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Surface Mount Technology

Author : Ray Prasad
Publisher : Springer Science & Business Media
ISBN 13 : 1461540844
Total Pages : 791 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Surface Mount Technology by : Ray Prasad

Download or read book Surface Mount Technology written by Ray Prasad and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 791 pages. Available in PDF, EPUB and Kindle. Book excerpt: A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.

Surface-mount Technology for PC Boards

Author : Glenn R. Blackwell
Publisher : Delmar Thomson Learning
ISBN 13 :
Total Pages : 548 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Surface-mount Technology for PC Boards by : Glenn R. Blackwell

Download or read book Surface-mount Technology for PC Boards written by Glenn R. Blackwell and published by Delmar Thomson Learning. This book was released on 2006 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: Learn to generate high manufacturing yields, low testing costs, and reproducible designs using the latest components of surface mount technology (SMT)! Manufacturers, managers, engineers, students, and others who work with printed-circuit boards will find a wealth of cutting-edge information about SMT and fine pitch technology (FPT) in this new edition. Practical data and clear illustrations combine to clearly and accurately present the details of design-for-manufacturability, environmental compliance, design-for-test, and quality/reliability for today's miniaturized electronics packaging.

Electronic Systems Maintenance Handbook

Author : Jerry C. Whitaker
Publisher : CRC Press
ISBN 13 : 1420036858
Total Pages : 624 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis Electronic Systems Maintenance Handbook by : Jerry C. Whitaker

Download or read book Electronic Systems Maintenance Handbook written by Jerry C. Whitaker and published by CRC Press. This book was released on 2017-12-19 with total page 624 pages. Available in PDF, EPUB and Kindle. Book excerpt: The days of troubleshooting a piece of gear armed only with a scope, voltmeter, and a general idea of how the hardware works are gone forever. As technology continues to drive equipment design forward, maintenance difficulties will continue to increase, and those responsible for maintaining this equipment will continue to struggle to keep up. The Electronic Systems Maintenance Handbook, Second Edition establishes a foundation for servicing, operating, and optimizing audio, video, computer, and RF systems. Beginning with an overview of reliability principles and properties, a team of top experts describes the steps essential to ensuring high reliability and minimum downtime. They examine heat management issues, grounding systems, and all aspects of system test and measurement. They even explore disaster planning and provide guidelines for keeping a facility running under extreme circumstances. Today more than ever, the reliability of a system can have a direct and immediate impact on the profitability of an operation. Advocating a carefully planned, systematic maintenance program, the richly illustrated Electronic Systems Maintenance Handbook helps engineers and technicians meet the challenges inherent in modern electronic equipment and ensure top quality performance from each piece of hardware.

SMT Soldering Handbook

Author : RUDOLF STRAUSS
Publisher : Elsevier
ISBN 13 : 0080480977
Total Pages : 389 pages
Book Rating : 4.0/5 (84 download)

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Book Synopsis SMT Soldering Handbook by : RUDOLF STRAUSS

Download or read book SMT Soldering Handbook written by RUDOLF STRAUSS and published by Elsevier. This book was released on 1998-02-24 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. - Written by founding father of SMT technology - Standard specifications have been fully updated - New chapter covering Ball Grid Array (BGA) technology

Reflow Soldering Processes

Author : Ning-Cheng Lee
Publisher : Newnes
ISBN 13 : 0750672188
Total Pages : 282 pages
Book Rating : 4.7/5 (56 download)

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Book Synopsis Reflow Soldering Processes by : Ning-Cheng Lee

Download or read book Reflow Soldering Processes written by Ning-Cheng Lee and published by Newnes. This book was released on 2002-01-11 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Mastering Surface Mount Technology

Author : Vincent Himpe
Publisher :
ISBN 13 : 9781907920127
Total Pages : 282 pages
Book Rating : 4.9/5 (21 download)

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Book Synopsis Mastering Surface Mount Technology by : Vincent Himpe

Download or read book Mastering Surface Mount Technology written by Vincent Himpe and published by . This book was released on 2012 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Soldering in Electronics Assembly

Author : MIKE JUDD
Publisher : Elsevier
ISBN 13 : 008051734X
Total Pages : 385 pages
Book Rating : 4.0/5 (85 download)

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Book Synopsis Soldering in Electronics Assembly by : MIKE JUDD

Download or read book Soldering in Electronics Assembly written by MIKE JUDD and published by Elsevier. This book was released on 1999-03-26 with total page 385 pages. Available in PDF, EPUB and Kindle. Book excerpt: Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. - A practical guide for the industry covering all the main soldering processes currently in use - Cleaning, faults, troubleshooting and standards are all major topics - Considers safety and solder process quality assessment

EMC and the Printed Circuit Board

Author : Mark I. Montrose
Publisher : John Wiley & Sons
ISBN 13 : 0471660906
Total Pages : 344 pages
Book Rating : 4.4/5 (716 download)

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Book Synopsis EMC and the Printed Circuit Board by : Mark I. Montrose

Download or read book EMC and the Printed Circuit Board written by Mark I. Montrose and published by John Wiley & Sons. This book was released on 2004-04-05 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: This accessible, new reference work shows how and why RF energy iscreated within a printed circuit board and the manner in whichpropagation occurs. With lucid explanations, this book enablesengineers to grasp both the fundamentals of EMC theory and signalintegrity and the mitigation process needed to prevent an EMCevent. Author Montrose also shows the relationship between time andfrequency domains to help you meet mandatory compliancerequirements placed on printed circuit boards. Using real-world examples the book features: Clear discussions, without complex mathematical analysis, offlux minimization concepts Extensive analysis of capacitor usage for variousapplications Detailed examination of components characteristics with variousgrounding methodologies, including implementation techniques An in-depth study of transmission line theory A careful look at signal integrity, crosstalk, andtermination

Statistical Process Control for Surface Mount Technology

Author : William Samuel Messina
Publisher :
ISBN 13 : 9780967503394
Total Pages : 0 pages
Book Rating : 4.5/5 (33 download)

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Book Synopsis Statistical Process Control for Surface Mount Technology by : William Samuel Messina

Download or read book Statistical Process Control for Surface Mount Technology written by William Samuel Messina and published by . This book was released on 1999 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The books is divided into two parts. Part I provides an overview of the methods of data slejthing. Part II provides a case study approach to the implementation of SPC throughout the whole SMT manufacturing line. It stants with how to qualify the raw material from the supplier to the implementation of SPC for final test of the printed circuit board.

Mining Massive Data Sets for Security

Author : Françoise Fogelman-Soulié
Publisher : IOS Press
ISBN 13 : 1586038982
Total Pages : 388 pages
Book Rating : 4.5/5 (86 download)

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Book Synopsis Mining Massive Data Sets for Security by : Françoise Fogelman-Soulié

Download or read book Mining Massive Data Sets for Security written by Françoise Fogelman-Soulié and published by IOS Press. This book was released on 2008 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: The real power for security applications will come from the synergy of academic and commercial research focusing on the specific issue of security. This book is suitable for those interested in understanding the techniques for handling very large data sets and how to apply them in conjunction for solving security issues.

Computer Integrated Electronics Manufacturing and Testing

Author : Arabian
Publisher : CRC Press
ISBN 13 : 9780824778491
Total Pages : 620 pages
Book Rating : 4.7/5 (784 download)

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Book Synopsis Computer Integrated Electronics Manufacturing and Testing by : Arabian

Download or read book Computer Integrated Electronics Manufacturing and Testing written by Arabian and published by CRC Press. This book was released on 1989-09-01 with total page 620 pages. Available in PDF, EPUB and Kindle. Book excerpt: Describes this process at it relates to the electronics industry, focusing on such areas as printed wiring boards, networking, automatic assembly, surface mount technology, tape automated bonding, bar coding, and electro-static discharge. Also studies the effects of group work ethics as a factor in

Handbook of Microwave Component Measurements

Author : Joel P. Dunsmore
Publisher : John Wiley & Sons
ISBN 13 : 1119477131
Total Pages : 852 pages
Book Rating : 4.1/5 (194 download)

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Book Synopsis Handbook of Microwave Component Measurements by : Joel P. Dunsmore

Download or read book Handbook of Microwave Component Measurements written by Joel P. Dunsmore and published by John Wiley & Sons. This book was released on 2020-06-29 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Microwave Component Measurements Second Edition is a fully updated, complete reference to this topic, focusing on the modern measurement tools, such as a Vector Network Analyzer (VNA), gathering in one place all the concepts, formulas, and best practices of measurement science. It includes basic concepts in each chapter as well as appendices which provide all the detail needed to understand the science behind microwave measurements. The book offers an insight into the best practices for ascertaining the true nature of the device-under-test (DUT), optimizing the time to setup and measure, and to the greatest extent possible, remove the effects of the measuring equipment from that result. Furthermore, the author writes with a simplicity that is easily accessible to the student or new engineer, yet is thorough enough to provide details of measurement science for even the most advanced applications and researchers. This welcome new edition brings forward the most modern techniques used in industry today, and recognizes that more new techniques have developed since the first edition published in 2012. Whilst still focusing on the VNA, these techniques are also compatible with other vendor's advanced equipment, providing a comprehensive industry reference.

Solder Joint Reliability Assessment

Author : Mohd N. Tamin
Publisher : Springer Science & Business
ISBN 13 : 3319000926
Total Pages : 179 pages
Book Rating : 4.3/5 (19 download)

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Book Synopsis Solder Joint Reliability Assessment by : Mohd N. Tamin

Download or read book Solder Joint Reliability Assessment written by Mohd N. Tamin and published by Springer Science & Business. This book was released on 2014-04-26 with total page 179 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.

Embedded Systems

Author : Kiyofumi Tanaka
Publisher : BoD – Books on Demand
ISBN 13 : 9535103504
Total Pages : 292 pages
Book Rating : 4.5/5 (351 download)

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Book Synopsis Embedded Systems by : Kiyofumi Tanaka

Download or read book Embedded Systems written by Kiyofumi Tanaka and published by BoD – Books on Demand. This book was released on 2012-03-16 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nowadays, embedded systems - computer systems that are embedded in various kinds of devices and play an important role of specific control functions, have permeated various scenes of industry. Therefore, we can hardly discuss our life or society from now onwards without referring to embedded systems. For wide-ranging embedded systems to continue their growth, a number of high-quality fundamental and applied researches are indispensable. This book contains 13 excellent chapters and addresses a wide spectrum of research topics of embedded systems, including parallel computing, communication architecture, application-specific systems, and embedded systems projects. Embedded systems can be made only after fusing miscellaneous technologies together. Various technologies condensed in this book as well as in the complementary book "Embedded Systems - Theory and Design Methodology", will be helpful to researchers and engineers around the world.

The Printed Circuit Assembler's Guide To... Solder Defects

Author : Indium Corporation
Publisher :
ISBN 13 : 9781737023289
Total Pages : pages
Book Rating : 4.0/5 (232 download)

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Book Synopsis The Printed Circuit Assembler's Guide To... Solder Defects by : Indium Corporation

Download or read book The Printed Circuit Assembler's Guide To... Solder Defects written by Indium Corporation and published by . This book was released on 2021-11-12 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. Indium Corporations' Christopher Nash and Dr. Ronald C. Lasky address six top defect topics, as well as how to avoid them, including (1) voiding in bottom-termination components, (2) graping, (3) head-in-pillow and non-wet opens, (4) tombstoning of passive components, (5) insufficients, and (6) solder balling and beading. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.

A Beginners Guide to Surface Mount Technology

Author : RATAN SENGUPTA
Publisher : Blue Rose Publishers
ISBN 13 :
Total Pages : 103 pages
Book Rating : 4./5 ( download)

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Book Synopsis A Beginners Guide to Surface Mount Technology by : RATAN SENGUPTA

Download or read book A Beginners Guide to Surface Mount Technology written by RATAN SENGUPTA and published by Blue Rose Publishers. This book was released on 2022-12-30 with total page 103 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through hole technology (THT). SMT comes into existence because our earlier version of Through Hole Manufacturing Technology (THT)were having following limitations: 1.Large in Size 2.Only one side of PCB can be used 3.Lesser functions 4.Automation of PCB Assembly restricted 5.Cross Talk becomes predominating factor at Higher Frequency, restricting evolution of Mobile Technology.

Solder Joint Reliability

Author : John H. Lau
Publisher : Springer Science & Business Media
ISBN 13 : 1461539102
Total Pages : 649 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Solder Joint Reliability by : John H. Lau

Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 649 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.