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Author : H. Baumgart
Publisher : The Electrochemical Society
ISBN 13 : 9781566773607
Total Pages : 310 pages
Book Rating : 4.7/5 (736 download)
Download or read book Semiconductor Wafer Bonding written by H. Baumgart and published by The Electrochemical Society. This book was released on 2002 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Publisher : The Electrochemical Society
ISBN 13 : 9781566774604
Total Pages : 476 pages
Book Rating : 4.7/5 (746 download)
Download or read book Semiconductor Wafer Bonding VIII : Science, Technology, and Applications written by and published by The Electrochemical Society. This book was released on 2005 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Charles E. Hunt
Publisher : The Electrochemical Society
ISBN 13 : 9781566772587
Total Pages : 498 pages
Book Rating : 4.7/5 (725 download)
Download or read book Semiconductor Wafer Bonding : Science, Technology, and Applications V written by Charles E. Hunt and published by The Electrochemical Society. This book was released on 2001 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Publisher : The Electrochemical Society
ISBN 13 : 1566776546
Total Pages : 588 pages
Book Rating : 4.5/5 (667 download)
Download or read book Semiconductor Wafer Bonding 10: Science, Technology, and Applications written by and published by The Electrochemical Society. This book was released on 2008-10 with total page 588 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.
Author :
Publisher : The Electrochemical Society
ISBN 13 : 9781566774024
Total Pages : 408 pages
Book Rating : 4.7/5 (74 download)
Download or read book Semiconductor Wafer Bonding VII : Science, Technology, and Applications written by and published by The Electrochemical Society. This book was released on 2003 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : U. Gösele
Publisher : The Electrochemical Society
ISBN 13 : 9781566771894
Total Pages : 636 pages
Book Rating : 4.7/5 (718 download)
Download or read book Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding written by U. Gösele and published by The Electrochemical Society. This book was released on 1998 with total page 636 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 524 pages
Book Rating : 4.3/5 (91 download)
Download or read book Proceedings of the ... International Symposium on Semiconductor Wafer Bonding written by and published by . This book was released on 1991 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : C. Colinge
Publisher : The Electrochemical Society
ISBN 13 : 1566778239
Total Pages : 656 pages
Book Rating : 4.5/5 (667 download)
Download or read book Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele written by C. Colinge and published by The Electrochemical Society. This book was released on 2010-10 with total page 656 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.
Author : Helmut Baumgart
Publisher : The Electrochemical Society
ISBN 13 : 156677506X
Total Pages : 398 pages
Book Rating : 4.5/5 (667 download)
Download or read book Semiconductor Wafer Bonding 9: Science, Technology, and Applications written by Helmut Baumgart and published by The Electrochemical Society. This book was released on 2006 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.
Author : C. S. Tan
Publisher : The Electrochemical Society
ISBN 13 : 1607688514
Total Pages : 258 pages
Book Rating : 4.6/5 (76 download)
Download or read book Semiconductor Wafer Bonding: Science, Technology, and Applications 15 written by C. S. Tan and published by The Electrochemical Society. This book was released on 2018-09-21 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Yoshio Nishi
Publisher : CRC Press
ISBN 13 : 1420017667
Total Pages : 1720 pages
Book Rating : 4.4/5 (2 download)
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author : Subramanian S. Iyer
Publisher : Univ. Press of Mississippi
ISBN 13 : 9780852960394
Total Pages : 180 pages
Book Rating : 4.9/5 (63 download)
Download or read book Silicon Wafer Bonding Technology written by Subramanian S. Iyer and published by Univ. Press of Mississippi. This book was released on 2002 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the essentials of silicon wafer bonding from an engineering perspective. A beginning chapter deals with basic processes of wafer bonding in detail, and subsequent chapters cover bonding by mechanical removal, the Smart Cut method of hydrogen exfoliation, the ELTRAN thinning technique and hydrogen annealing, engineering methods of wafer characterization, and quality assurance for bonded wafers. A chapter on advanced applications looks at applications in optoelectronics, very large scale integration (VLSI), microelectromechanical systems (MEMS), and photonics. A glossary is included, plus a table comparing various bonding methods. The editors work in the private sector. Annotation copyrighted by Book News, Inc., Portland, OR
Author : Yasuhisa Omura
Publisher : The Electrochemical Society
ISBN 13 : 1566778662
Total Pages : 347 pages
Book Rating : 4.5/5 (667 download)
Download or read book Advanced Semiconductor-on-Insulator Technology and Related Physics 15 written by Yasuhisa Omura and published by The Electrochemical Society. This book was released on 2011-04 with total page 347 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the continuation of the long running ¿Silicon-on-Insulator Technology and Devices¿ symposium. The issue of ECS Transactions covers recent significant advances in SOI technologies, SOI-based nanoelectronics and innovative applications including scientific interests. It will be of interest to materials and device scientists, as well as to process and applications oriented engineers and scientists.
Author : Markku Tilli
Publisher : Elsevier
ISBN 13 : 012817787X
Total Pages : 1028 pages
Book Rating : 4.1/5 (281 download)
Download or read book Handbook of Silicon Based MEMS Materials and Technologies written by Markku Tilli and published by Elsevier. This book was released on 2020-04-17 with total page 1028 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. - Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits - Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures - Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements - Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors
Author : Changhan Yun
Publisher :
ISBN 13 :
Total Pages : 252 pages
Book Rating : 4.:/5 (34 download)
Download or read book Semiconductor Wafer Bonding and Ion-cut Layer Transfer written by Changhan Yun and published by . This book was released on 2000 with total page 252 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Dongkai Shangguan
Publisher : CRC Press
ISBN 13 : 1040028691
Total Pages : 549 pages
Book Rating : 4.0/5 (4 download)
Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 549 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Author : Hans Richter
Publisher : Trans Tech Publications Ltd
ISBN 13 : 3035706611
Total Pages : 618 pages
Book Rating : 4.0/5 (357 download)
Download or read book Gettering and Defect Engineering in Semiconductor Technology VI written by Hans Richter and published by Trans Tech Publications Ltd. This book was released on 1995-07-13 with total page 618 pages. Available in PDF, EPUB and Kindle. Book excerpt: GADEST 1995 Proceedings of the 6th International Autumn Meeting on Gettering and Defect Engineering in Semiconductor Technology (GADEST '95) held in Berlin, Germany, September 1995
