Materials and Reliability Handbook for Semiconductor Optical and Electron Devices

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Author :
Publisher : Springer Science & Business Media
ISBN 13 : 1461443377
Total Pages : 618 pages
Book Rating : 4.4/5 (614 download)

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Book Synopsis Materials and Reliability Handbook for Semiconductor Optical and Electron Devices by : Osamu Ueda

Download or read book Materials and Reliability Handbook for Semiconductor Optical and Electron Devices written by Osamu Ueda and published by Springer Science & Business Media. This book was released on 2012-09-22 with total page 618 pages. Available in PDF, EPUB and Kindle. Book excerpt: Materials and Reliability Handbook for Semiconductor Optical and Electron Devices provides comprehensive coverage of reliability procedures and approaches for electron and photonic devices. These include lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Lifetime predictions for compound semiconductor devices are notoriously inaccurate due to the absence of standard protocols. Manufacturers have relied on extrapolation back to room temperature of accelerated testing at elevated temperature. This technique fails for scaled, high current density devices. Device failure is driven by electric field or current mechanisms or low activation energy processes that are masked by other mechanisms at high temperature. The Handbook addresses reliability engineering for III-V devices, including materials and electrical characterization, reliability testing, and electronic characterization. These are used to develop new simulation technologies for device operation and reliability, which allow accurate prediction of reliability as well as the design specifically for improved reliability. The Handbook emphasizes physical mechanisms rather than an electrical definition of reliability. Accelerated aging is useful only if the failure mechanism is known. The Handbook also focuses on voltage and current acceleration stress mechanisms.

Materials and Reliability Handbook for Semiconductor Optical and Electron Devices

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Author :
Publisher : Springer Science & Business Media
ISBN 13 : 1461443369
Total Pages : 618 pages
Book Rating : 4.4/5 (614 download)

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Book Synopsis Materials and Reliability Handbook for Semiconductor Optical and Electron Devices by : Osamu Ueda

Download or read book Materials and Reliability Handbook for Semiconductor Optical and Electron Devices written by Osamu Ueda and published by Springer Science & Business Media. This book was released on 2012-09-24 with total page 618 pages. Available in PDF, EPUB and Kindle. Book excerpt: Materials and Reliability Handbook for Semiconductor Optical and Electron Devices provides comprehensive coverage of reliability procedures and approaches for electron and photonic devices. These include lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Lifetime predictions for compound semiconductor devices are notoriously inaccurate due to the absence of standard protocols. Manufacturers have relied on extrapolation back to room temperature of accelerated testing at elevated temperature. This technique fails for scaled, high current density devices. Device failure is driven by electric field or current mechanisms or low activation energy processes that are masked by other mechanisms at high temperature. The Handbook addresses reliability engineering for III-V devices, including materials and electrical characterization, reliability testing, and electronic characterization. These are used to develop new simulation technologies for device operation and reliability, which allow accurate prediction of reliability as well as the design specifically for improved reliability. The Handbook emphasizes physical mechanisms rather than an electrical definition of reliability. Accelerated aging is useful only if the failure mechanism is known. The Handbook also focuses on voltage and current acceleration stress mechanisms.

Reliability and Failure of Electronic Materials and Devices

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Author :
Publisher : Academic Press
ISBN 13 : 0080575528
Total Pages : 759 pages
Book Rating : 4.0/5 (85 download)

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Book Synopsis Reliability and Failure of Electronic Materials and Devices by : Milton Ohring

Download or read book Reliability and Failure of Electronic Materials and Devices written by Milton Ohring and published by Academic Press. This book was released on 2014-10-14 with total page 759 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

Handbook of Emerging Materials for Semiconductor Industry

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Author :
Publisher : Springer Nature
ISBN 13 : 9819966493
Total Pages : 930 pages
Book Rating : 4.8/5 (199 download)

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Book Synopsis Handbook of Emerging Materials for Semiconductor Industry by : Young Suh Song

Download or read book Handbook of Emerging Materials for Semiconductor Industry written by Young Suh Song and published by Springer Nature. This book was released on with total page 930 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Reliability Design Handbook

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Publisher :
ISBN 13 :
Total Pages : 810 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis Reliability Design Handbook by : United States. Naval Ship Systems Command

Download or read book Reliability Design Handbook written by United States. Naval Ship Systems Command and published by . This book was released on 1963 with total page 810 pages. Available in PDF, EPUB and Kindle. Book excerpt:

The Reliability Handbook

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Publisher :
ISBN 13 :
Total Pages : 344 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis The Reliability Handbook by : National Semiconductor Corporation

Download or read book The Reliability Handbook written by National Semiconductor Corporation and published by . This book was released on 1987 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Handbook of Semiconductor Manufacturing Technology

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Author :
Publisher : CRC Press
ISBN 13 : 1351829823
Total Pages : 3276 pages
Book Rating : 4.3/5 (518 download)

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Book Synopsis Handbook of Semiconductor Manufacturing Technology by : Yoshio Nishi

Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 3276 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Reliability Engineering Handbook

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Author :
Publisher : DEStech Publications, Inc
ISBN 13 : 9781932078008
Total Pages : 728 pages
Book Rating : 4.0/5 (78 download)

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Book Synopsis Reliability Engineering Handbook by : Kececioglu Dimitri B

Download or read book Reliability Engineering Handbook written by Kececioglu Dimitri B and published by DEStech Publications, Inc. This book was released on 2002 with total page 728 pages. Available in PDF, EPUB and Kindle. Book excerpt: Designed to be used in engineering education and industrial practice, this book provides a comprehensive presentation of reliability engineering for optimized design engineering of products, parts, components and equipment.

Semiconductor Advanced Packaging

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Author :
Publisher : Springer Nature
ISBN 13 : 9811613761
Total Pages : 513 pages
Book Rating : 4.8/5 (116 download)

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Book Synopsis Semiconductor Advanced Packaging by : John H. Lau

Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Physics-of-Failure Based Handbook of Microelectronic Systems

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Author :
Publisher : RIAC
ISBN 13 : 1933904291
Total Pages : 271 pages
Book Rating : 4.9/5 (339 download)

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Book Synopsis Physics-of-Failure Based Handbook of Microelectronic Systems by : Shahrzad Salemi

Download or read book Physics-of-Failure Based Handbook of Microelectronic Systems written by Shahrzad Salemi and published by RIAC. This book was released on 2008 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Microelectronics Packaging Handbook

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Publisher : Springer Science & Business Media
ISBN 13 : 1461540860
Total Pages : 742 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Microelectronics Packaging Handbook by : R.R. Tummala

Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 742 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Reliability Characterisation of Electrical and Electronic Systems

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Publisher : Woodhead Publishing
ISBN 13 : 9780081029633
Total Pages : 350 pages
Book Rating : 4.0/5 (296 download)

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Book Synopsis Reliability Characterisation of Electrical and Electronic Systems by : Jonathan Swingler

Download or read book Reliability Characterisation of Electrical and Electronic Systems written by Jonathan Swingler and published by Woodhead Publishing. This book was released on 2020-11-15 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book charts how reliability engineering has moved from the use of sometimes arbitrary standards to an empirical scientific approach of understanding operating conditions, failure mechanisms, the need for testing for a more realistic characterisation and, new for the second edition, includes the monitoring of performance/robustness in the field. Reliability Characterisation of Electrical and Electronic Systems brings together a number of experts and key players in the discipline to concisely present the fundamentals and background to reliability theory, elaborate on the current thinking and developments behind reliability characterisation, and give a detailed account of emerging issues across a wide range of applications. The second edition has a new section titled Reliability Condition Monitoring and Prognostics for Specific Application which provides a guide to critical issues in key industrial sectors such as automotive and aerospace. There are also new chapters on areas of growing importance such as reliability methods in high-temperature electronics and reliability and testing of electric aircraft power systems. Reviews emerging areas of importance such as reliability methods in high-temperature electronics and reliability testing of electric vehicles Looks at the failure mechanisms, testing methods, failure analysis, characterisation techniques and prediction models that can be used to increase reliability Facilitates a greater understanding of operating conditions, failure mechanisms and the need for testing

Semiconductor Device Reliability

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Author :
Publisher : Springer Science & Business Media
ISBN 13 : 9400924828
Total Pages : 571 pages
Book Rating : 4.4/5 (9 download)

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Book Synopsis Semiconductor Device Reliability by : A. Christou

Download or read book Semiconductor Device Reliability written by A. Christou and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 571 pages. Available in PDF, EPUB and Kindle. Book excerpt: This publication is a compilation of papers presented at the Semiconductor Device Reliabi lity Workshop sponsored by the NATO International Scientific Exchange Program. The Workshop was held in Crete, Greece from June 4 to June 9, 1989. The objective of the Workshop was to review and to further explore advances in the field of semiconductor reliability through invited paper presentations and discussions. The technical emphasis was on quality assurance and reliability of optoelectronic and high speed semiconductor devices. The primary support for the meeting was provided by the Scientific Affairs Division of NATO. We are indebted to NATO for their support and to Dr. Craig Sinclair, who admin isters this program. The chapters of this book follow the format and order of the sessions of the meeting. Thirty-six papers were presented and discussed during the five-day Workshop. In addi tion, two panel sessions were held, with audience participation, where the particularly controversial topics of bum-in and reliability modeling and prediction methods were dis cussed. A brief review of these sessions is presented in this book.

AC Power Systems Handbook

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Publisher : CRC Press
ISBN 13 : 1420005812
Total Pages : 450 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis AC Power Systems Handbook by : Jerry C. Whitaker

Download or read book AC Power Systems Handbook written by Jerry C. Whitaker and published by CRC Press. This book was released on 2018-10-03 with total page 450 pages. Available in PDF, EPUB and Kindle. Book excerpt: Sooner or later, power system protection is going to cost money. How much is entirely up to you. Setting up a safe and effective AC power system from the very beginning can help avoid costly downtime and repairs, provide backup power during system outages, and minimize workplace accidents. For the past 15 years, Jerry Whitaker's AC Power Systems Handbook has supplied industry professionals with a comprehensive, practical guide to the key elements of AC power for commercial and industrial systems. This third edition is thoroughly revised and completely reorganized to reflect the changing demands of modern power systems. To ease navigation, many sections are now presented as separate chapters filled with updated and expanded information. Most notably, the author adds heavily in the areas of transient suppression hardware, electrical system components, and power system fundamentals. Following a logical progression, coverage flows from power system operation to protecting equipment loads, selecting the right level of protection, grounding, standby power, and safety. Along the way, the author paints a clear picture of the sources of disturbances, the tradeoffs involved for different options, and the advantages and limitations of various approaches. Streamlined to be a hands-on, user-oriented guide, the AC Power Systems Handbook offers expert guidance on designing and installing a safe and efficient power system.

Microelectronics Manufacturing Diagnostics Handbook

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Publisher : Springer Science & Business Media
ISBN 13 : 1461520290
Total Pages : 663 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Microelectronics Manufacturing Diagnostics Handbook by : Abraham Landzberg

Download or read book Microelectronics Manufacturing Diagnostics Handbook written by Abraham Landzberg and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 663 pages. Available in PDF, EPUB and Kindle. Book excerpt: The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.

Automotive Electronics Reliability Handbook

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Author :
Publisher : SAE International
ISBN 13 :
Total Pages : 512 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Automotive Electronics Reliability Handbook by :

Download or read book Automotive Electronics Reliability Handbook written by and published by SAE International. This book was released on 1987 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook was designed to provide the automotive electronics community with an understanding of the concepts, principles, and methodologies concerning all aspects of automotive electronic systems reliability engineering. Chapters include: Reliability Terminology Associated with Automotive Electronics; Reliability Theory; Reliability Data Analysis; Regression Analysis; Reliability Specification and Allocation; Reliability Prediction; Reliability Design Guidelines; FMEA, FTA, and SCA; Reliability Demonstration and Reliability Growth. The handbook is based upon information from several sources, which are listed at the end of each chapter.

Semiconductor Packaging

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Publisher : CRC Press
ISBN 13 : 1439862079
Total Pages : 216 pages
Book Rating : 4.4/5 (398 download)

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Book Synopsis Semiconductor Packaging by : Andrea Chen

Download or read book Semiconductor Packaging written by Andrea Chen and published by CRC Press. This book was released on 2016-04-19 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.