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Author : Phil L. Jones
Publisher : Manchester University Press
ISBN 13 : 9780719030796
Total Pages : 200 pages
Book Rating : 4.0/5 (37 download)
Download or read book Electronics Computer Aided Design written by Phil L. Jones and published by Manchester University Press. This book was released on 1989 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Abdelkhalak El Hami
Publisher : ISTE Press - Elsevier
ISBN 13 : 1785481908
Total Pages : 298 pages
Book Rating : 4.7/5 (854 download)
Download or read book Embedded Mechatronic Systems 2 written by Abdelkhalak El Hami and published by ISTE Press - Elsevier. This book was released on 2020-03-03 with total page 298 pages. Available in PDF, EPUB and Kindle. Book excerpt: Embedded Mechatronic Systems 2: Analysis of Failures, Modeling, Simulation and Optimization presents advances in research within the field of mechatronic systems, which integrates reliability into the design process. Providing many detailed examples, this book develops a characterization methodology for faults in mechatronic systems. It analyzes the multi-physical modeling of faults, revealing weaknesses in design and failure mechanisms. This development of meta-models enables us to simulate effects on the reliability of conditions of use and manufacture.
Author :
Publisher :
ISBN 13 :
Total Pages : 772 pages
Book Rating : 4.:/5 (31 download)
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1994 with total page 772 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Abdelkhalak El Hami
Publisher : Elsevier
ISBN 13 : 0081004699
Total Pages : 273 pages
Book Rating : 4.0/5 (81 download)
Download or read book Embedded Mechatronic Systems, Volume 2 written by Abdelkhalak El Hami and published by Elsevier. This book was released on 2015-07-16 with total page 273 pages. Available in PDF, EPUB and Kindle. Book excerpt: In operation, mechatronics embedded systems are stressed by loads of different causes: climate (temperature, humidity), vibration, electrical and electromagnetic. These stresses in components induce failure mechanisms should be identified and modeled for better control. AUDACE is a collaborative project of the cluster Mov'eo that address issues specific to mechatronic reliability embedded systems. AUDACE means analyzing the causes of failure of components of mechatronic systems onboard. The goal of the project is to optimize the design of mechatronic devices by reliability. The project brings together public sector laboratories that have expertise in analysis and modeling of failure, major groups of mechatronics (Valeo and Thales) in the automotive and aerospace and small and medium enterprises that have skills in characterization and validation tests. - Find and develop ways to characterize and validate the design robustness and reliability of complex mechatronic devices - Develop ways to characterize physical and chemical phenomena, - Identify mechanisms of failure of components of these devices, - Analyze the physical and / or chemical mechanisms of failure, in order of importance - To model failure mechanisms and design optimization.
Author : Manfred Glesner
Publisher : Springer
ISBN 13 : 3540461175
Total Pages : 1209 pages
Book Rating : 4.5/5 (44 download)
Download or read book Field-Programmable Logic and Applications: Reconfigurable Computing Is Going Mainstream written by Manfred Glesner and published by Springer. This book was released on 2003-08-02 with total page 1209 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 12th International Conference on Field-Programmable Logic and Applications, FPL 2002, held in Montpellier, France, in September 2002. The 104 revised regular papers and 27 poster papers presented together with three invited contributions were carefully reviewed and selected from 214 submissions. The papers are organized in topical sections on rapid prototyping, FPGA synthesis, custom computing engines, DSP applications, reconfigurable fabrics, dynamic reconfiguration, routing and placement, power estimation, synthesis issues, communication applications, new technologies, reconfigurable architectures, multimedia applications, FPGA-based arithmetic, reconfigurable processors, testing and fault-tolerance, crypto applications, multitasking, compilation techniques, etc.
Author : Wade H. Shafer
Publisher : Springer Science & Business Media
ISBN 13 : 1461528321
Total Pages : 350 pages
Book Rating : 4.4/5 (615 download)
Download or read book Masters Theses in the Pure and Applied Sciences written by Wade H. Shafer and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt: Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS) * at Purdue University in 1 957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dissemination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all con cerned if the printing and distribution of the volumes were handled by an interna tional publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Cor poration of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 36 (thesis year 1991) a total of 11,024 thesis titles from 23 Canadian and 161 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this important annual reference work. While Volume 36 reports theses submitted in 1991, on occasion, certain univer sities do report theses submitted in previous years but not reported at the time.
Author :
Publisher :
ISBN 13 :
Total Pages : 432 pages
Book Rating : 4.:/5 (4 download)
Download or read book International Journal of Electrical Engineering Education written by and published by . This book was released on 1989 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : TERRE Michel
Publisher : Lavoisier
ISBN 13 : 2746289067
Total Pages : 226 pages
Book Rating : 4.7/5 (462 download)
Download or read book Systèmes sans fil : problèmes résolus written by TERRE Michel and published by Lavoisier. This book was released on 2012-09-05 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt: Universellement accessibles et permettant la mobilité, les systèmes sans fil connaissent un usage croissant. Cependant, le débit et la qualité de service ne sont pas encore au niveau des systèmes filaires. Par une approche macroscopique des systèmes sans fil, cet ouvrage répond aux questions de puissance, de débit, d'accès multiple, d'organisation cellulaire et d'organisation des réseaux d'accès. Ce livre met en application les principes fondamentaux des systèmes de télécommunications sans fil. Les grands concepts technologiques des systèmes radio (F/TDMA, GSM, CDMA, UMTS, OFDM, LTE, MIMO et UWB) et leurs principaux résultats théoriques sont présentés. Une série de problèmes résolus ayant pour objet d'établir des éléments du bilan de liaison global de différents systèmes de radiocommunications est proposée.
Author : Yves Arden
Publisher : Psychology Press
ISBN 13 : 0415112257
Total Pages : 866 pages
Book Rating : 4.4/5 (151 download)
Download or read book Routledge Dictionnaire Technique Anglais written by Yves Arden and published by Psychology Press. This book was released on 1994 with total page 866 pages. Available in PDF, EPUB and Kindle. Book excerpt: The French-English volume of this highly acclaimed set consists of some 100,000 keywords in both French and English, drawn from the whole range of modern applied science and technical terminology. Covers over 70 subject areas, from engineering and chemistry to packaging, transportation, data processing and much more.
Author :
Publisher :
ISBN 13 :
Total Pages : 768 pages
Book Rating : 4.:/5 (318 download)
Download or read book Electronic Engineering written by and published by . This book was released on 1989 with total page 768 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Jean-Claude Laprie
Publisher : Springer
ISBN 13 : 370919170X
Total Pages : 268 pages
Book Rating : 4.7/5 (91 download)
Download or read book Dependability: Basic Concepts and Terminology written by Jean-Claude Laprie and published by Springer. This book was released on 2013-12-28 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : NOËL Didier
Publisher : Lavoisier
ISBN 13 : 2743065044
Total Pages : 474 pages
Book Rating : 4.7/5 (43 download)
Download or read book Les nanomatériaux et leurs applications pour l'énergie électrique written by NOËL Didier and published by Lavoisier. This book was released on 2014-01-10 with total page 474 pages. Available in PDF, EPUB and Kindle. Book excerpt: Les nanotechnologies apportent un fort potentiel d’innovation et de rupture dans de nombreux domaines. Leurs applications pour l’énergie en est un champ important, car la synthèse et la structuration des nanomatériaux y ouvrent des voies de progrès notables. Si divers ouvrages décrivent les innovations promises par les nanotechnologies sur des thématiques scientifiques générales ou spécialisées, très peu abordent le chemin qui va des nouvelles propriétés aux applications pour l’énergie électrique et ses usages. Cet ouvrage présente, sur des bases scientifiques solides, les apports des nanotechnologies et plus particulièrement des nanomatériaux aux enjeux de la production d’électricité et de ses usages. Après un panorama des effets physiques qui peuvent être exploités à ces échelles pour améliorer les propriétés des matériaux ou leur fonctionnalité, leur application à la production d’électricité, à son stockage, à ses usages ainsi qu’au traitement de questions environnementales est abordée. Elle conduit à explorer les domaines de l’électrochimie, du photovoltaïque, de la thermoélectricité, des propriétés mécaniques et thermiques des matériaux ou encore des membranes et des surfaces ultrahydrophobes. Chaque chapitre constitue une monographie exhaustive enrichie d’une abondante iconographie et d’une bibliographie très complète. Les meilleurs experts de chaque domaine ont été réunis, faisant de cet ouvrage une référence incontournable. Au confluent de plusieurs disciplines et en prise directe sur un vaste champ d’applications, ce livre s’adresse à un large public : ingénieurs et chercheurs, étudiants des écoles d’ingénieurs ou des universités aux niveaux licence et master.
Author : Fengyuan Sun
Publisher : Editions Publibook
ISBN 13 : 2753903298
Total Pages : 178 pages
Book Rating : 4.7/5 (539 download)
Download or read book Analyse Et Caractérisation Des Couplages Substrat Et de la Connectique Dans Les Circuits 3D written by Fengyuan Sun and published by Editions Publibook. This book was released on 2016 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proposal of doubling the number of transistors on an IC chip (with minimum costs and subtle innovations) every 24 months by Gordon Moore in 1965 (the so-called called Moore's law) has been the most powerful driver for the emphasis of the microelectronics industry in the past 50 years. This law enhances lithography scaling and integration, in 2D, of all functions on a single chip, increasingly through system-on-chip (SOC). On the other hand, the integration of all these functions can be achieved through 3D integrations . Generally speaking, 3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and mostly the TSV (through-silicon via) separates 3D IC packaging from 3D IC/Si integrations since the latter two uses TSVs, but 3D IC packaging does not. TSV (with a new concept that every chip or interposer could have two surfaces with circuits) is the heart of 3D IC/Si integrations. Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. 3D Si integration is the right way to go and compete with Moore's law (more than Moore versus more Moore). However, it is still a long way to go. In this book, Fengyuan SUN proposes new substrate network extraction techniques. Using this latter, the substrate coupling and loss in IC's can be analyzed. He implements some Green/TLM (Transmission Line Matrix) algorithms in MATLAB. It permits to extract impedances between any number of embedded contacts or/and TSVS. He does investigate models of high aspect ratio TSV, on both analytical and numerical methods electromagnetic simulations. This model enables to extract substrate and TSV impedance, S parameters and parasitic elements, considering the variable resistivity of the substrate. It is full compatible with SPICE-like solvers and should allow an investigation in depth of TSV impact on circuit performance.
Author : C.G. Wedgwood
Publisher : Elsevier
ISBN 13 : 1483292649
Total Pages : 631 pages
Book Rating : 4.4/5 (832 download)
Download or read book European Electronics Directory 1994 written by C.G. Wedgwood and published by Elsevier. This book was released on 2013-10-22 with total page 631 pages. Available in PDF, EPUB and Kindle. Book excerpt: Companion volume to Components and Sub-Assemblies Directory, providing access to 8000 manufacturers, agents and representatives of electronics systems and equipment. Entries include names of key managers, addresses, fax/telephone numbers, and pocket descriptions of manufacturing and sales programmes. There is also a product index to track the companies involved in any given business lines.
Author : Raoul Velazco
Publisher : Springer Science & Business Media
ISBN 13 : 140205646X
Total Pages : 273 pages
Book Rating : 4.4/5 (2 download)
Download or read book Radiation Effects on Embedded Systems written by Raoul Velazco and published by Springer Science & Business Media. This book was released on 2007-06-19 with total page 273 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides an extensive overview of radiation effects on integrated circuits, offering major guidelines for coping with radiation effects on components. It contains a set of chapters based on the tutorials presented at the International School on Effects of Radiation on Embedded Systems for Space Applications (SERESSA) that was held in Manaus, Brazil, November 20-25, 2005.
Author :
Publisher :
ISBN 13 :
Total Pages : 842 pages
Book Rating : 4.0/5 ( download)
Download or read book International Workshop Expert Systems & Their Applications written by and published by . This book was released on 1987 with total page 842 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Jens Sparsø
Publisher : Springer Science & Business Media
ISBN 13 : 1475733852
Total Pages : 348 pages
Book Rating : 4.4/5 (757 download)
Download or read book Principles of Asynchronous Circuit Design written by Jens Sparsø and published by Springer Science & Business Media. This book was released on 2013-04-17 with total page 348 pages. Available in PDF, EPUB and Kindle. Book excerpt: Principles of Asynchronous Circuit Design - A Systems Perspective addresses the need for an introductory text on asynchronous circuit design. Part I is an 8-chapter tutorial which addresses the most important issues for the beginner, including how to think about asynchronous systems. Part II is a 4-chapter introduction to Balsa, a freely-available synthesis system for asynchronous circuits which will enable the reader to get hands-on experience of designing high-level asynchronous systems. Part III offers a number of examples of state-of-the-art asynchronous systems to illustrate what can be built using asynchronous techniques. The examples range from a complete commercial smart card chip to complex microprocessors. The objective in writing this book has been to enable industrial designers with a background in conventional (clocked) design to be able to understand asynchronous design sufficiently to assess what it has to offer and whether it might be advantageous in their next design task.
