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Author :
Publisher :
ISBN 13 :
Total Pages : 392 pages
Book Rating : 4.3/5 (91 download)
Download or read book Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by . This book was released on 2005 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Alhussein Albarbar
Publisher : Springer
ISBN 13 : 3319598287
Total Pages : 224 pages
Book Rating : 4.3/5 (195 download)
Download or read book Thermal Analysis of Power Electronic Devices Used in Renewable Energy Systems written by Alhussein Albarbar and published by Springer. This book was released on 2017-07-19 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book analyzes the thermal characteristics of power electronic devices (PEDs) with a focus on those used in wind and solar energy systems. The authors focus on the devices used in such applications, for example boost converters and inverters under different operating conditions. The book explains in detail finite element modeling techniques, setting up measuring systems, data analysis, and PEDs’ lifetime calculations. It is appropriate reading for graduate students and researchers who focus on the design and reliability of power electronic devices.
Author :
Publisher :
ISBN 13 :
Total Pages : 206 pages
Book Rating : 4.3/5 (91 download)
Download or read book Proceedings written by and published by . This book was released on 1995 with total page 206 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 272 pages
Book Rating : 4.X/5 (4 download)
Download or read book Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1996 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Institute of Electrical and Electronics Engineers
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 312 pages
Book Rating : 4.X/5 (4 download)
Download or read book 1997 IEEE 13th Annual Semiconductor Thermal Measurement & Management Symposium written by Institute of Electrical and Electronics Engineers and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1997 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume features coverage of new developments in and applications relating to generation and removal of heat within semiconductor devices, and measurement of junction temperatures under various application and environmental conditions.
Author : Márta Rencz
Publisher : MDPI
ISBN 13 : 303943831X
Total Pages : 310 pages
Book Rating : 4.0/5 (394 download)
Download or read book Thermal and Electro-thermal System Simulation 2020 written by Márta Rencz and published by MDPI. This book was released on 2021-01-12 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
Author : Karl J. Puttlitz
Publisher : Springer Science & Business Media
ISBN 13 : 9780792379195
Total Pages : 1262 pages
Book Rating : 4.3/5 (791 download)
Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2001 with total page 1262 pages. Available in PDF, EPUB and Kindle. Book excerpt: Presents the geography, history, people, places, and economy of Tennessee.
Author :
Publisher :
ISBN 13 :
Total Pages : 838 pages
Book Rating : 4.F/5 ( download)
Download or read book Future Energy Conferences and Symposia written by and published by . This book was released on 1989 with total page 838 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Duixian Liu
Publisher : John Wiley & Sons
ISBN 13 : 1119556651
Total Pages : 492 pages
Book Rating : 4.1/5 (195 download)
Download or read book Antenna-in-Package Technology and Applications written by Duixian Liu and published by John Wiley & Sons. This book was released on 2020-03-03 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Author : Yatish T. Shah
Publisher : CRC Press
ISBN 13 : 1315305941
Total Pages : 854 pages
Book Rating : 4.3/5 (153 download)
Download or read book Thermal Energy written by Yatish T. Shah and published by CRC Press. This book was released on 2018-01-12 with total page 854 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book details sources of thermal energy, methods of capture, and applications. It describes the basics of thermal energy, including measuring thermal energy, laws of thermodynamics that govern its use and transformation, modes of thermal energy, conventional processes, devices and materials, and the methods by which it is transferred. It covers 8 sources of thermal energy: combustion, fusion (solar) fission (nuclear), geothermal, microwave, plasma, waste heat, and thermal energy storage. In each case, the methods of production and capture and its uses are described in detail. It also discusses novel processes and devices used to improve transfer and transformation processes.
Author : National Semiconductor Metrology Program (U.S.)
Publisher :
ISBN 13 :
Total Pages : 148 pages
Book Rating : 4.3/5 ( download)
Download or read book National Semiconductor Metrology Program written by National Semiconductor Metrology Program (U.S.) and published by . This book was released on 1999 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Jing Liu
Publisher : World Scientific
ISBN 13 : 9811245878
Total Pages : 961 pages
Book Rating : 4.8/5 (112 download)
Download or read book Advanced Liquid Metal Cooling For Chip, Device And System written by Jing Liu and published by World Scientific. This book was released on 2022-04-08 with total page 961 pages. Available in PDF, EPUB and Kindle. Book excerpt: This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category — liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system.With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry.
Author : Marta Rencz
Publisher : Springer Nature
ISBN 13 : 3030861740
Total Pages : 389 pages
Book Rating : 4.0/5 (38 download)
Download or read book Theory and Practice of Thermal Transient Testing of Electronic Components written by Marta Rencz and published by Springer Nature. This book was released on 2023-01-23 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.
Author : Cher Ming Tan
Publisher : Woodhead Publishing
ISBN 13 : 012822407X
Total Pages : 190 pages
Book Rating : 4.1/5 (282 download)
Download or read book Reliability and Failure Analysis of High-Power LED Packaging written by Cher Ming Tan and published by Woodhead Publishing. This book was released on 2022-09-24 with total page 190 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. - Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them - Describes the chemistry underlying the material degradation and its impact on LEDs - Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs
Author : Krzysztof Górecki
Publisher : MDPI
ISBN 13 : 303650334X
Total Pages : 140 pages
Book Rating : 4.0/5 (365 download)
Download or read book Latest Advances in Electrothermal Models written by Krzysztof Górecki and published by MDPI. This book was released on 2021-03-17 with total page 140 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode–transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.
Author : Bogdan M. Wilamowski
Publisher : CRC Press
ISBN 13 : 1439802904
Total Pages : 4052 pages
Book Rating : 4.4/5 (398 download)
Download or read book The Industrial Electronics Handbook - Five Volume Set written by Bogdan M. Wilamowski and published by CRC Press. This book was released on 2011-03-04 with total page 4052 pages. Available in PDF, EPUB and Kindle. Book excerpt: Industrial electronics systems govern so many different functions that vary in complexity-from the operation of relatively simple applications, such as electric motors, to that of more complicated machines and systems, including robots and entire fabrication processes. The Industrial Electronics Handbook, Second Edition combines traditional and new
Author : Muhannad S. Bakir
Publisher : Artech House
ISBN 13 : 1596932473
Total Pages : 551 pages
Book Rating : 4.5/5 (969 download)
Download or read book Integrated Interconnect Technologies for 3D Nanoelectronic Systems written by Muhannad S. Bakir and published by Artech House. This book was released on 2008-11-30 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
