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Proceedings Of The Fifth International Vacuum Microelectronics Conference
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Book Synopsis Proceeding of Fifth International Conference on Microelectronics, Computing and Communication Systems by : Vijay Nath
Download or read book Proceeding of Fifth International Conference on Microelectronics, Computing and Communication Systems written by Vijay Nath and published by Springer Nature. This book was released on 2021-09-09 with total page 855 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents high-quality papers from the Fifth International Conference on Microelectronics, Computing & Communication Systems (MCCS 2020). It discusses the latest technological trends and advances in MEMS and nanoelectronics, wireless communication, optical communication, instrumentation, signal processing, image processing, bioengineering, green energy, hybrid vehicles, environmental science, weather forecasting, cloud computing, renewable energy, RFID, CMOS sensors, actuators, transducers, telemetry systems, embedded systems and sensor network applications. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements and testing. The applications and solutions discussed here provide excellent reference material for future product development.
Author :The Korean Institute of Electrical and Electronic Material Engineers Publisher : ISBN 13 :9780780326521 Total Pages :620 pages Book Rating :4.3/5 (265 download)
Book Synopsis Proceedings of the 5th International Conference on Properties and Applications of Dielectric Materials by : The Korean Institute of Electrical and Electronic Material Engineers
Download or read book Proceedings of the 5th International Conference on Properties and Applications of Dielectric Materials written by The Korean Institute of Electrical and Electronic Material Engineers and published by . This book was released on 1997 with total page 620 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Index of Conference Proceedings by : British Library. Document Supply Centre
Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 2000 with total page 836 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Microelectronic Applications of Chemical Mechanical Planarization by : Yuzhuo Li
Download or read book Microelectronic Applications of Chemical Mechanical Planarization written by Yuzhuo Li and published by John Wiley & Sons. This book was released on 2007-10-19 with total page 764 pages. Available in PDF, EPUB and Kindle. Book excerpt: An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
Book Synopsis Chemistry in Microelectronics by : Yannick Le Tiec
Download or read book Chemistry in Microelectronics written by Yannick Le Tiec and published by John Wiley & Sons. This book was released on 2013-02-28 with total page 261 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronics is a complex world where many sciences need to collaborate to create nano-objects: we need expertise in electronics, microelectronics, physics, optics and mechanics also crossing into chemistry, electrochemistry, as well as biology, biochemistry and medicine. Chemistry is involved in many fields from materials, chemicals, gases, liquids or salts, the basics of reactions and equilibrium, to the optimized cleaning of surfaces and selective etching of specific layers. In addition, over recent decades, the size of the transistors has been drastically reduced while the functionality of circuits has increased. This book consists of five chapters covering the chemicals and sequences used in processing, from cleaning to etching, the role and impact of their purity, along with the materials used in “Front End Of the Line” which corresponds to the heart and performance of individual transistors, then moving on to the “Back End Of the Line” which is related to the interconnection of all the transistors. Finally, the need for specific functionalization also requires key knowledge on surface treatments and chemical management to allow new applications. Contents 1. Chemistry in the “Front End of the Line” (FEOL): Deposits, Gate Stacks, Epitaxy and Contacts, François Martin, Jean-Michel Hartmann, Véronique Carron and Yannick Le Tiec. 2. Chemistry in Interconnects, Vincent Jousseaume, Paul-Henri Haumesser, Carole Pernel, Jeffery Butterbaugh, Sylvain Maîtrejean and Didier Louis. 3. The Chemistry of Wet Surface Preparation: Cleaning, Etching and Drying, Yannick Le Tiec and Martin Knotter. 4. The Use and Management of Chemical Fluids in Microelectronics, Christiane Gottschalk, Kevin Mclaughlin, Julie Cren, Catherine Peyne and Patrick Valenti. 5. Surface Functionalization for Micro- and Nanosystems: Application to Biosensors, Antoine Hoang, Gilles Marchand, Guillaume Nonglaton, Isabelle Texier-Nogues and Francoise Vinet. About the Authors Yannick Le Tiec is a technical expert at CEA-Leti, Minatec since 2002. He is a CEA-Leti assignee at IBM, Albany (NY) to develop the advanced 14 nm CMOS node and the FDSOI technology. He held different technical positions from the advanced 300 mm SOI CMOS pilot line to different assignments within SOITEC for advanced wafer development and later within INES to optimize solar cell ramp-up and yield. He has been part of the ITRS Front End technical working group at ITRS since 2008.
Book Synopsis Proceedings of the 1993 Particle Accelerator Conference by :
Download or read book Proceedings of the 1993 Particle Accelerator Conference written by and published by . This book was released on 1993 with total page 800 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Chimie en microélectronique by : LE TIEC Yannick
Download or read book Chimie en microélectronique written by LE TIEC Yannick and published by Lavoisier. This book was released on 2013-07-01 with total page 386 pages. Available in PDF, EPUB and Kindle. Book excerpt: La microélectronique est un monde complexe dans lequel plusieurs sciences comme la physique, l’électronique, l’optique ou la mécanique, contribuent à créer des nano-objets fonctionnels. La chimie est particulièrement impliquée dans de nombreux domaines tels que la synthèse des matériaux, la pureté des fluides, des gaz, des sels, le suivi des réactions chimiques et de leurs équilibres ainsi que la préparation de surfaces optimisées et la gravure sélective de couches spécifiques. Au cours des dernières décennies, la taille des transistors s’est considérablement réduite et la fonctionnalité des circuits électroniques s’est accrue. Cette évolution a conduit à une interpénétration de la chimie et de la microélectronique exposée dans cet ouvrage. Chimie en microélectronique présente les chimies et les séquences utilisées lors des procédés de production de la microélectronique, des nettoyages jusqu’aux gravures des plaquettes de silicium, du rôle et de l’impact de leur niveau de pureté jusqu’aux procédés d’interconnexion des millions de transistors composant un circuit électronique. Afin d’illustrer la convergence avec le domaine de la santé, l’ouvrage expose les nouvelles fonctionnalisations spécifiques, tels que les capteurs biologiques ou les capteurs sur la personne.
Download or read book Technical Digest written by and published by . This book was released on 1996 with total page 726 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis My Life on the Mysterious Island of Nanotechnology by : Zvi Yaniv
Download or read book My Life on the Mysterious Island of Nanotechnology written by Zvi Yaniv and published by Page Publishing Inc. This book was released on 2017-05-26 with total page 260 pages. Available in PDF, EPUB and Kindle. Book excerpt: What causes an Israeli born in Romania to immigrate to America and end up with over three hundred patents in his name in the most exciting scientific and technological breakthroughs of the twentieth century? Join the adventures of physicist, inventor, and entrepreneur Zvi Yaniv and see how Jules Verne’s book, The Mysterious Island, ignited his imagination and love for science, which, in turn, propelled him to a career in flat panel displays, image digitizers, and molecular engineering. These fields eventually became an integral part of what is known in the common vernacular today as nanotechnology. Do you use an image scanner digitizer? Are you reading this on a flat panel display, on your computer, your iPad , or iPhone? Are you getting information driving on the highways from electronic billboards? Are you watching the news or movies on your giant color TV screen? Follow Zvi’s journey and along the way, learn how to unleash your own creativity and innovation. Understand what nanotechnology is all about and its future. This book is about creativity, innovation, and entrepreneurship, using the vehicle of Dr. Yaniv’s life and career as a case study. The book shows one person’s ability to use his creativity and innovation skills to impact the fields of liquid crystal displays, image scanner digitizers, flat-screen color TVs, digital advertising, and give rise to nanotechnologically based new materials and applications thereof. During his more-than-four-decade career in science and industry, Zvi perfected techniques for taking ideas from concept to commercialization, outlining an explicit road map for this process. Along the way, the book demystifies what nanotechnology is and how it impacts different aspects of our society from science to education to medicine to new materials fields.
Book Synopsis Index to IEEE Publications by : Institute of Electrical and Electronics Engineers
Download or read book Index to IEEE Publications written by Institute of Electrical and Electronics Engineers and published by . This book was released on 1996 with total page 1292 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book New Serial Titles written by and published by . This book was released on 1997 with total page 1448 pages. Available in PDF, EPUB and Kindle. Book excerpt: A union list of serials commencing publication after Dec. 31, 1949.
Book Synopsis Mechanical Properties and Performance of Engineering Ceramics II, Volume 27, Issue 2 by : Rajan Tandon
Download or read book Mechanical Properties and Performance of Engineering Ceramics II, Volume 27, Issue 2 written by Rajan Tandon and published by John Wiley & Sons. This book was released on 2009-09-29 with total page 801 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume contains over 70 papers on advanced research and development of processing, mechanical properties and mechanics of ceramics and composites from the proceedings of the 30th International Conference on Advanced Ceramics and Composites, January 22-27, 2006, in Cocoa Beach, Florida. The conference was organized and sponsored by The American Ceramic Society and The American Ceramic Society's Engineering Ceramics Division in conjunction with the Nuclear and Environmental Technology Division. It covers underlying fundamental links between microstructure and properties, and the ability to achieve desired multifunctional properties through innovative processing techniques.
Book Synopsis Converging Clinical and Engineering Research on Neurorehabilitation IV by : Diego Torricelli
Download or read book Converging Clinical and Engineering Research on Neurorehabilitation IV written by Diego Torricelli and published by Springer Nature. This book was released on 2021-10-01 with total page 870 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book reports on advanced topics in the areas of neurorehabilitation research and practice. It focuses on new methods for interfacing the human nervous system with electronic and mechatronic systems to restore or compensate impaired neural functions. Importantly, the book merges different perspectives, such as the clinical, neurophysiological, and bioengineering ones, to promote, feed and encourage collaborations between clinicians, neuroscientists and engineers. Based on the 2020 International Conference on Neurorehabilitation (ICNR 2020) held online on October 13-16, 2020, this book covers various aspects of neurorehabilitation research and practice, including new insights into biomechanics, brain physiology, neuroplasticity, and brain damages and diseases, as well as innovative methods and technologies for studying and/or recovering brain function, from data mining to interface technologies and neuroprosthetics. In this way, it offers a concise, yet comprehensive reference guide to neurosurgeons, rehabilitation physicians, neurologists, and bioengineers. Moreover, by highlighting current challenges in understanding brain diseases as well as in the available technologies and their implementation, the book is also expected to foster new collaborations between the different groups, thus stimulating new ideas and research directions.
Book Synopsis Quality Conformance and Qualification of Microelectronic Packages and Interconnects by : Michael Pecht
Download or read book Quality Conformance and Qualification of Microelectronic Packages and Interconnects written by Michael Pecht and published by John Wiley & Sons. This book was released on 1994-12-13 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp.
Book Synopsis Subject Guide to Books in Print by :
Download or read book Subject Guide to Books in Print written by and published by . This book was released on 2001 with total page 3054 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Future Energy Conferences and Symposia by :
Download or read book Future Energy Conferences and Symposia written by and published by . This book was released on 1989 with total page 838 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Solar Energy Update written by and published by . This book was released on 1982-11 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt:
