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Process Dependence Of Properties In High Thermal Conductivity Aluminum Nitride Substrates For Electronic Packaging
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Book Synopsis Scientific and Technical Aerospace Reports by :
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
Book Synopsis Electronic Materials and Processes Handbook by : Charles A. Harper
Download or read book Electronic Materials and Processes Handbook written by Charles A. Harper and published by McGraw Hill Professional. This book was released on 2003-08-07 with total page 768 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct today’s cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design.
Book Synopsis Extreme Environment Electronics by : John D. Cressler
Download or read book Extreme Environment Electronics written by John D. Cressler and published by CRC Press. This book was released on 2017-12-19 with total page 1041 pages. Available in PDF, EPUB and Kindle. Book excerpt: Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.
Book Synopsis High Thermal Conductivity Materials by : Subhash L. Shinde
Download or read book High Thermal Conductivity Materials written by Subhash L. Shinde and published by Springer Science & Business Media. This book was released on 2006 with total page 302 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thedemandfore?cientthermalmanagementhasincreasedsubstantiallyover the last decade in every imaginable area, be it a formula 1 racing car suddenly braking to decelerate from 200 to 50 mph going around a sharp corner, a space shuttle entering the earth’s atmosphere, or an advanced microproc- sor operating at a very high speed. The temperatures at the hot junctions are extremely high and the thermal ?ux can reach values higher than a few 2 hundred to a thousand watts/cm in these applications. To take a speci?c example of the microelectronics area, the chip heat ?ux for CMOS microp- cessors, though moderate compared to the numbers mentioned above have 2 already reached values close to 100 W/cm , and are projected to increase 2 above 200 W/cm over the next few years. Although the thermal mana- ment strategies for microprocessors do involve power optimization through improved design, it is extremely di?cult to eliminate “hot spots” completely. This is where high thermal conductivity materials ?nd most of their appli- tions, as “heat spreaders”. The high thermal conductivity of these materials allows the heat to be carried away from the “hot spots” very quickly in all directions thereby “spreading” the heat. Heat spreading reduces the heat ?ux density, and thus makes it possible to cool systems using standard cooling solutions like ?nned heat sinks with forced air cooling.
Download or read book Ceramic Abstracts written by and published by . This book was released on 1998 with total page 1040 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Book Synopsis 1989 Spring Meeting by : Materials Research Society. Fall Meeting
Download or read book 1989 Spring Meeting written by Materials Research Society. Fall Meeting and published by . This book was released on 1989 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis The Science of Engineering Ceramics III by : Tatsuki Ohji
Download or read book The Science of Engineering Ceramics III written by Tatsuki Ohji and published by Trans Tech Publications Ltd. This book was released on 2006-08-15 with total page 942 pages. Available in PDF, EPUB and Kindle. Book excerpt: EnCera04 Proceedings of the 3rd International Sympsoium on the Science of Engineering Ceramics (EnCera 04) in Conjunction with the 12th International Seminar on Core University Program (CUP) between Japan and Korea, October 31-November 3, 2004, Osaka, Japan
Book Synopsis The International Journal for Hybrid Microelectronics by :
Download or read book The International Journal for Hybrid Microelectronics written by and published by . This book was released on 1986 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electrical & Electronics Abstracts by :
Download or read book Electrical & Electronics Abstracts written by and published by . This book was released on 1997 with total page 2304 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Government Reports Announcements & Index by :
Download or read book Government Reports Announcements & Index written by and published by . This book was released on 1994-10 with total page 1294 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advanced Materials for Thermal Management of Electronic Packaging by : Xingcun Colin Tong
Download or read book Advanced Materials for Thermal Management of Electronic Packaging written by Xingcun Colin Tong and published by Springer Science & Business Media. This book was released on 2011-01-05 with total page 633 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Book Synopsis Heat Transfer by : Konstantin Volkov
Download or read book Heat Transfer written by Konstantin Volkov and published by BoD – Books on Demand. This book was released on 2018-06-27 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on new analytical, experimental, and computational developments in the field of research of heat and mass transfer phenomena. The generation, conversion, use, and exchange of thermal energy between physical systems are considered. Various mechanisms of heat transfer such as thermal conduction, thermal convection, thermal radiation, and transfer of energy by phase changes are presented. Theory and fundamental research in heat and mass transfer, numerical simulations and algorithms, experimental techniques, and measurements as they applied to all kinds of applied and emerging problems are covered.
Book Synopsis Advanced Electronic Packaging by : Richard K. Ulrich
Download or read book Advanced Electronic Packaging written by Richard K. Ulrich and published by John Wiley & Sons. This book was released on 2006-02-24 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt: As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Book Synopsis Japanese Journal of Applied Physics by :
Download or read book Japanese Journal of Applied Physics written by and published by . This book was released on 2003 with total page 1538 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Engineered Materials Abstracts written by and published by . This book was released on 1991-03 with total page 614 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advances in Thermal Modeling of Electronic Components and Systems by :
Download or read book Advances in Thermal Modeling of Electronic Components and Systems written by and published by . This book was released on 1998 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt:
