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Processing Effect On Via Extrusion For Through Silicon Vias Tsvs In 3d Interconnects A Comparative Study Of Two Tsv Structures
Download Processing Effect On Via Extrusion For Through Silicon Vias Tsvs In 3d Interconnects A Comparative Study Of Two Tsv Structures full books in PDF, epub, and Kindle. Read online Processing Effect On Via Extrusion For Through Silicon Vias Tsvs In 3d Interconnects A Comparative Study Of Two Tsv Structures ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Book Synopsis 3D Microelectronic Packaging by : Yan Li
Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer Nature. This book was released on 2020-11-23 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Book Synopsis ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis by : ASM International
Download or read book ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2019-12-01 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Book Synopsis Strain Effect in Semiconductors by : Yongke Sun
Download or read book Strain Effect in Semiconductors written by Yongke Sun and published by Springer Science & Business Media. This book was released on 2009-11-14 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt: Strain Effect in Semiconductors: Theory and Device Applications presents the fundamentals and applications of strain in semiconductors and semiconductor devices that is relevant for strain-enhanced advanced CMOS technology and strain-based piezoresistive MEMS transducers. Discusses relevant applications of strain while also focusing on the fundamental physics pertaining to bulk, planar, and scaled nano-devices. Hence, this book is relevant for current strained Si logic technology as well as for understanding the physics and scaling for future strained nano-scale devices.
Book Synopsis Materials for Advanced Packaging by : Daniel Lu
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Book Synopsis Ultra-thin Chip Technology and Applications by : Joachim Burghartz
Download or read book Ultra-thin Chip Technology and Applications written by Joachim Burghartz and published by Springer Science & Business Media. This book was released on 2010-11-18 with total page 471 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
Book Synopsis 3D Microelectronic Packaging by : Yan Li
Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer. This book was released on 2016-10-29 with total page 560 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Book Synopsis Handbook of Mechanics of Materials by : Siegfried Schmauder
Download or read book Handbook of Mechanics of Materials written by Siegfried Schmauder and published by Springer. This book was released on 2019-05-09 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive reference for the studies of mechanical properties of materials over multiple length and time scales. The topics include nanomechanics, micromechanics, continuum mechanics, mechanical property measurements, and materials design. The handbook employs a consistent and systematic approach offering readers a user friendly reference ideal for frequent consultation. It is appropriate for an audience at of graduate students, faculties, researchers, and professionals in the fields of Materials Science, Mechanical Engineering, Civil Engineering, Engineering Mechanics, and Aerospace Engineering.
Book Synopsis Semiconductor Advanced Packaging by : John H. Lau
Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Book Synopsis Three-Dimensional Integration of Semiconductors by : Kazuo Kondo
Download or read book Three-Dimensional Integration of Semiconductors written by Kazuo Kondo and published by Springer. This book was released on 2015-12-09 with total page 423 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
Book Synopsis Fundamentals of Electromigration-Aware Integrated Circuit Design by : Jens Lienig
Download or read book Fundamentals of Electromigration-Aware Integrated Circuit Design written by Jens Lienig and published by Springer. This book was released on 2018-02-23 with total page 171 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Book Synopsis Carbon Nanotubes for Interconnects by : Aida Todri-Sanial
Download or read book Carbon Nanotubes for Interconnects written by Aida Todri-Sanial and published by Springer. This book was released on 2018-05-30 with total page 333 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Book Synopsis X-Ray Metrology in Semiconductor Manufacturing by : D. Keith Bowen
Download or read book X-Ray Metrology in Semiconductor Manufacturing written by D. Keith Bowen and published by CRC Press. This book was released on 2018-10-03 with total page 297 pages. Available in PDF, EPUB and Kindle. Book excerpt: The scales involved in modern semiconductor manufacturing and microelectronics continue to plunge downward. Effective and accurate characterization of materials with thicknesses below a few nanometers can be achieved using x-rays. While many books are available on the theory behind x-ray metrology (XRM), X-Ray Metrology in Semiconductor Manufacturing is the first book to focus on the practical aspects of the technology and its application in device fabrication and solving new materials problems. Following a general overview of the field, the first section of the book is organized by application and outlines the techniques that are best suited to each. The next section delves into the techniques and theory behind the applications, such as specular x-ray reflectivity, diffraction imaging, and defect mapping. Finally, the third section provides technological details of each technique, answering questions commonly encountered in practice. The authors supply real examples from the semiconductor and magnetic recording industries as well as more than 150 clearly drawn figures to illustrate the discussion. They also summarize the principles and key information about each method with inset boxes found throughout the text. Written by world leaders in the field, X-Ray Metrology in Semiconductor Manufacturing provides real solutions with a focus on accuracy, repeatability, and throughput.
Download or read book ESD Basics written by Steven H. Voldman and published by John Wiley & Sons. This book was released on 2012-10-22 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electrostatic discharge (ESD) continues to impact semiconductor manufacturing, semiconductor components and systems, as technologies scale from micro- to nano electronics. This book introduces the fundamentals of ESD, electrical overstress (EOS), electromagnetic interference (EMI), electromagnetic compatibility (EMC), and latchup, as well as provides a coherent overview of the semiconductor manufacturing environment and the final system assembly. It provides an illuminating look into the integration of ESD protection networks followed by examples in specific technologies, circuits, and chips. The text is unique in covering semiconductor chip manufacturing issues, ESD semiconductor chip design, and system problems confronted today as well as the future of ESD phenomena and nano-technology. Look inside for extensive coverage on: The fundamentals of electrostatics, triboelectric charging, and how they relate to present day manufacturing environments of micro-electronics to nano-technology Semiconductor manufacturing handling and auditing processing to avoid ESD failures ESD, EOS, EMI, EMC, and latchup semiconductor component and system level testing to demonstrate product resilience from human body model (HBM), transmission line pulse (TLP), charged device model (CDM), human metal model (HMM), cable discharge events (CDE), to system level IEC 61000-4-2 tests ESD on-chip design and process manufacturing practices and solutions to improve ESD semiconductor chip solutions, also practical off-chip ESD protection and system level solutions to provide more robust systems System level concerns in servers, laptops, disk drives, cell phones, digital cameras, hand held devices, automobiles, and space applications Examples of ESD design for state-of-the-art technologies, including CMOS, BiCMOS, SOI, bipolar technology, high voltage CMOS (HVCMOS), RF CMOS, smart power, magnetic recording technology, micro-machines (MEMs) to nano-structures ESD Basics: From Semiconductor Manufacturing to Product Use complements the author’s series of books on ESD protection. For those new to the field, it is an essential reference and a useful insight into the issues that confront modern technology as we enter the Nano-electronic Era.
Book Synopsis Chemical-Mechanical Planarization of Semiconductor Materials by : M.R. Oliver
Download or read book Chemical-Mechanical Planarization of Semiconductor Materials written by M.R. Oliver and published by Springer Science & Business Media. This book was released on 2004-01-26 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Book Synopsis Advanced Flip Chip Packaging by : Ho-Ming Tong
Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Book Synopsis Bio and Nano Packaging Techniques for Electron Devices by : Gerald Gerlach
Download or read book Bio and Nano Packaging Techniques for Electron Devices written by Gerald Gerlach and published by Springer Science & Business Media. This book was released on 2012-07-16 with total page 619 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes the effect of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and their application as packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed; also ways for implementation are described. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces as well as new packaging technologies with high potential for industrial applications are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers.
Book Synopsis Silicon Wafer Bonding Technology by : Subramanian S. Iyer
Download or read book Silicon Wafer Bonding Technology written by Subramanian S. Iyer and published by Univ. Press of Mississippi. This book was released on 2002 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the essentials of silicon wafer bonding from an engineering perspective. A beginning chapter deals with basic processes of wafer bonding in detail, and subsequent chapters cover bonding by mechanical removal, the Smart Cut method of hydrogen exfoliation, the ELTRAN thinning technique and hydrogen annealing, engineering methods of wafer characterization, and quality assurance for bonded wafers. A chapter on advanced applications looks at applications in optoelectronics, very large scale integration (VLSI), microelectromechanical systems (MEMS), and photonics. A glossary is included, plus a table comparing various bonding methods. The editors work in the private sector. Annotation copyrighted by Book News, Inc., Portland, OR
