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Surface Mount Technology For Concurrent Engineering And Manufacturing
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Book Synopsis Surface Mount Technology for Concurrent Engineering and Manufacturing by : Frank Classon
Download or read book Surface Mount Technology for Concurrent Engineering and Manufacturing written by Frank Classon and published by McGraw-Hill Companies. This book was released on 1993 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: A guide to gaining the valuable miniaturization and cost-saving benefits of surface mount technology (SMT), showing how to integrate multiple company functions - designs, manufacturing, testing and management - and save time and money at every stage.
Book Synopsis Surface-mount Technology for PC Boards by : Glenn R. Blackwell
Download or read book Surface-mount Technology for PC Boards written by Glenn R. Blackwell and published by Delmar Thomson Learning. This book was released on 2006 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: Learn to generate high manufacturing yields, low testing costs, and reproducible designs using the latest components of surface mount technology (SMT)! Manufacturers, managers, engineers, students, and others who work with printed-circuit boards will find a wealth of cutting-edge information about SMT and fine pitch technology (FPT) in this new edition. Practical data and clear illustrations combine to clearly and accurately present the details of design-for-manufacturability, environmental compliance, design-for-test, and quality/reliability for today's miniaturized electronics packaging.
Book Synopsis Surface Mount Technology by : Ray Prasad
Download or read book Surface Mount Technology written by Ray Prasad and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 791 pages. Available in PDF, EPUB and Kindle. Book excerpt: A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.
Book Synopsis Application of AI in Manufacturing by : Stephanus Johannes Minnaar
Download or read book Application of AI in Manufacturing written by Stephanus Johannes Minnaar and published by . This book was released on 1992 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Fine Pitch Surface Mount Technology by : Phil Marcoux
Download or read book Fine Pitch Surface Mount Technology written by Phil Marcoux and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.
Book Synopsis Design Guidelines for Surface Mount Technology by : John Traister
Download or read book Design Guidelines for Surface Mount Technology written by John Traister and published by Elsevier. This book was released on 2012-12-02 with total page 326 pages. Available in PDF, EPUB and Kindle. Book excerpt: Design Guidelines for Surface Mount Technology covers the basics and the mechanics of surface mounted design technology. Surface mount technology (SMT) embodies an automated circuit assembly process, using a generation of electronic components called surface mounted devices (SMDs). Organized into eight chapters, the book discusses the component selection, space planning, materials and processes, and total concept needed to ensure a manufacturable design. The opening chapters of the book examine the significant requirements and variables affecting SMT and SMDs. The book then deals with the substrate materials specifications, including fabrication and material planning, assembly, design rules, layout guidelines, package outlines, and bar code labeling. The next chapters describe the manufacturing and assembly processes in SMDs and process-proven footprint patterns for each of the component types used, as well as guidelines for creating a suitable pattern on future products. Other chapters discuss the component spacing requirements for SMT and the generation of footprint patterns for passive and active components of SMDs. The concluding chapter describes the design criteria for maximizing machine insertion of leaded electronic components into printed circuit boards (PCBs). These criteria aid the PCB designer by detailing the considerations and some of the trade-offs that will provide reliable insertion in a production environment. Supplementary texts on surface mount equipment, supplies, and services are also provided. Design engineers and researchers will find this book invaluable.
Book Synopsis Surface Mount Technology Terms and Concepts by : Phil Zarrow
Download or read book Surface Mount Technology Terms and Concepts written by Phil Zarrow and published by Newnes. This book was released on 1997-08-21 with total page 145 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surface Mount Technology Terms and Concepts is an invaluable resource for anyone involved in SMT. This book clearly defines more than 1000 of the most commonly used terms and concepts. By far the most comprehensive glossary of its kind, as well as more accessible and readable than most technical books devoted to assembly, Surface Mount Technology Terms and Concepts contains all of the terms that engineers and managers engaged in surface mount process, manufacturing, quality, design, and purchasing may encounter.
Book Synopsis Surface Mount Technology with Fine Pitch Components by : H. Danielsson
Download or read book Surface Mount Technology with Fine Pitch Components written by H. Danielsson and published by Springer. This book was released on 1995 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is a state-of-the-art guide to SMT with fine pitch components intended for professionals in electronics manufacturing. The overriding objective is to equip manufacturing people in the electronics industry with a better understanding of the manufacturing processes involved.
Book Synopsis Surface-Mount Technology For Pc Boards by : James K. Hollomon
Download or read book Surface-Mount Technology For Pc Boards written by James K. Hollomon and published by . This book was released on 1995 with total page 509 pages. Available in PDF, EPUB and Kindle. Book excerpt: Manufacturers, Managers, Engineers And Others Who Work With Printed-Circuit Boards Will Find A Wealth Of Information About Surface-Mount Technology (Smt) And Fine-Pitch Technology (Fpt) In This Book. Practical Data And Clear Illustrations Plainly Present The Details Of Design-For-Manufacturability, Environmental Compliance, Design-For-Test, And Quality/Reliability For Today's Miniaturized Electronics Packaging.
Book Synopsis The Electronic Packaging Handbook by : Glenn R. Blackwell
Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Book Synopsis Concurrent Engineering and Design for Manufacture of Electronics Products by : Sammy G. Shina
Download or read book Concurrent Engineering and Design for Manufacture of Electronics Products written by Sammy G. Shina and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 357 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is intended to introduce and familiarize design, production, quality, and process engineers, and their managers to the importance and recent developments in concurrent engineering (CE) and design for manufacturing (DFM) of new products. CE and DFM are becoming an important element of global competitiveness in terms of achieving high-quality and low-cost products. The new product design and development life cycle has become the focus of many manufacturing companies as a road map to shortening new product introduction cycles, and to achieving a quick ramp-up of production volumes. Customer expectations have increased in demanding high-quality, functional, and user-friendly products. There is little time to waste in solving manufacturing problems or in redesigning products for ease of manufacture, since product life cycles have become very short because of technological breakthroughs or competitive pressures. Another important reason for the increased attention to DFM is that global products have developed into very opposing roles: either they are commodities, with very similar features, capabilities, and specifications; or they are very focused on a market niche. In the first case, the manufacturers are competing on cost and quality, and in the second they are in race for time to market. DFM could be a very important competitive weapon in either case, for lowering cost and increasing quality; and for increasing production ramp-up to mature volumes.
Book Synopsis The Electrical Engineering Handbook,Second Edition by : Richard C. Dorf
Download or read book The Electrical Engineering Handbook,Second Edition written by Richard C. Dorf and published by CRC Press. This book was released on 1997-09-26 with total page 2758 pages. Available in PDF, EPUB and Kindle. Book excerpt: In 1993, the first edition of The Electrical Engineering Handbook set a new standard for breadth and depth of coverage in an engineering reference work. Now, this classic has been substantially revised and updated to include the latest information on all the important topics in electrical engineering today. Every electrical engineer should have an opportunity to expand his expertise with this definitive guide. In a single volume, this handbook provides a complete reference to answer the questions encountered by practicing engineers in industry, government, or academia. This well-organized book is divided into 12 major sections that encompass the entire field of electrical engineering, including circuits, signal processing, electronics, electromagnetics, electrical effects and devices, and energy, and the emerging trends in the fields of communications, digital devices, computer engineering, systems, and biomedical engineering. A compendium of physical, chemical, material, and mathematical data completes this comprehensive resource. Every major topic is thoroughly covered and every important concept is defined, described, and illustrated. Conceptually challenging but carefully explained articles are equally valuable to the practicing engineer, researchers, and students. A distinguished advisory board and contributors including many of the leading authors, professors, and researchers in the field today assist noted author and professor Richard Dorf in offering complete coverage of this rapidly expanding field. No other single volume available today offers this combination of broad coverage and depth of exploration of the topics. The Electrical Engineering Handbook will be an invaluable resource for electrical engineers for years to come.
Book Synopsis Handbook of Fine Pitch Surface Mount Technology by : John H. Lau
Download or read book Handbook of Fine Pitch Surface Mount Technology written by John H. Lau and published by Springer. This book was released on 1994 with total page 732 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surface mount technology (SMT) is a mature technology. SMT allows placement of more surface mount components (SMC) into smaller and tighter printed circuit board (PCB) areas. This increased density means increased performance and power in smaller packaging systems, and allows manufacturing of smaller and higher performance products at lower cost. The advance of integrated circuit (IC) technology and the requirements of high density for high-speed circuity is driving the design of SM C to higher pin count and smaller package size. In general, the higher pin count and smaller package size are accomplished by reducing the bond pad size and spacing (pitch) on the chip level and the lead/pin/solder dimensions and pitch on the chip carrier (module) level. The last few years have witnessed an explosive growth in the research and development efforts devoted to FPT as a direct result of the rapid growth of SMT and miniaturization. Some examples are: hand held lightweight video recorders that can take sharp pictures, hand held lightweight devices that can track the worldwide package movements, and portable computers with tiny yet powerful microprocessors and large memory capability that can fit into a briefcase or into the palm of your hand.
Book Synopsis Surface Mount Technology by : Ray P Prasad
Download or read book Surface Mount Technology written by Ray P Prasad and published by . This book was released on 1988-12-31 with total page 642 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Handbook of Surface Mount Technology by : Stephen W. Hinch
Download or read book Handbook of Surface Mount Technology written by Stephen W. Hinch and published by Longman Scientific and Technical. This book was released on 1988 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electronic Systems Maintenance Handbook by : Jerry C. Whitaker
Download or read book Electronic Systems Maintenance Handbook written by Jerry C. Whitaker and published by CRC Press. This book was released on 2017-12-19 with total page 624 pages. Available in PDF, EPUB and Kindle. Book excerpt: The days of troubleshooting a piece of gear armed only with a scope, voltmeter, and a general idea of how the hardware works are gone forever. As technology continues to drive equipment design forward, maintenance difficulties will continue to increase, and those responsible for maintaining this equipment will continue to struggle to keep up. The Electronic Systems Maintenance Handbook, Second Edition establishes a foundation for servicing, operating, and optimizing audio, video, computer, and RF systems. Beginning with an overview of reliability principles and properties, a team of top experts describes the steps essential to ensuring high reliability and minimum downtime. They examine heat management issues, grounding systems, and all aspects of system test and measurement. They even explore disaster planning and provide guidelines for keeping a facility running under extreme circumstances. Today more than ever, the reliability of a system can have a direct and immediate impact on the profitability of an operation. Advocating a carefully planned, systematic maintenance program, the richly illustrated Electronic Systems Maintenance Handbook helps engineers and technicians meet the challenges inherent in modern electronic equipment and ensure top quality performance from each piece of hardware.
Book Synopsis Surface Mount Technology by : Carmen Capillo
Download or read book Surface Mount Technology written by Carmen Capillo and published by McGraw-Hill Companies. This book was released on 1989 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt:
