Surface Mount Solder Joint Long Term Reliability

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Solder Joint Reliability

Author : John H. Lau
Publisher : Springer Science & Business Media
ISBN 13 : 1461539102
Total Pages : 649 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Solder Joint Reliability by : John H. Lau

Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 649 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.

Reliability and Failure of Electronic Materials and Devices

Author : Milton Ohring
Publisher : Academic Press
ISBN 13 : 0080575528
Total Pages : 759 pages
Book Rating : 4.0/5 (85 download)

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Book Synopsis Reliability and Failure of Electronic Materials and Devices by : Milton Ohring

Download or read book Reliability and Failure of Electronic Materials and Devices written by Milton Ohring and published by Academic Press. This book was released on 2014-10-14 with total page 759 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

Reliability, Maintainability, and Supportability

Author : Michael Tortorella
Publisher : John Wiley & Sons
ISBN 13 : 1118858883
Total Pages : 464 pages
Book Rating : 4.1/5 (188 download)

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Book Synopsis Reliability, Maintainability, and Supportability by : Michael Tortorella

Download or read book Reliability, Maintainability, and Supportability written by Michael Tortorella and published by John Wiley & Sons. This book was released on 2015-03-30 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focuses on the core systems engineering tasks of writing, managing, and tracking requirements for reliability, maintainability, and supportability that are most likely to satisfy customers and lead to success for suppliers This book helps systems engineers lead the development of systems and services whose reliability, maintainability, and supportability meet and exceed the expectations of their customers and promote success and profit for their suppliers. This book is organized into three major parts: reliability, maintainability, and supportability engineering. Within each part, there is material on requirements development, quantitative modelling, statistical analysis, and best practices in each of these areas. Heavy emphasis is placed on correct use of language. The author discusses the use of various sustainability engineering methods and techniques in crafting requirements that are focused on the customers’ needs, unambiguous, easily understood by the requirements’ stakeholders, and verifiable. Part of each major division of the book is devoted to statistical analyses needed to determine when requirements are being met by systems operating in customer environments. To further support systems engineers in writing, analyzing, and interpreting sustainability requirements, this book also Contains “Language Tips” to help systems engineers learn the different languages spoken by specialists and non-specialists in the sustainability disciplines Provides exercises in each chapter, allowing the reader to try out some of the ideas and procedures presented in the chapter Delivers end-of-chapter summaries of the current reliability, maintainability, and supportability engineering best practices for systems engineers Reliability, Maintainability, and Supportability is a reference for systems engineers and graduate students hoping to learn how to effectively determine and develop appropriate requirements so that designers may fulfil the intent of the customer.

Design and Reliability of Solders and Solder Interconnections

Author : Rao K. Mahidhara
Publisher : Minerals, Metals, & Materials Society
ISBN 13 :
Total Pages : 468 pages
Book Rating : 4.X/5 (4 download)

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Book Synopsis Design and Reliability of Solders and Solder Interconnections by : Rao K. Mahidhara

Download or read book Design and Reliability of Solders and Solder Interconnections written by Rao K. Mahidhara and published by Minerals, Metals, & Materials Society. This book was released on 1997 with total page 468 pages. Available in PDF, EPUB and Kindle. Book excerpt: The reliability of solders and solder joints is an important factor in the durability and design of electronic packages. This volume addresses issues of reliability such as microstructural stability in service, creep, fatigue, creep/fatigue interactions, and thermomechanical fatigue of bulk solders and solder joints.

Reliability Improvement with Design of Experiment

Author : Lloyd Condra
Publisher : CRC Press
ISBN 13 : 1351990918
Total Pages : 418 pages
Book Rating : 4.3/5 (519 download)

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Book Synopsis Reliability Improvement with Design of Experiment by : Lloyd Condra

Download or read book Reliability Improvement with Design of Experiment written by Lloyd Condra and published by CRC Press. This book was released on 2018-05-04 with total page 418 pages. Available in PDF, EPUB and Kindle. Book excerpt: A guide to implementing and operating a practical reliability program using carefully designed experiments to provide information quickly, efficiently and cost effectively. It emphasizes real world solutions to daily problems. The second edition contains a special expanded section demonstrating how to combine accelerated testing with design of experiments for immediate improvement.

Long-Term Non-Operating Reliability of Electronic Products

Author : Judy Pecht
Publisher : CRC Press
ISBN 13 : 1351082620
Total Pages : 130 pages
Book Rating : 4.3/5 (51 download)

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Book Synopsis Long-Term Non-Operating Reliability of Electronic Products by : Judy Pecht

Download or read book Long-Term Non-Operating Reliability of Electronic Products written by Judy Pecht and published by CRC Press. This book was released on 2019-07-23 with total page 130 pages. Available in PDF, EPUB and Kindle. Book excerpt: In today's electronic environment, operating reliability for continued daily use of electronic products is essential. This book discusses the reliability of products that lie dormant for long periods of time and are subject to stresses such as humidity, ionic contaminants, temperature, radiation, shock, and vibration. Non-operating reliability is especially critical for life-saving electronic products such as fire alarm systems, standby power sources, and burglar alarms. Air bags in automobiles, earthquake alarm systems, and radiation warning systems in nuclear power plants are also covered. This physics-of-failure approach is also important to maintaining defense hardware such as missiles and munitions systems which often lie dormant for years before being deployed on very short notice

Lead-free Soldering Process Development and Reliability

Author : Jasbir Bath
Publisher : John Wiley & Sons
ISBN 13 : 1119482038
Total Pages : 512 pages
Book Rating : 4.1/5 (194 download)

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Book Synopsis Lead-free Soldering Process Development and Reliability by : Jasbir Bath

Download or read book Lead-free Soldering Process Development and Reliability written by Jasbir Bath and published by John Wiley & Sons. This book was released on 2020-07-28 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.

Fatigue under Thermal and Mechanical Loading: Mechanisms, Mechanics and Modelling

Author : J. Bressers
Publisher : Springer Science & Business Media
ISBN 13 : 9401586365
Total Pages : 497 pages
Book Rating : 4.4/5 (15 download)

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Book Synopsis Fatigue under Thermal and Mechanical Loading: Mechanisms, Mechanics and Modelling by : J. Bressers

Download or read book Fatigue under Thermal and Mechanical Loading: Mechanisms, Mechanics and Modelling written by J. Bressers and published by Springer Science & Business Media. This book was released on 2013-04-17 with total page 497 pages. Available in PDF, EPUB and Kindle. Book excerpt: The International Symposium "Fatigue under Thermal and Mechanical Loading", held at Petten (The Netherlands) on May 22-24, 1995, was jointly organized by the Institute for Advanced Materials of The Joint Research Centre, E. C. , and by the Societe Fran~se de Metallurgie et de Materiaux. The fast heating and cooling cycles experienced by many high temperature components cause thermally induced stresses, which often operate in combination with mechanical loads. The resulting thermal / mechanical fatigue cycle leads to material degradation mechanisms and failure modes typical of service cycles. The growing awareness that the synergism between the combined thermal and mechanical loads can not be reproduced by means of isothermal tests, has resulted in an increasing interest in thermal and thermo-mechanical fatigue testing. This trend has been reinforced by the constant pull by industry for more performant, yet safer high temperature systems, pushing the materials to the limit of their properties. Dedicated ASTM meetings in particular have set the scene for this area of research. The proceedings of the symposium organized by D. A. Spera and D. F. Mowbray in 1975 provided a reference book on thermal fatigue which reflects the knowledge and experimental capabilities of the mid-seventies.

SMT Soldering Handbook

Author : RUDOLF STRAUSS
Publisher : Elsevier
ISBN 13 : 0080480977
Total Pages : 389 pages
Book Rating : 4.0/5 (84 download)

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Book Synopsis SMT Soldering Handbook by : RUDOLF STRAUSS

Download or read book SMT Soldering Handbook written by RUDOLF STRAUSS and published by Elsevier. This book was released on 1998-02-24 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. - Written by founding father of SMT technology - Standard specifications have been fully updated - New chapter covering Ball Grid Array (BGA) technology

Mechanical Analysis of Electronic Packaging Systems

Author : Mckeown
Publisher : CRC Press
ISBN 13 : 9780824770334
Total Pages : 382 pages
Book Rating : 4.7/5 (73 download)

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Book Synopsis Mechanical Analysis of Electronic Packaging Systems by : Mckeown

Download or read book Mechanical Analysis of Electronic Packaging Systems written by Mckeown and published by CRC Press. This book was released on 1999-04-06 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."

Surface Mount Technology

Author : Ray Prasad
Publisher : Springer Science & Business Media
ISBN 13 : 1461540844
Total Pages : 791 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Surface Mount Technology by : Ray Prasad

Download or read book Surface Mount Technology written by Ray Prasad and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 791 pages. Available in PDF, EPUB and Kindle. Book excerpt: A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.

Handbook of Materials Failure Analysis

Author : Abdel Salam Hamdy Makhlouf
Publisher : Butterworth-Heinemann
ISBN 13 : 0128113960
Total Pages : 388 pages
Book Rating : 4.1/5 (281 download)

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Book Synopsis Handbook of Materials Failure Analysis by : Abdel Salam Hamdy Makhlouf

Download or read book Handbook of Materials Failure Analysis written by Abdel Salam Hamdy Makhlouf and published by Butterworth-Heinemann. This book was released on 2019-10-22 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Materials Failure Analysis: With Case Studies from the Electronics Industries examines the reasons materials fail in certain situations, including material defects and mechanical failure as a result of various causes. The book begins with a general overview of materials failure analysis and its importance. It then proceeds to discussions on the types of failure analysis, specific tools and techniques, and an analysis of materials failure from various causes. As failure can occur for several reasons, including materials defects-related failure, materials design-related failure, or corrosion-related failures, the topics covered in this comprehensive source are an important tool for practitioners. - Provides the most up-to-date and balanced coverage of failure analysis, combining foundational knowledge and current research on the latest developments and innovations in the field - Offers an ideal accompaniment for those interested in materials forensic investigation, failure of materials, static failure analysis, dynamic failure analysis, and fatigue life prediction - Presents compelling new case studies from key industries to demonstrate concepts

Influence of Temperature on Microelectronics and System Reliability

Author : Pradeep Lall
Publisher : CRC Press
ISBN 13 : 0429611110
Total Pages : 327 pages
Book Rating : 4.4/5 (296 download)

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Book Synopsis Influence of Temperature on Microelectronics and System Reliability by : Pradeep Lall

Download or read book Influence of Temperature on Microelectronics and System Reliability written by Pradeep Lall and published by CRC Press. This book was released on 2020-07-09 with total page 327 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The

Practical Reliability Engineering

Author : Patrick O'Connor
Publisher : John Wiley & Sons
ISBN 13 : 0470979828
Total Pages : 491 pages
Book Rating : 4.4/5 (79 download)

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Book Synopsis Practical Reliability Engineering by : Patrick O'Connor

Download or read book Practical Reliability Engineering written by Patrick O'Connor and published by John Wiley & Sons. This book was released on 2012-01-30 with total page 491 pages. Available in PDF, EPUB and Kindle. Book excerpt: With emphasis on practical aspects of engineering, this bestseller has gained worldwide recognition through progressive editions as the essential reliability textbook. This fifth edition retains the unique balanced mixture of reliability theory and applications, thoroughly updated with the latest industry best practices. Practical Reliability Engineering fulfils the requirements of the Certified Reliability Engineer curriculum of the American Society for Quality (ASQ). Each chapter is supported by practice questions, and a solutions manual is available to course tutors via the companion website. Enhanced coverage of mathematics of reliability, physics of failure, graphical and software methods of failure data analysis, reliability prediction and modelling, design for reliability and safety as well as management and economics of reliability programmes ensures continued relevance to all quality assurance and reliability courses. Notable additions include: New chapters on applications of Monte Carlo simulation methods and reliability demonstration methods. Software applications of statistical methods, including probability plotting and a wider use of common software tools. More detailed descriptions of reliability prediction methods. Comprehensive treatment of accelerated test data analysis and warranty data analysis. Revised and expanded end-of-chapter tutorial sections to advance students’ practical knowledge. The fifth edition will appeal to a wide range of readers from college students to seasoned engineering professionals involved in the design, development, manufacture and maintenance of reliable engineering products and systems. www.wiley.com/go/oconnor_reliability5

The Electronic Packaging Handbook

Author : Glenn R. Blackwell
Publisher : CRC Press
ISBN 13 : 1351835548
Total Pages : 937 pages
Book Rating : 4.3/5 (518 download)

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Book Synopsis The Electronic Packaging Handbook by : Glenn R. Blackwell

Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 937 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

Author : Karl J. Puttlitz
Publisher : CRC Press
ISBN 13 : 0203021487
Total Pages : 1044 pages
Book Rating : 4.2/5 (3 download)

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Book Synopsis Handbook of Lead-Free Solder Technology for Microelectronic Assemblies by : Karl J. Puttlitz

Download or read book Handbook of Lead-Free Solder Technology for Microelectronic Assemblies written by Karl J. Puttlitz and published by CRC Press. This book was released on 2004-02-27 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif

Transactions on Engineering Technologies

Author : Gi-Chul Yang
Publisher : Springer
ISBN 13 : 9401798044
Total Pages : 760 pages
Book Rating : 4.4/5 (17 download)

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Book Synopsis Transactions on Engineering Technologies by : Gi-Chul Yang

Download or read book Transactions on Engineering Technologies written by Gi-Chul Yang and published by Springer. This book was released on 2015-05-07 with total page 760 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume contains fifty-one revised and extended research articles written by prominent researchers participating in the international conference on Advances in Engineering Technologies and Physical Science (London, UK, 2-4 July, 2014), under the World Congress on Engineering 2014 (WCE 2014). Topics covered include mechanical engineering, bioengineering, internet engineering, wireless networks, image engineering, manufacturing engineering and industrial applications. The book offers an overview of the tremendous advances made recently in engineering technologies and the physical sciences and their applications and also serves as an excellent reference for researchers and graduate students working in these fields.