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Proceedings Of The 2010 Asia And South Pacific Design Automation Conference
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Book Synopsis Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology by : Luciano Lavagno
Download or read book Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology written by Luciano Lavagno and published by CRC Press. This book was released on 2017-02-03 with total page 893 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Book Synopsis Proceedings of International Conference on Frontiers in Computing and Systems by : Debotosh Bhattacharjee
Download or read book Proceedings of International Conference on Frontiers in Computing and Systems written by Debotosh Bhattacharjee and published by Springer Nature. This book was released on 2020-11-23 with total page 895 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers outstanding research papers presented at the International Conference on Frontiers in Computing and Systems (COMSYS 2020), held on January 13–15, 2019 at Jalpaiguri Government Engineering College, West Bengal, India and jointly organized by the Department of Computer Science & Engineering and Department of Electronics & Communication Engineering. The book presents the latest research and results in various fields of machine learning, computational intelligence, VLSI, networks and systems, computational biology, and security, making it a rich source of reference material for academia and industry alike.
Book Synopsis Design and Testing of Reversible Logic by : Ashutosh Kumar Singh
Download or read book Design and Testing of Reversible Logic written by Ashutosh Kumar Singh and published by Springer. This book was released on 2019-07-29 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book compiles efficient design and test methodologies for the implementation of reversible logic circuits. The methodologies covered in the book are design approaches, test approaches, fault tolerance in reversible circuits and physical implementation techniques. The book also covers the challenges and the reversible logic circuits to meet these challenges stimulated during each stage of work cycle. The novel computing paradigms are being explored to serve as a basis for fast and low power computation.
Book Synopsis CMOS Indoor Light Energy Harvesting System for Wireless Sensing Applications by : Carlos Manuel Ferreira Carvalho
Download or read book CMOS Indoor Light Energy Harvesting System for Wireless Sensing Applications written by Carlos Manuel Ferreira Carvalho and published by Springer. This book was released on 2015-07-30 with total page 221 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses in detail the CMOS implementation of energy harvesting. The authors describe an integrated, indoor light energy harvesting system, based on a controller circuit that dynamically and automatically adjusts its operation to meet the actual light circumstances of the environment where the system is placed. The system is intended to power a sensor node, enabling an autonomous wireless sensor network (WSN). Although designed to cope with indoor light levels, the system is also able to work with higher levels, making it an all-round light energy harvesting system. The discussion includes experimental data obtained from an integrated manufactured prototype, which in conjunction with a photovoltaic (PV) cell, serves as a proof of concept of the desired energy harvesting system.
Book Synopsis Fundamentals of IP and SoC Security by : Swarup Bhunia
Download or read book Fundamentals of IP and SoC Security written by Swarup Bhunia and published by Springer. This book was released on 2017-01-24 with total page 316 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is about security in embedded systems and it provides an authoritative reference to all aspects of security in system-on-chip (SoC) designs. The authors discuss issues ranging from security requirements in SoC designs, definition of architectures and design choices to enforce and validate security policies, and trade-offs and conflicts involving security, functionality, and debug requirements. Coverage also includes case studies from the “trenches” of current industrial practice in design, implementation, and validation of security-critical embedded systems. Provides an authoritative reference and summary of the current state-of-the-art in security for embedded systems, hardware IPs and SoC designs; Takes a "cross-cutting" view of security that interacts with different design and validation components such as architecture, implementation, verification, and debug, each enforcing unique trade-offs; Includes high-level overview, detailed analysis on implementation, and relevant case studies on design/verification/debug issues related to IP/SoC security.
Book Synopsis Approximate Computing Techniques by : Alberto Bosio
Download or read book Approximate Computing Techniques written by Alberto Bosio and published by Springer Nature. This book was released on 2022-06-10 with total page 541 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book serves as a single-source reference to the latest advances in Approximate Computing (AxC), a promising technique for increasing performance or reducing the cost and power consumption of a computing system. The authors discuss the different AxC design and validation techniques, and their integration. They also describe real AxC applications, spanning from mobile to high performance computing and also safety-critical applications.
Book Synopsis Physical Design for 3D Integrated Circuits by : Aida Todri-Sanial
Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 397 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Book Synopsis Smart Systems Integration and Simulation by : Nicola Bombieri
Download or read book Smart Systems Integration and Simulation written by Nicola Bombieri and published by Springer. This book was released on 2016-02-17 with total page 239 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book-presents new methods and tools for the integration and simulation of smart devices. The design approach described in this book explicitly accounts for integration of Smart Systems components and subsystems as a specific constraint. It includes methodologies and EDA tools to enable multi-disciplinary and multi-scale modeling and design, simulation of multi-domain systems, subsystems and components at all levels of abstraction, system integration and exploration for optimization of functional and non-functional metrics. By covering theoretical and practical aspects of smart device design, this book targets people who are working and studying on hardware/software modelling, component integration and simulation under different positions (system integrators, designers, developers, researchers, teachers, students etc.). In particular, it is a good introduction to people who have interest in managing heterogeneous components in an efficient and effective way on different domains and different abstraction levels. People active in smart device development can understand both the current status of practice and future research directions. · Provides a comprehensive overview of smart systems design, focusing on design challenges and cutting-edge solutions; · Enables development of a co-simulation and co-design environment that accounts for the peculiarities of the basic subsystems and components to be integrated; · Describes development of modeling and design techniques, methods and tools that enable multi-domain simulation and optimization at various levels of abstraction and across different technological domains.
Book Synopsis Advanced Field-Solver Techniques for RC Extraction of Integrated Circuits by : Wenjian Yu
Download or read book Advanced Field-Solver Techniques for RC Extraction of Integrated Circuits written by Wenjian Yu and published by Springer Science & Business. This book was released on 2014-04-21 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt: Resistance and capacitance (RC) extraction is an essential step in modeling the interconnection wires and substrate coupling effect in nanometer-technology integrated circuits (IC). The field-solver techniques for RC extraction guarantee the accuracy of modeling, and are becoming increasingly important in meeting the demand for accurate modeling and simulation of VLSI designs. Advanced Field-Solver Techniques for RC Extraction of Integrated Circuits presents a systematic introduction to, and treatment of, the key field-solver methods for RC extraction of VLSI interconnects and substrate coupling in mixed-signal ICs. Various field-solver techniques are explained in detail, with real-world examples to illustrate the advantages and disadvantages of each algorithm. This book will benefit graduate students and researchers in the field of electrical and computer engineering as well as engineers working in the IC design and design automation industries. Dr. Wenjian Yu is an Associate Professor at the Department of Computer Science and Technology at Tsinghua University in China; Dr. Xiren Wang is a R&D Engineer at Cadence Design Systems in the USA.
Book Synopsis Advanced Techniques for Power, Energy, and Thermal Management for Clustered Manycores by : Santiago Pagani
Download or read book Advanced Techniques for Power, Energy, and Thermal Management for Clustered Manycores written by Santiago Pagani and published by Springer. This book was released on 2018-04-26 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on two of the most relevant problems related to power management on multicore and manycore systems. Specifically, one part of the book focuses on maximizing/optimizing computational performance under power or thermal constraints, while another part focuses on minimizing energy consumption under performance (or real-time) constraints.
Book Synopsis Handbook of Research on Embedded Systems Design by : Bagnato, Alessandra
Download or read book Handbook of Research on Embedded Systems Design written by Bagnato, Alessandra and published by IGI Global. This book was released on 2014-06-30 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: As real-time and integrated systems become increasingly sophisticated, issues related to development life cycles, non-recurring engineering costs, and poor synergy between development teams will arise. The Handbook of Research on Embedded Systems Design provides insights from the computer science community on integrated systems research projects taking place in the European region. This premier references work takes a look at the diverse range of design principles covered by these projects, from specification at high abstraction levels using standards such as UML and related profiles to intermediate design phases. This work will be invaluable to designers of embedded software, academicians, students, practitioners, professionals, and researchers working in the computer science industry.
Book Synopsis Three-Dimensional Design Methodologies for Tree-based FPGA Architecture by : Vinod Pangracious
Download or read book Three-Dimensional Design Methodologies for Tree-based FPGA Architecture written by Vinod Pangracious and published by Springer. This book was released on 2015-06-25 with total page 239 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.
Book Synopsis Multicore Technology by : Muhammad Yasir Qadri
Download or read book Multicore Technology written by Muhammad Yasir Qadri and published by CRC Press. This book was released on 2018-10-08 with total page 446 pages. Available in PDF, EPUB and Kindle. Book excerpt: The saturation of design complexity and clock frequencies for single-core processors has resulted in the emergence of multicore architectures as an alternative design paradigm. Nowadays, multicore/multithreaded computing systems are not only a de-facto standard for high-end applications, they are also gaining popularity in the field of embedded computing. The start of the multicore era has altered the concepts relating to almost all of the areas of computer architecture design, including core design, memory management, thread scheduling, application support, inter-processor communication, debugging, and power management. This book gives readers a holistic overview of the field and guides them to further avenues of research by covering the state of the art in this area. It includes contributions from industry as well as academia.
Book Synopsis Three-Dimensional Integrated Circuit Design by : Vasilis F. Pavlidis
Download or read book Three-Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Book Synopsis Analyse Et Caractérisation Des Couplages Substrat Et de la Connectique Dans Les Circuits 3D by : Fengyuan Sun
Download or read book Analyse Et Caractérisation Des Couplages Substrat Et de la Connectique Dans Les Circuits 3D written by Fengyuan Sun and published by Editions Publibook. This book was released on 2016 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proposal of doubling the number of transistors on an IC chip (with minimum costs and subtle innovations) every 24 months by Gordon Moore in 1965 (the so-called called Moore's law) has been the most powerful driver for the emphasis of the microelectronics industry in the past 50 years. This law enhances lithography scaling and integration, in 2D, of all functions on a single chip, increasingly through system-on-chip (SOC). On the other hand, the integration of all these functions can be achieved through 3D integrations . Generally speaking, 3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and mostly the TSV (through-silicon via) separates 3D IC packaging from 3D IC/Si integrations since the latter two uses TSVs, but 3D IC packaging does not. TSV (with a new concept that every chip or interposer could have two surfaces with circuits) is the heart of 3D IC/Si integrations. Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. 3D Si integration is the right way to go and compete with Moore's law (more than Moore versus more Moore). However, it is still a long way to go. In this book, Fengyuan SUN proposes new substrate network extraction techniques. Using this latter, the substrate coupling and loss in IC's can be analyzed. He implements some Green/TLM (Transmission Line Matrix) algorithms in MATLAB. It permits to extract impedances between any number of embedded contacts or/and TSVS. He does investigate models of high aspect ratio TSV, on both analytical and numerical methods electromagnetic simulations. This model enables to extract substrate and TSV impedance, S parameters and parasitic elements, considering the variable resistivity of the substrate. It is full compatible with SPICE-like solvers and should allow an investigation in depth of TSV impact on circuit performance.
Book Synopsis Green Communications by : Jinsong Wu
Download or read book Green Communications written by Jinsong Wu and published by CRC Press. This book was released on 2016-04-19 with total page 836 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nowadays energy crisis and global warming problems are hanging over everyone's head, urging much research work on energy saving. In the ICT industry, which is becoming a major consumer of global energy triggered by the telecommunication network operators experiencing energy cost as a significant factor in profit calculations, researchers have start
Author :Jerónimo Castrillón Mazo Publisher :Springer Science & Business Media ISBN 13 :3319006754 Total Pages :243 pages Book Rating :4.3/5 (19 download)
Book Synopsis Programming Heterogeneous MPSoCs by : Jerónimo Castrillón Mazo
Download or read book Programming Heterogeneous MPSoCs written by Jerónimo Castrillón Mazo and published by Springer Science & Business Media. This book was released on 2013-09-24 with total page 243 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides embedded software developers with techniques for programming heterogeneous Multi-Processor Systems-on-Chip (MPSoCs), capable of executing multiple applications simultaneously. It describes a set of algorithms and methodologies to narrow the software productivity gap, as well as an in-depth description of the underlying problems and challenges of today’s programming practices. The authors present four different tool flows: A parallelism extraction flow for applications written using the C programming language, a mapping and scheduling flow for parallel applications, a special mapping flow for baseband applications in the context of Software Defined Radio (SDR) and a final flow for analyzing multiple applications at design time. The tool flows are evaluated on Virtual Platforms (VPs), which mimic different characteristics of state-of-the-art heterogeneous MPSoCs.
