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Proceedings Of The Symposium On Multilevel Metallization Interconnection And Contact Technologies
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Book Synopsis Proceedings of the Symposium on Multilevel Metallization, Interconnection, and Contact Technologies by : L. B. Rothman
Download or read book Proceedings of the Symposium on Multilevel Metallization, Interconnection, and Contact Technologies written by L. B. Rothman and published by . This book was released on 1987 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the ... International Symposium on Semiconductor Wafer Bonding by :
Download or read book Proceedings of the ... International Symposium on Semiconductor Wafer Bonding written by and published by . This book was released on 1991 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the Symposium on Interconnect and Contact Metallization by : Harzara S. Rathore
Download or read book Proceedings of the Symposium on Interconnect and Contact Metallization written by Harzara S. Rathore and published by The Electrochemical Society. This book was released on 1998 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, and Thin Insulator Materials by : T. O. Herndon
Download or read book Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, and Thin Insulator Materials written by T. O. Herndon and published by . This book was released on 1993 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis ULSI Science and Technology/1987 by : S. Broydo
Download or read book ULSI Science and Technology/1987 written by S. Broydo and published by . This book was released on 1987 with total page 874 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the Symposia on Reliability of Semiconductor Devices and Interconnection and Multilevel Metallization, Interconnection, and Contact Technologies by : Harzara S. Rathore
Download or read book Proceedings of the Symposia on Reliability of Semiconductor Devices and Interconnection and Multilevel Metallization, Interconnection, and Contact Technologies written by Harzara S. Rathore and published by . This book was released on 1989 with total page 516 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Handbook of Semiconductor Manufacturing Technology by : Yoshio Nishi
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Book Synopsis Guidebook for Managing Silicon Chip Reliability by : Michael Pecht
Download or read book Guidebook for Managing Silicon Chip Reliability written by Michael Pecht and published by CRC Press. This book was released on 2017-11-22 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
Book Synopsis Proceedings of the Symposium on Electromigration of Metals and First International Symposium on Multilevel Metallization and Packaging by : James R. Lloyd
Download or read book Proceedings of the Symposium on Electromigration of Metals and First International Symposium on Multilevel Metallization and Packaging written by James R. Lloyd and published by . This book was released on 1985 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Cleaning Technology in Semiconductor Device Manufacturing by :
Download or read book Cleaning Technology in Semiconductor Device Manufacturing written by and published by The Electrochemical Society. This book was released on 2000 with total page 636 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advances in Low-temperature Plasma Chemistry, Technology, Applications by : Herman V. Boenig
Download or read book Advances in Low-temperature Plasma Chemistry, Technology, Applications written by Herman V. Boenig and published by . This book was released on 1991 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Handbook of Electronic Package Design by : Michael Pecht
Download or read book Handbook of Electronic Package Design written by Michael Pecht and published by CRC Press. This book was released on 2018-10-24 with total page 904 pages. Available in PDF, EPUB and Kindle. Book excerpt: Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Book Synopsis Interconnect and Contact Metallization for ULSI by : G. S. Mathad
Download or read book Interconnect and Contact Metallization for ULSI written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2000 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advanced Interconnects for ULSI Technology by : Mikhail Baklanov
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-04-02 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Book Synopsis IBM Journal of Research and Development by :
Download or read book IBM Journal of Research and Development written by and published by . This book was released on 2005 with total page 1048 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the Symposium on High Voltage and Smart Power ICs by : Muhammed Ayman Shibib
Download or read book Proceedings of the Symposium on High Voltage and Smart Power ICs written by Muhammed Ayman Shibib and published by . This book was released on 1989 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Reduced Thermal Processing for ULSI by : R.A. Levy
Download or read book Reduced Thermal Processing for ULSI written by R.A. Levy and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt: As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such restrictions extend to the fabrication of multilevel structures that are now essential in increasing packing density of interconnect lines. The fabrication of ultra large scale integrated (ULSI) devices under thermal budget restrictions requires the reassessment of existing and the development of new microelectronic materials and processes. This book addresses three broad but interrelated areas. The first area focuses on the subject of rapid thermal processing (RTP), a technology that allows minimization of processing time while relaxing the constraints on high temperature. Initially developed to limit dopant redistribution, current applications of RTP are shown here to encompass annealing, oxidation, nitridation, silicidation, glass reflow, and contact sintering. In a second but complementary area, advances in equipment design and performance of rapid thermal processing equipment are presented in conjunction with associated issues of temperature measurement and control. Defect mechanisms are assessed together with the resulting properties of rapidly deposited and processed films. The concept of RTP integration for a full CMOS device process is also examined together with its impact on device characteristics.
