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Download or read book Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V written by and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Sonia Garcia-Blanco
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 : 9780819484659
Total Pages : 256 pages
Book Rating : 4.4/5 (846 download)
Download or read book Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X written by Sonia Garcia-Blanco and published by SPIE-International Society for Optical Engineering. This book was released on 2011 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes Proceedings Vol. 7821
Author : Rajeshuni Ramesham
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (838 download)
Download or read book Special Section on Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS II written by Rajeshuni Ramesham and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Richard C. Kullberg
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 : 9780819479884
Total Pages : 344 pages
Book Rating : 4.4/5 (798 download)
Download or read book Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX written by Richard C. Kullberg and published by SPIE-International Society for Optical Engineering. This book was released on 2010 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes Proceedings Vol. 7821
Author : Danelle Mary Tanner
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 : 9780819456908
Total Pages : 272 pages
Book Rating : 4.4/5 (569 download)
Download or read book Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV written by Danelle Mary Tanner and published by SPIE-International Society for Optical Engineering. This book was released on 2005 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Author : Sonia M. García-Blanco
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 : 9780819488930
Total Pages : 174 pages
Book Rating : 4.4/5 (889 download)
Download or read book Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices XI written by Sonia M. García-Blanco and published by SPIE-International Society for Optical Engineering. This book was released on 2012 with total page 174 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes Proceedings Vol. 7821
Author : Rajeshuni Ramesham
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (113 download)
Download or read book Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII written by Rajeshuni Ramesham and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE offer access to the latest innovations in research and technology and are among the most cited references in patent literature.
Author : Rajeshuni Ramesham
Publisher :
ISBN 13 :
Total Pages : 1701 pages
Book Rating : 4.:/5 (553 download)
Download or read book Special Sections On: Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS and Computational Lithography written by Rajeshuni Ramesham and published by . This book was released on 2009 with total page 1701 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Allyson L. Hartzell
Publisher : Springer Science & Business Media
ISBN 13 : 144196018X
Total Pages : 300 pages
Book Rating : 4.4/5 (419 download)
Download or read book MEMS Reliability written by Allyson L. Hartzell and published by Springer Science & Business Media. This book was released on 2010-11-02 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it. MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.
Author :
Publisher :
ISBN 13 :
Total Pages : 332 pages
Book Rating : 4.3/5 (91 download)
Download or read book Reliability, Testing, and Characterization of MEMS/MOEMS. written by and published by . This book was released on 2001 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Titu I. Băjenescu
Publisher : Artech House
ISBN 13 : 1596934360
Total Pages : 706 pages
Book Rating : 4.5/5 (969 download)
Download or read book Component Reliability for Electronic Systems written by Titu I. Băjenescu and published by Artech House. This book was released on 2010 with total page 706 pages. Available in PDF, EPUB and Kindle. Book excerpt: The main reason for the premature breakdown of today's electronic products (computers, cars, tools, appliances, etc.) is the failure of the components used to build these products. Today professionals are looking for effective ways to minimize the degradation of electronic components to help ensure longer-lasting, more technically sound products and systems. This practical book offers engineers specific guidance on how to design more reliable components and build more reliable electronic systems. Professionals learn how to optimize a virtual component prototype, accurately monitor product reliability during the entire production process, and add the burn-in and selection procedures that are the most appropriate for the intended applications. Moreover, the book helps system designers ensure that all components are correctly applied, margins are adequate, wear-out failure modes are prevented during the expected duration of life, and system interfaces cannot lead to failure.
Author : Rajeshuni Ramesham
Publisher : Society of Photo Optical
ISBN 13 : 9780819447807
Total Pages : 334 pages
Book Rating : 4.4/5 (478 download)
Download or read book Reliability, Testing, and Characterization of MEMS/MOEMS II written by Rajeshuni Ramesham and published by Society of Photo Optical. This book was released on 2003 with total page 334 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Rajeshuni Ramesham
Publisher : Society of Photo Optical
ISBN 13 : 9780819442864
Total Pages : 296 pages
Book Rating : 4.4/5 (428 download)
Download or read book Reliability, Testing, and Characterization of MEMS/MOEMS written by Rajeshuni Ramesham and published by Society of Photo Optical. This book was released on 2001 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Duixian Liu
Publisher : John Wiley & Sons
ISBN 13 : 9780470742952
Total Pages : 850 pages
Book Rating : 4.7/5 (429 download)
Download or read book Advanced Millimeter-wave Technologies written by Duixian Liu and published by John Wiley & Sons. This book was released on 2009-03-03 with total page 850 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging Contains a good number of case studies to aid understanding Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging
Download or read book Reliability, Packaging, Testing, and Characterization of MEMS written by and published by . This book was released on 2005 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Markku Tilli
Publisher : William Andrew
ISBN 13 : 0323312233
Total Pages : 827 pages
Book Rating : 4.3/5 (233 download)
Download or read book Handbook of Silicon Based MEMS Materials and Technologies written by Markku Tilli and published by William Andrew. This book was released on 2015-09-02 with total page 827 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures - Geared towards practical applications rather than theory
Download or read book Reliability, Packaging, Testing, and Characterization of MEMS written by and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
