Read Books Online and Download eBooks, EPub, PDF, Mobi, Kindle, Text Full Free.
Download Solder Paste Applications For Surface Mount Technology Used In Pc Manufacture full books in PDF, epub, and Kindle. Read online Solder Paste Applications For Surface Mount Technology Used In Pc Manufacture ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Author : James K. Hollomon
Publisher : Sams Technical Publishing
ISBN 13 :
Total Pages : 538 pages
Book Rating : 4.:/5 (318 download)
Download or read book Surface-mount Technology for PC Board Design written by James K. Hollomon and published by Sams Technical Publishing. This book was released on 1989 with total page 538 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : John Traister
Publisher : Elsevier
ISBN 13 : 032314165X
Total Pages : 326 pages
Book Rating : 4.3/5 (231 download)
Download or read book Design Guidelines for Surface Mount Technology written by John Traister and published by Elsevier. This book was released on 2012-12-02 with total page 326 pages. Available in PDF, EPUB and Kindle. Book excerpt: Design Guidelines for Surface Mount Technology covers the basics and the mechanics of surface mounted design technology. Surface mount technology (SMT) embodies an automated circuit assembly process, using a generation of electronic components called surface mounted devices (SMDs). Organized into eight chapters, the book discusses the component selection, space planning, materials and processes, and total concept needed to ensure a manufacturable design. The opening chapters of the book examine the significant requirements and variables affecting SMT and SMDs. The book then deals with the substrate materials specifications, including fabrication and material planning, assembly, design rules, layout guidelines, package outlines, and bar code labeling. The next chapters describe the manufacturing and assembly processes in SMDs and process-proven footprint patterns for each of the component types used, as well as guidelines for creating a suitable pattern on future products. Other chapters discuss the component spacing requirements for SMT and the generation of footprint patterns for passive and active components of SMDs. The concluding chapter describes the design criteria for maximizing machine insertion of leaded electronic components into printed circuit boards (PCBs). These criteria aid the PCB designer by detailing the considerations and some of the trade-offs that will provide reliable insertion in a production environment. Supplementary texts on surface mount equipment, supplies, and services are also provided. Design engineers and researchers will find this book invaluable.
Download or read book InfoWorld written by and published by . This book was released on 1987-05-11 with total page 88 pages. Available in PDF, EPUB and Kindle. Book excerpt: InfoWorld is targeted to Senior IT professionals. Content is segmented into Channels and Topic Centers. InfoWorld also celebrates people, companies, and projects.
Author : Glenn R. Blackwell
Publisher : Delmar Thomson Learning
ISBN 13 :
Total Pages : 548 pages
Book Rating : 4.3/5 (91 download)
Download or read book Surface-mount Technology for PC Boards written by Glenn R. Blackwell and published by Delmar Thomson Learning. This book was released on 2006 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: Learn to generate high manufacturing yields, low testing costs, and reproducible designs using the latest components of surface mount technology (SMT)! Manufacturers, managers, engineers, students, and others who work with printed-circuit boards will find a wealth of cutting-edge information about SMT and fine pitch technology (FPT) in this new edition. Practical data and clear illustrations combine to clearly and accurately present the details of design-for-manufacturability, environmental compliance, design-for-test, and quality/reliability for today's miniaturized electronics packaging.
Author : Glenn R. Blackwell
Publisher : CRC Press
ISBN 13 : 9781420049848
Total Pages : 648 pages
Book Rating : 4.0/5 (498 download)
Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Author : James J. Licari
Publisher : William Andrew
ISBN 13 : 1437778909
Total Pages : 415 pages
Book Rating : 4.4/5 (377 download)
Download or read book Adhesives Technology for Electronic Applications written by James J. Licari and published by William Andrew. This book was released on 2011-06-24 with total page 415 pages. Available in PDF, EPUB and Kindle. Book excerpt: Approx.512 pagesApprox.512 pages
Author : Karl J. Puttlitz
Publisher : CRC Press
ISBN 13 : 0203021487
Total Pages : 1044 pages
Book Rating : 4.2/5 (3 download)
Download or read book Handbook of Lead-Free Solder Technology for Microelectronic Assemblies written by Karl J. Puttlitz and published by CRC Press. This book was released on 2004-02-27 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif
Author : Ning-Cheng Lee
Publisher : Newnes
ISBN 13 : 0750672188
Total Pages : 282 pages
Book Rating : 4.7/5 (56 download)
Download or read book Reflow Soldering Processes written by Ning-Cheng Lee and published by Newnes. This book was released on 2002-01-11 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Author : Kwang-lung Lin
Publisher : World Scientific
ISBN 13 : 9813238216
Total Pages : 388 pages
Book Rating : 4.8/5 (132 download)
Download or read book Solder Materials written by Kwang-lung Lin and published by World Scientific. This book was released on 2018-07-13 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.
Author : Richard C. Dorf
Publisher : CRC Press
ISBN 13 : 9781420049763
Total Pages : 2758 pages
Book Rating : 4.0/5 (497 download)
Download or read book The Electrical Engineering Handbook,Second Edition written by Richard C. Dorf and published by CRC Press. This book was released on 1997-09-26 with total page 2758 pages. Available in PDF, EPUB and Kindle. Book excerpt: In 1993, the first edition of The Electrical Engineering Handbook set a new standard for breadth and depth of coverage in an engineering reference work. Now, this classic has been substantially revised and updated to include the latest information on all the important topics in electrical engineering today. Every electrical engineer should have an opportunity to expand his expertise with this definitive guide. In a single volume, this handbook provides a complete reference to answer the questions encountered by practicing engineers in industry, government, or academia. This well-organized book is divided into 12 major sections that encompass the entire field of electrical engineering, including circuits, signal processing, electronics, electromagnetics, electrical effects and devices, and energy, and the emerging trends in the fields of communications, digital devices, computer engineering, systems, and biomedical engineering. A compendium of physical, chemical, material, and mathematical data completes this comprehensive resource. Every major topic is thoroughly covered and every important concept is defined, described, and illustrated. Conceptually challenging but carefully explained articles are equally valuable to the practicing engineer, researchers, and students. A distinguished advisory board and contributors including many of the leading authors, professors, and researchers in the field today assist noted author and professor Richard Dorf in offering complete coverage of this rapidly expanding field. No other single volume available today offers this combination of broad coverage and depth of exploration of the topics. The Electrical Engineering Handbook will be an invaluable resource for electrical engineers for years to come.
Author : Jerry C. Whitaker
Publisher : CRC Press
ISBN 13 : 1420036858
Total Pages : 624 pages
Book Rating : 4.4/5 (2 download)
Download or read book Electronic Systems Maintenance Handbook written by Jerry C. Whitaker and published by CRC Press. This book was released on 2017-12-19 with total page 624 pages. Available in PDF, EPUB and Kindle. Book excerpt: The days of troubleshooting a piece of gear armed only with a scope, voltmeter, and a general idea of how the hardware works are gone forever. As technology continues to drive equipment design forward, maintenance difficulties will continue to increase, and those responsible for maintaining this equipment will continue to struggle to keep up. The Electronic Systems Maintenance Handbook, Second Edition establishes a foundation for servicing, operating, and optimizing audio, video, computer, and RF systems. Beginning with an overview of reliability principles and properties, a team of top experts describes the steps essential to ensuring high reliability and minimum downtime. They examine heat management issues, grounding systems, and all aspects of system test and measurement. They even explore disaster planning and provide guidelines for keeping a facility running under extreme circumstances. Today more than ever, the reliability of a system can have a direct and immediate impact on the profitability of an operation. Advocating a carefully planned, systematic maintenance program, the richly illustrated Electronic Systems Maintenance Handbook helps engineers and technicians meet the challenges inherent in modern electronic equipment and ensure top quality performance from each piece of hardware.
Author : John E. Traister
Publisher :
ISBN 13 :
Total Pages : 468 pages
Book Rating : 4.:/5 (41 download)
Download or read book Design Guidelines for Surface Mount Technology written by John E. Traister and published by . This book was released on 1990 with total page 468 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Yi-Kuei Lin
Publisher : Springer Science & Business Media
ISBN 13 : 9814451983
Total Pages : 1545 pages
Book Rating : 4.8/5 (144 download)
Download or read book Proceedings of the Institute of Industrial Engineers Asian Conference 2013 written by Yi-Kuei Lin and published by Springer Science & Business Media. This book was released on 2013-07-12 with total page 1545 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is based on the research papers presented during The Institute of Industrial Engineers Asian Conference 2013 held at Taipei in July 2013. It presents information on the most recent and relevant research, theories and practices in industrial and systems engineering. Key topics include: Engineering and Technology Management Engineering Economy and Cost Analysis Engineering Education and Training Facilities Planning and Management Global Manufacturing and Management Human Factors Industrial & Systems Engineering Education Information Processing and Engineering Intelligent Systems Manufacturing Systems Operations Research Production Planning and Control Project Management Quality Control and Management Reliability and Maintenance Engineering Safety, Security and Risk Management Supply Chain Management Systems Modeling and Simulation Large scale complex systems
Author : Marlene G. Rosato
Publisher : Springer Science & Business Media
ISBN 13 : 146154579X
Total Pages : 696 pages
Book Rating : 4.4/5 (615 download)
Download or read book Concise Encyclopedia of Plastics written by Marlene G. Rosato and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 696 pages. Available in PDF, EPUB and Kindle. Book excerpt: After over a century of worldwide production of all kinds trol persons, cost estimators, buyers, vendors, consultants, of products, the plastics industry is now the fourth largest and others. industry in the United States. This brief, concise, and prac The bulk of the book is the alphabetical listing of en tical book is a cutting edge compendium of the plastics tries. Preceding those entries is A Plastics Overview: Fig industry's information and terminology-ranging from ures and Tables (which presents eight summary guides on design, materials, and processes, to testing, quality control, the subjects examined in the text) and then the World of regulations, legal matters, and profitability. New and use Plastics Reviews (which presents 14 articles that provide ful developments in plastic materials and processing con general introductory information, comprehensive updates, tinually are on the horizon, and the examples of these de and important networking avenues within the world of velopments that are discussed in the book provide guides plastics). Following the alphabetical listing of entries, at the to past and future trends. end of the encyclopedia, seven appendices provide back This practical and comprehensive book reviews the ground and source guide information keyed to the text of the book. The extensive and useful Appendix A, List of plastics industry virtually from A to Z through its more than 25,000 entries. Its concise entries cover the basic is Abbreviations, lists all abbreviations used in the text.
Author : D.V. Rosato
Publisher : Springer Science & Business Media
ISBN 13 : 9780792373162
Total Pages : 864 pages
Book Rating : 4.3/5 (731 download)
Download or read book Plastics Institute of America Plastics Engineering, Manufacturing & Data Handbook written by D.V. Rosato and published by Springer Science & Business Media. This book was released on 2001-11-30 with total page 864 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a simplified, practical, and innovative approach to understanding the design and manufacture of plastic products in the World of Plastics. The concise and comprehensive information defines and focuses on past, current, and future technical trends. The handbook reviews over 20,000 different subjects; and contains over 1,000 figures and more than 400 tables. Various plastic materials and their behavior patterns are reviewed. Examples are provided of different plastic products and relating to them critical factors that range from meeting performance requirements in different environments to reducing costs and targeting for zero defects. This book provides the reader with useful pertinent information readily available as summarized in the Table of Contents, List of References and the Index.
Author :
Publisher :
ISBN 13 :
Total Pages : 878 pages
Book Rating : 4.F/5 ( download)
Download or read book Surface Mount Technology (SMT) written by and published by . This book was released on 1984 with total page 878 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Rao Tummala
Publisher : Springer Science & Business Media
ISBN 13 : 9780412084515
Total Pages : 662 pages
Book Rating : 4.0/5 (845 download)
Download or read book Microelectronics Packaging Handbook written by Rao Tummala and published by Springer Science & Business Media. This book was released on 1997-01-31 with total page 662 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
