957
Total Pages : 715 pages
Book Rating : 4.0/5 (7 download)

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Book Synopsis III-V Nitride Semiconductors by : Edward T. Yu

Download or read book III-V Nitride Semiconductors written by Edward T. Yu and published by CRC Press. This book was released on 2022-10-30 with total page 715 pages. Available in PDF, EPUB and Kindle. Book excerpt: The concepts in this book will provide a comprehensive overview of the current state for a broad range of nitride semiconductor devices, as well as a detailed introduction to selected materials and processing issues of general relevance for these applications. This compilation is very timely given the level of interest and the current stage of research in nitride semiconductor materials and device applications. This volume consists of chapters written by a number of leading researchers in nitride materials and device technology addressing Ohmic and Schottky contacts, AIGalnN multiple quantum well laser diodes, nitride vertical cavity emitting lasers, and ultraviolet photodetectors. This unique volume provides a comprehensive review and introduction to application and devices based on GaN and related compounds for newcomers to the field and stimulus to further advances for experienced researchers.

Interface Thermal Conductance with Metal Screens as Interstitial Material

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ISBN 13 :
Total Pages : 92 pages
Book Rating : 4.:/5 (62 download)

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Book Synopsis Interface Thermal Conductance with Metal Screens as Interstitial Material by : William Edward Stewart (Jr.)

Download or read book Interface Thermal Conductance with Metal Screens as Interstitial Material written by William Edward Stewart (Jr.) and published by . This book was released on 1970 with total page 92 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This thesis reports the results of an experimental investigation to determine the thermal conductance at the interface of metal specimens separated by wire mesh. Sets of metal specimens of copper, 2024-T4 aluminum, and 304 stainless steel were used. The specimens were cylindrical, axially aligned, and hydraulically loaded. All tests were conducted in an air environment. Pressure applied to the specimens ranged from 50 to 500 psig. Surface roughness of the interfaces varied from 5 to 20 micro inches. The wire mesh separators were of 304 stainless steel in 20, 30, 40, and 50 mesh. Results of the experiments show that: a) thermal conductance increases with an increase in mesh number and the corresponding increase in the number of contact points, b) an increase in contact pressure will increase thermal conductance in all cases and, c) at a given pressure and with a given mesh stainless steel screen, the specimen materials in order of decreasing interface conductance are: aluminum, copper, and stainless steel"--Abstract, leaf ii.

Micro and Nano Thermal Transport

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Publisher : Academic Press
ISBN 13 : 012823623X
Total Pages : 358 pages
Book Rating : 4.1/5 (282 download)

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Book Synopsis Micro and Nano Thermal Transport by : Lin Qiu

Download or read book Micro and Nano Thermal Transport written by Lin Qiu and published by Academic Press. This book was released on 2022-02-09 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro and Nano Thermal Transport Research: Characterization, Measurement and Mechanism is a complete and reliable reference on thermal measurement methods and mechanisms of micro and nanoscale materials. The book has a strong focus on applications and simulation, providing clear guidance on how to measure thermal properties in a systematic way. Sections cover the fundamentals of thermal properties before introducing tools to help readers identify and analyze thermal characteristics of these materials. The thermal transport properties are then further explored by means of simulation which reflect the internal mechanisms used to generate such thermal properties. Readers will gain a clear understanding of thermophysical measurement methods and the representative thermal transport characteristics of micro/nanoscale materials with different structures and are guided through a decision-making process to choose the most effective method to master thermal analysis. The book is particularly suitable for those engaged in the design and development of thermal property measurement instruments, as well as researchers of thermal transport at the micro and nanoscale. Includes a variety of measurement methods and thermal transport characteristics of micro and nanoscale materials under different structures Guides the reader through the decision-making process to ensure the best thermal analysis method is selected for their setting Contains experiments and simulations throughout that help apply understanding to practice

Materials Interfaces

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Publisher : Springer Science & Business Media
ISBN 13 : 9780412412707
Total Pages : 748 pages
Book Rating : 4.4/5 (127 download)

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Book Synopsis Materials Interfaces by : D. Wolf

Download or read book Materials Interfaces written by D. Wolf and published by Springer Science & Business Media. This book was released on 1992-10-31 with total page 748 pages. Available in PDF, EPUB and Kindle. Book excerpt: Many of the most important properties of materials in high-technology applications are strongly influenced or even controlled by the presence of solid interfaces. In this work, leading international authorities review the broad range of subjects in this field focusing on the atomic level properties of solid interfaces.

NBS Special Publication

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ISBN 13 :
Total Pages : 790 pages
Book Rating : 4.:/5 (319 download)

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Book Synopsis NBS Special Publication by :

Download or read book NBS Special Publication written by and published by . This book was released on 1978 with total page 790 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Scientific and Technical Aerospace Reports

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ISBN 13 :
Total Pages : 692 pages
Book Rating : 4.:/5 (3 download)

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Book Synopsis Scientific and Technical Aerospace Reports by :

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 692 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Chemical Abstracts

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ISBN 13 :
Total Pages : 2540 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Chemical Abstracts by :

Download or read book Chemical Abstracts written by and published by . This book was released on 2002 with total page 2540 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele

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Publisher : The Electrochemical Society
ISBN 13 : 1566778239
Total Pages : 656 pages
Book Rating : 4.5/5 (667 download)

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Book Synopsis Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele by : C. Colinge

Download or read book Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele written by C. Colinge and published by The Electrochemical Society. This book was released on 2010-10 with total page 656 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.

Advances in Heat Transfer

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Publisher : Academic Press
ISBN 13 : 0323850820
Total Pages : 414 pages
Book Rating : 4.3/5 (238 download)

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Book Synopsis Advances in Heat Transfer by : Ephraim M. Sparrow

Download or read book Advances in Heat Transfer written by Ephraim M. Sparrow and published by Academic Press. This book was released on 2021-12-01 with total page 414 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Heat Transfer, Volume 53 in this long-running serial, highlights new advances in the field, with this new volume presenting interesting chapters written by an international board of authors. Provides the authority and expertise of leading contributors from an international board of authors Presents the latest release in the Advances in Heat Transfer series

15th European Workshop on Metalorganic Vapour Phase Epitaxy (EWMOVPE XV)

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Publisher : Forschungszentrum Jülich
ISBN 13 : 3893368701
Total Pages : 415 pages
Book Rating : 4.8/5 (933 download)

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Book Synopsis 15th European Workshop on Metalorganic Vapour Phase Epitaxy (EWMOVPE XV) by :

Download or read book 15th European Workshop on Metalorganic Vapour Phase Epitaxy (EWMOVPE XV) written by and published by Forschungszentrum Jülich. This book was released on 2013 with total page 415 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Silicon Molecular Beam Epitaxy

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Publisher : CRC Press
ISBN 13 : 1351085077
Total Pages : 306 pages
Book Rating : 4.3/5 (51 download)

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Book Synopsis Silicon Molecular Beam Epitaxy by : E. Kasper

Download or read book Silicon Molecular Beam Epitaxy written by E. Kasper and published by CRC Press. This book was released on 2018-05-04 with total page 306 pages. Available in PDF, EPUB and Kindle. Book excerpt: This subject is divided into two volumes. Volume I is on homoepitaxy with the necessary systems, techniques, and models for growth and dopant incorporation. Three chapters on homoepitaxy are followed by two chapters describing the different ways in which MBE may be applied to create insulator/Si stackings which may be used for three-dimensional circuits. The two remaining chapters in Volume I are devoted to device applications. The first three chapters of Volume II treat all aspects of heteroepitaxy with the exception of the epitaxial insulator/Si structures already treated in volume I.

Nano-Semiconductors

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Publisher : CRC Press
ISBN 13 : 143984836X
Total Pages : 600 pages
Book Rating : 4.4/5 (398 download)

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Book Synopsis Nano-Semiconductors by : Krzysztof Iniewski

Download or read book Nano-Semiconductors written by Krzysztof Iniewski and published by CRC Press. This book was released on 2018-09-03 with total page 600 pages. Available in PDF, EPUB and Kindle. Book excerpt: With contributions from top international experts from both industry and academia, Nano-Semiconductors: Devices and Technology is a must-read for anyone with a serious interest in future nanofabrication technologies. Taking into account the semiconductor industry’s transition from standard CMOS silicon to novel device structures—including carbon nanotubes (CNT), graphene, quantum dots, and III-V materials—this book addresses the state of the art in nano devices for electronics. It provides an all-encompassing, one-stop resource on the materials and device structures involved in the evolution from micro- to nanoelectronics. The book is divided into three parts that address: Semiconductor materials (i.e., carbon nanotubes, memristors, and spin organic devices) Silicon devices and technology (i.e., BiCMOS, SOI, various 3D integration and RAM technologies, and solar cells) Compound semiconductor devices and technology This reference explores the groundbreaking opportunities in emerging materials that will take system performance beyond the capabilities of traditional CMOS-based microelectronics. Contributors cover topics ranging from electrical propagation on CNT to GaN HEMTs technology and applications. Approaching the trillion-dollar nanotech industry from the perspective of real market needs and the repercussions of technological barriers, this resource provides vital information about elemental device architecture alternatives that will lead to massive strides in future development.

Metal – Semiconductor Contacts and Devices

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Publisher : Academic Press
ISBN 13 : 1483217795
Total Pages : 435 pages
Book Rating : 4.4/5 (832 download)

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Book Synopsis Metal – Semiconductor Contacts and Devices by : Simon S. Cohen

Download or read book Metal – Semiconductor Contacts and Devices written by Simon S. Cohen and published by Academic Press. This book was released on 2014-12-01 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: VLSI Electronics Microstructure Science, Volume 13: Metal-Semiconductor Contacts and Devices presents the physics, technology, and applications of metal-semiconductor barriers in digital integrated circuits. The emphasis is placed on the interplay among the theory, processing, and characterization techniques in the development of practical metal-semiconductor contacts and devices. This volume contains chapters that are devoted to the discussion of the physics of metal-semiconductor interfaces and its basic phenomena; fabrication procedures; and interface characterization techniques, particularly, ohmic contacts. Contacts that involve polycrystalline silicon; applications of the metal-semiconductor barriers in MOS, bipolar, and MESFET digital integrated circuits; and methods for measuring the barrier height are covered as well. Process engineers, device physicists, circuit designers, and students of this discipline will find the book very useful.

Publications

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ISBN 13 :
Total Pages : 788 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Publications by : United States. National Bureau of Standards

Download or read book Publications written by United States. National Bureau of Standards and published by . This book was released on 1978 with total page 788 pages. Available in PDF, EPUB and Kindle. Book excerpt: