Rf Mems Switch Fabrication And Packaging

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RF MEMS Switch Fabrication and Packaging

Author : Lakshmi Swaminathan
Publisher :
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.:/5 (139 download)

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Book Synopsis RF MEMS Switch Fabrication and Packaging by : Lakshmi Swaminathan

Download or read book RF MEMS Switch Fabrication and Packaging written by Lakshmi Swaminathan and published by . This book was released on 2018 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: RF (Radio Frequency) MEMS (Micro Electro Mechanical Systems) technology is the application of micromachined mechanical structures, controlled by electrical signals and interacting with signals in the RF range. The applications of these devices range from switching networks for satellite communication systems to high performance resonators and tuners. RF MEMS switches are the first and foremost MEMS devices designed for RF technology. A specialized method for fabricating microsturctures called surface micromachining process is used for fabricating the RF MEMS switches. Die level packaging using available surface mount style RF packages. The packaging process involved the design of RF feed throughs on the Alumina substrates to the die attachment, wire bonding and hermetic sealing using low temperature processes.

RF MEMS Switches and Integrated Switching Circuits

Author : Ai-Qun Liu
Publisher : Springer Science & Business Media
ISBN 13 : 0387462627
Total Pages : 276 pages
Book Rating : 4.3/5 (874 download)

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Book Synopsis RF MEMS Switches and Integrated Switching Circuits by : Ai-Qun Liu

Download or read book RF MEMS Switches and Integrated Switching Circuits written by Ai-Qun Liu and published by Springer Science & Business Media. This book was released on 2010-08-09 with total page 276 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectromechanical Systems (MEMS) stand poised for the next major breakthrough in the silicon revolution that began with the transistor in the 1960s and has revolutionized microelectronics. MEMS allow one to not only observe and process information of all types from small scale systems, but also to affect changes in systems and the environment at that scale. “RF MEMS Switches and Integrated Switching Circuits” builds on the extensive body of literature that exists in research papers on analytical and numerical modeling and design based on RF MEMS switches and micromachined switching circuits, and presents a unified framework of coverage. This volume includes, but is not limited to, RF MEMS approaches, developments from RF MEMS switches to RF switching circuits, and MEMS switch components in circuit systems. This book also: -Presents RF Switches and switching circuit MEMS devices in a unified framework covering all aspects of engineering innovation, design, modeling, fabrication, control and experimental implementation -Discusses RF switch devices in detail, with both system and component-level circuit integration using micro- and nano-fabrication techniques -Includes an emphasis on design innovation and experimental relevance rather than basic electromagnetic theory and device physics “RF MEMS Switches and Integrated Switching Circuits” is perfect for engineers, researchers and students working in the fields of MEMS, circuits and systems and RFs.

RF MEMS

Author : Gabriel M. Rebeiz
Publisher : John Wiley & Sons
ISBN 13 : 0471462888
Total Pages : 512 pages
Book Rating : 4.4/5 (714 download)

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Book Synopsis RF MEMS by : Gabriel M. Rebeiz

Download or read book RF MEMS written by Gabriel M. Rebeiz and published by John Wiley & Sons. This book was released on 2004-02-06 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ultrasmall Radio Frequency and Micro-wave Microelectromechanical systems (RF MEMs), such as switches, varactors, and phase shifters, exhibit nearly zero power consumption or loss. For this reason, they are being developed intensively by corporations worldwide for use in telecommunications equipment. This book acquaints readers with the basics of RF MEMs and describes how to design practical circuits and devices with them. The author, an acknowledged expert in the field, presents a range of real-world applications and shares many valuable tricks of the trade.

Advanced MEMS Packaging

Author : John H. Lau
Publisher : McGraw Hill Professional
ISBN 13 : 0071627928
Total Pages : 577 pages
Book Rating : 4.0/5 (716 download)

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Book Synopsis Advanced MEMS Packaging by : John H. Lau

Download or read book Advanced MEMS Packaging written by John H. Lau and published by McGraw Hill Professional. This book was released on 2009-10-22 with total page 577 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging. This definitive resource helps you select reliable, creative, high-performance, robust, and cost-effective packaging techniques for MEMS devices. The book will also aid in stimulating further research and development in electrical, optical, mechanical, and thermal designs as well as materials, processes, manufacturing, testing, and reliability. Among the topics explored: Advanced IC and MEMS packaging trends MEMS devices, commercial applications, and markets More than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and handling Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding techniques Actuation mechanisms and integrated micromachining Bubble switch, optical switch, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging

Mems Packaging

Author : Yung-cheng Lee
Publisher : World Scientific
ISBN 13 : 9813229373
Total Pages : 363 pages
Book Rating : 4.8/5 (132 download)

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Book Synopsis Mems Packaging by : Yung-cheng Lee

Download or read book Mems Packaging written by Yung-cheng Lee and published by World Scientific. This book was released on 2018-01-03 with total page 363 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.

Practical Guide to RF-MEMS

Author : Jacopo Iannacci
Publisher : John Wiley & Sons
ISBN 13 : 3527673946
Total Pages : 374 pages
Book Rating : 4.5/5 (276 download)

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Book Synopsis Practical Guide to RF-MEMS by : Jacopo Iannacci

Download or read book Practical Guide to RF-MEMS written by Jacopo Iannacci and published by John Wiley & Sons. This book was released on 2013-08-12 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: Closes the gap between hardcore-theoretical and purely experimental RF-MEMS books. The book covers, from a practical viewpoint, the most critical steps that have to be taken in order to develop novel RF-MEMS device concepts. Prototypical RF-MEMS devices, both including lumped components and complex networks, are presented at the beginning of the book as reference examples, and these are then discussed from different perspectives with regard to design, simulation, packaging, testing, and post-fabrication modeling. Theoretical concepts are introduced when necessary to complement the practical hints given for all RF-MEMS development stages. Provides researchers and engineers with invaluable practical hints on how to develop novel RF-MEMS device concepts Covers all critical steps, dealing with design, simulation, optimization, characterization and fabrication of MEMS for radio-frequency applications Addresses frequently disregarded issues, explicitly treating the hard to predict interplay between the three-dimensional device structure and its electromagnetic functionality Bridges theory and experiment, fundamental concepts are introduced with the application in mind, and simulation results are validated against experimental results Appeals to the practice-oriented R&D reader: design and simulation examples are based on widely known software packages such as ANSYS and the hardware description language Verilog.

Novel RF MEMS Switch and Packaging Concepts

Author : Joachim Oberhammer
Publisher :
ISBN 13 : 9789172838314
Total Pages : 142 pages
Book Rating : 4.8/5 (383 download)

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Book Synopsis Novel RF MEMS Switch and Packaging Concepts by : Joachim Oberhammer

Download or read book Novel RF MEMS Switch and Packaging Concepts written by Joachim Oberhammer and published by . This book was released on 2004 with total page 142 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Silicon Micromachined Packages for RF MEMS Switches

Author :
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (632 download)

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Book Synopsis Silicon Micromachined Packages for RF MEMS Switches by :

Download or read book Silicon Micromachined Packages for RF MEMS Switches written by and published by . This book was released on 2001 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS technology has major applica-tions in developing smaller, faster and less energy consuming devices provided that reliability of pack-aging/ interconnect technology is sufficiently addressed. This paper presents a low cost, on-wafer, silicon mi-cromachined packaging scheme for RF MEMS switches having excellent electrical performance in K-band. In particular, the package demonstrates an insertion loss of 0.1dB and a return loss of 32dB at 20 GHz. The package is fabricated in parallel with the MEMS switch on the same wafer and therefore requires no lossy solder bumps or bond wires to achieve signal propagation.

Micro Electro Mechanical Systems

Author : Qing-An Huang
Publisher : Springer
ISBN 13 : 9789811059445
Total Pages : 0 pages
Book Rating : 4.0/5 (594 download)

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Book Synopsis Micro Electro Mechanical Systems by : Qing-An Huang

Download or read book Micro Electro Mechanical Systems written by Qing-An Huang and published by Springer. This book was released on 2018-05-04 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook volume aims to provide a comprehensive, self-contained, and authoritative reference in MEMS. It covers the theoretical and practical aspects including but not limited to sensors, actuators, RF MEMS, micro fluids and bio MEMS systems. It is particularly recommended to undergraduates, postgraduates, researchers, scientists, and field experts. This comprehensive summary will provide a solid knowledge background and inspire innovations in this highly interdisciplinary field. The handbook series consists of 5 volumes: Micro/nano fabrication technology, MEMS, Nanomaterial, Nanomedicine and Applications of micro-/nanotechnologies in IT. Experienced researchers and experts are invited to contribute in each of these areas.The series is published under Springer Major Reference works, which allows continuous online update and publication. These features allow newcomers and other readers to keep in touch with the most up-to-date information in micro-/nanotechnologies.It presents an overview of the knowledge base, as well as selected topics and provides comprehensive and authoritative information on the field for researchers, engineers, scientists and graduate students who are involved in different aspects of micro-/nanotechnologies.This publication will provide inspiration for innovative research and application ideas for continued growth of the field.

Advanced RF MEMS

Author : Stepan Lucyszyn
Publisher : Cambridge University Press
ISBN 13 : 1139491660
Total Pages : 441 pages
Book Rating : 4.1/5 (394 download)

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Book Synopsis Advanced RF MEMS by : Stepan Lucyszyn

Download or read book Advanced RF MEMS written by Stepan Lucyszyn and published by Cambridge University Press. This book was released on 2010-08-19 with total page 441 pages. Available in PDF, EPUB and Kindle. Book excerpt: An up-to-date guide to the theory and applications of RF MEMS. With detailed information about RF MEMS technology as well as its reliability and applications, this is a comprehensive resource for professionals, researchers, and students alike. • Reviews RF MEMS technologies • Illustrates new techniques that solve long-standing problems associated with reliability and packaging • Provides the information needed to incorporate RF MEMS into commercial products • Describes current and future trends in RF MEMS, providing perspective on industry growth • Ideal for those studying or working in RF and microwave circuits, systems, microfabrication and manufacturing, production management and metrology, and performance evaluation

Integration Aspects of RF-MEMS Technologies

Author :
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (667 download)

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Book Synopsis Integration Aspects of RF-MEMS Technologies by :

Download or read book Integration Aspects of RF-MEMS Technologies written by and published by . This book was released on 2005 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This paper presents an overview about existing fabrication and packaging solutions for RF MEMS switches with regard to an integration with other passive or active devices. Achievements and problems are discussed from a technological point of view.

Wafer Level Micropackaging for RF MEMS Switches

Author :
Publisher :
ISBN 13 :
Total Pages : 8 pages
Book Rating : 4.:/5 (644 download)

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Book Synopsis Wafer Level Micropackaging for RF MEMS Switches by :

Download or read book Wafer Level Micropackaging for RF MEMS Switches written by and published by . This book was released on 2005 with total page 8 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wafer-level micro-encapsulation is an innovative, low-cost, wafer-level packaging method for encapsulating RF MEMS switches. This zero-level packaging technique has demonstrated 0.04 dB package insertion loss at 35 GHz. This article overviews the processes, measurements, and testing methods used for determining the integrity and performance of individual encapsulated RF MEMS packages.

3D and Circuit Integration of MEMS

Author : Masayoshi Esashi
Publisher : John Wiley & Sons
ISBN 13 : 3527823255
Total Pages : 528 pages
Book Rating : 4.5/5 (278 download)

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Book Synopsis 3D and Circuit Integration of MEMS by : Masayoshi Esashi

Download or read book 3D and Circuit Integration of MEMS written by Masayoshi Esashi and published by John Wiley & Sons. This book was released on 2021-03-16 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.

Thin Film Encapsulation of Radio Frequency (RF) Microelectromechanical Systems (MEMS) Switches

Author : Eric D. Marsh
Publisher :
ISBN 13 :
Total Pages : 166 pages
Book Rating : 4.:/5 (742 download)

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Book Synopsis Thin Film Encapsulation of Radio Frequency (RF) Microelectromechanical Systems (MEMS) Switches by : Eric D. Marsh

Download or read book Thin Film Encapsulation of Radio Frequency (RF) Microelectromechanical Systems (MEMS) Switches written by Eric D. Marsh and published by . This book was released on 2004 with total page 166 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectromechanical systems (MEMS) radio frequency (RF) switches have been shown to have excellent electrical performance over a wide range of frequencies. However, cost-effective packaging techniques for MEMS switches do not currently exist. This thesis involves the design of RF-optimized encapsulations consisting of dielectric and metal layers, and the creation of a novel thin film encapsulation process to fabricate the encapsulations. The RF performance of several encapsulation designs are evaluated with an analytical model, full wave electromagnetic simulation, and laboratory testing. Performance degradation due to parasitic and reflection losses due to the package is considered, and RF feed-throughs of the transmission line into and out of the package are designed and assessed. Ten different encapsulation designs were created and their RF performance was characterized in terms of insertion loss, return loss, and isolation. A switch without an encapsulation and a switch with a dielectric encapsulation were fabricated and tested by the Air Force Research Laboratory (AFRL), and the test data was used to verify the data from analytical modeling and electromagnetic simulation performed in this work. All results were used to design an optimized encapsulation. An RF MEMS switch with this encapsulation was shown to have an overall insertion loss of less than -0.15 dB at 20 GHz compared to an unencapsulated switch insertion loss of about -0.1 dB. The isolation of the switch was slightly improved with the encapsulation. The fabrication process proposed to manufacture these encapsulations uses a low temperature solder as the metal encapsulation layer. As the final step in the fabrication, the solder is brought to melting temperature and reflowed over the etch holes to form a hermetic encapsulation.

RF MEMS Switch with Wafer Level Package Utilizing Frit Glass Bonding

Author :
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (632 download)

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Book Synopsis RF MEMS Switch with Wafer Level Package Utilizing Frit Glass Bonding by :

Download or read book RF MEMS Switch with Wafer Level Package Utilizing Frit Glass Bonding written by and published by . This book was released on 2002 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This paper reports experimental results of RF characteristics up to 20 GHz of a RF MEMS switch applied with wafer level packaging. A glass wafer is used as a package substrate on which frit glass is printed as material to seal the MEMS devices. The package wafer is bonded to a device wafer, which consists of actuators and base substrates .The actuators are made of single crystal silicon that has less residual stress. The base substrate has through holes formed by sand blast. The switch achieves a low insertion loss of 1.3 dB and a high isolation of 19 dB up to 20 GHz, and can be mounted on to a circuit board with bumps, like flip chip. The wafer level packaging with low cost and high reliability will transfer RF MEMS devices, which has superior high frequency characteristics even in quasi-millimeter wave band, to the practical use.

Influence of 0-level Packaging on the Microwave Performance of RF-MEMS Devices

Author :
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (632 download)

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Book Synopsis Influence of 0-level Packaging on the Microwave Performance of RF-MEMS Devices by :

Download or read book Influence of 0-level Packaging on the Microwave Performance of RF-MEMS Devices written by and published by . This book was released on 2001 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: RF-MEMS devices (Radio Frequency-MicroElectroMechanical Systems) are made of moveable and fragile structures (membranes, beams, cantilevers, & that must be encapsulated for protection and for stable performance characteristics. Zero-level or wafer-level packaging developed so far has been limited to dc-components. This paper elaborates on the design and fabrication of a 0-level package for housing RF-MEMS devices. The fabrication process is described and packages are characterized in terms of mechanical strength, hermeticity and microwave performance in the range 1-50 GHz. Simulations and experiments show minimal impact of the package on the RF losses if the cap has a minimal height of 50 æm, if low-loss materials (e.g., glass) are used, and if matched RF feedthroughs are implemented. Finally, in a multi-switch design, we recommend to minimize the number of feedthroughs, i.e. to use a single cap for the entire design.

RF MEMS and Their Applications

Author : Vijay K. Varadan
Publisher : John Wiley & Sons
ISBN 13 : 0470846194
Total Pages : 406 pages
Book Rating : 4.4/5 (78 download)

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Book Synopsis RF MEMS and Their Applications by : Vijay K. Varadan

Download or read book RF MEMS and Their Applications written by Vijay K. Varadan and published by John Wiley & Sons. This book was released on 2003-07-25 with total page 406 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectromechanical systems (MEMS) refer to a collection of micro-sensors and actuators, which can react to environmental change under micro- circuit control. The integration of MEMS into traditional Radio Frequency (RF) circuits has resulted in systems with superior performance levels and lower manufacturing costs. The incorporation of MEMS based fabrication technologies into micro and millimeter wave systems offers viable routes to ICs with MEMS actuators, antennas, switches and transmission lines. The resultant systems operate with an increased bandwidth and increased radiation efficiency and have considerable scope for implementation within the expanding area of wireless personal communication devices. This text provides leading edge coverage of this increasingly important area and highlights the overlapping information requirements of the RF and MEMS research and development communities. * Provides an introduction to micromachining techniques and their use in the fabrication of micro switches, capacitors and inductors * Includes coverage of MEMS devices for wireless and Bluetooth enabled systems Essential reading for RF Circuit design practitioners and researchers requiring an introduction to MEMS technologies, as well as practitioners and researchers in MEMS and silicon technology requiring an introduction to RF circuit design.