Proceedings Of International Conference On Electronic Components And Materials

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Proceedings of the 1st International Conference on Electronics, Biomedical Engineering, and Health Informatics

Author : Triwiyanto
Publisher : Springer Nature
ISBN 13 : 9813369264
Total Pages : 719 pages
Book Rating : 4.8/5 (133 download)

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Book Synopsis Proceedings of the 1st International Conference on Electronics, Biomedical Engineering, and Health Informatics by : Triwiyanto

Download or read book Proceedings of the 1st International Conference on Electronics, Biomedical Engineering, and Health Informatics written by Triwiyanto and published by Springer Nature. This book was released on 2021-04-16 with total page 719 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Conference proceeding presents high-quality peer-reviewed papers from the International Conference on Electronics, Biomedical Engineering, and Health Informatics (ICEBEHI) 2020 held at Surabaya, Indonesia. The contents are broadly divided into three parts: (i) Electronics, (ii) Biomedical Engineering, and (iii) Health Informatics. The major focus is on emerging technologies and their applications in the domain of biomedical engineering. It includes papers based on original theoretical, practical, and experimental simulations, development, applications, measurements, and testing. Featuring the latest advances in the field of biomedical engineering applications, this book serves as a definitive reference resource for researchers, professors, and practitioners interested in exploring advanced techniques in the field of electronics, biomedical engineering, and health informatics. The applications and solutions discussed here provide excellent reference material for future product development.

Proceedings of the 1st International Conference on Electronic Engineering and Renewable Energy

Author : Bekkay Hajji
Publisher : Springer
ISBN 13 : 9811314055
Total Pages : 786 pages
Book Rating : 4.8/5 (113 download)

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Book Synopsis Proceedings of the 1st International Conference on Electronic Engineering and Renewable Energy by : Bekkay Hajji

Download or read book Proceedings of the 1st International Conference on Electronic Engineering and Renewable Energy written by Bekkay Hajji and published by Springer. This book was released on 2018-08-01 with total page 786 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proceedings present a selection of refereed papers presented at the 1st International Conference on Electronic Engineering and Renewable Energy (ICEERE 2018) held during 15-17 April 2018, Saidi, Morocco. The contributions from electrical engineers and experts highlight key issues and developments essential to the multifaceted field of electrical engineering systems and seek to address multidisciplinary challenges in Information and Communication Technologies. The book has a special focus on energy challenges for developing the Euro-Mediterranean regions through new renewable energy technologies in the agricultural and rural areas. The book is intended for academia, including graduate students, experienced researchers and industrial practitioners working in the fields of Electronic Engineering and Renewable Energy.

Electronic Materials Handbook

Author :
Publisher : ASM International
ISBN 13 : 9780871702852
Total Pages : 1234 pages
Book Rating : 4.7/5 (28 download)

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Book Synopsis Electronic Materials Handbook by :

Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

Proceedings of the 21st International Conference on Industrial Engineering and Engineering Management 2014

Author : Ershi Qi
Publisher : Springer
ISBN 13 : 9462391025
Total Pages : 628 pages
Book Rating : 4.4/5 (623 download)

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Book Synopsis Proceedings of the 21st International Conference on Industrial Engineering and Engineering Management 2014 by : Ershi Qi

Download or read book Proceedings of the 21st International Conference on Industrial Engineering and Engineering Management 2014 written by Ershi Qi and published by Springer. This book was released on 2015-01-06 with total page 628 pages. Available in PDF, EPUB and Kindle. Book excerpt: Being the premier forum for the presentation of new advances and research results in the fields of Industrial Engineering, IEEM 2014 aims to provide a high-level international forum for experts, scholars and entrepreneurs at home and abroad to present the recent advances, new techniques and applications face and face, to promote discussion and interaction among academics, researchers and professionals to promote the developments and applications of the related theories and technologies in universities and enterprises and to establish business or research relations to find global partners for future collaboration in the field of Industrial Engineering. All the goals of the international conference are to fulfill the mission of the series conference which is to review, exchange, summarize and promote the latest achievements in the field of industrial engineering and engineering management over the past year and to propose prospects and vision for the further development.

From LED to Solid State Lighting

Author : S. W. Ricky Lee
Publisher : John Wiley & Sons
ISBN 13 : 1118881559
Total Pages : 256 pages
Book Rating : 4.1/5 (188 download)

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Book Synopsis From LED to Solid State Lighting by : S. W. Ricky Lee

Download or read book From LED to Solid State Lighting written by S. W. Ricky Lee and published by John Wiley & Sons. This book was released on 2021-09-17 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt: FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.

Nanopackaging

Author : James E. Morris
Publisher : Springer
ISBN 13 : 3319903624
Total Pages : 1007 pages
Book Rating : 4.3/5 (199 download)

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Book Synopsis Nanopackaging by : James E. Morris

Download or read book Nanopackaging written by James E. Morris and published by Springer. This book was released on 2018-09-22 with total page 1007 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Advances in Materials Research

Author : G. Kumaresan
Publisher : Springer Nature
ISBN 13 : 9811583196
Total Pages : 1231 pages
Book Rating : 4.8/5 (115 download)

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Book Synopsis Advances in Materials Research by : G. Kumaresan

Download or read book Advances in Materials Research written by G. Kumaresan and published by Springer Nature. This book was released on 2021-02-04 with total page 1231 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book comprises select peer-reviewed proceedings of the International Conference on Advances in Materials Research (ICAMR 2019). The contents cover latest research in materials and their applications relevant to composites, metals, alloys, polymers, energy and phase change. The indigenous properties of materials including mechanical, electrical, thermal, optical, chemical and biological functions are discussed. The book also elaborates the properties and performance enhancement and/or deterioration in order of the modifications in atomic particles and structure. This book will be useful for both students and professionals interested in the development and applications of advanced materials.

Electrical Contacts

Author : Paul G. Slade
Publisher : CRC Press
ISBN 13 : 9780824719340
Total Pages : 1116 pages
Book Rating : 4.7/5 (193 download)

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Book Synopsis Electrical Contacts by : Paul G. Slade

Download or read book Electrical Contacts written by Paul G. Slade and published by CRC Press. This book was released on 1999-03-31 with total page 1116 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering the choice, attachment, and testing of contact materials, Electrical Contacts introduces a thorough discussion on making electric contact and contact interface conduction, presents a general outline of, and measurement techniques for, important corrosion mechanisms, discusses the results of contact wear when plug-in connections are made and broken, investigates the effect of thin noble metal plating on electronic connections, relates crucial considerations for making high- and low-power contact joints, details arcing effects on contacts including contact erosion, welding, and contamination, and contains nearly 2800 references, tables, equations, drawings, and photographs.

Smart Materials

Author : Mel Schwartz
Publisher : CRC Press
ISBN 13 : 1420043730
Total Pages : 556 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis Smart Materials by : Mel Schwartz

Download or read book Smart Materials written by Mel Schwartz and published by CRC Press. This book was released on 2008-11-20 with total page 556 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explores State-of-the-Art Work from the World's Foremost Scientists, Engineers, Educators, and Practitioners in the FieldWhy use smart materials?Since most smart materials do not add mass, engineers can endow structures with built-in responses to a myriad of contingencies. In their various forms, these materials can adapt to their environments by c

Handbook of Silicon Based MEMS Materials and Technologies

Author : Markku Tilli
Publisher : Elsevier
ISBN 13 : 012817787X
Total Pages : 1028 pages
Book Rating : 4.1/5 (281 download)

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Book Synopsis Handbook of Silicon Based MEMS Materials and Technologies by : Markku Tilli

Download or read book Handbook of Silicon Based MEMS Materials and Technologies written by Markku Tilli and published by Elsevier. This book was released on 2020-04-17 with total page 1028 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. - Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits - Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures - Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements - Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors

Component Reliability for Electronic Systems

Author : Titu I. Băjenescu
Publisher : Artech House
ISBN 13 : 1596934360
Total Pages : 706 pages
Book Rating : 4.5/5 (969 download)

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Book Synopsis Component Reliability for Electronic Systems by : Titu I. Băjenescu

Download or read book Component Reliability for Electronic Systems written by Titu I. Băjenescu and published by Artech House. This book was released on 2010 with total page 706 pages. Available in PDF, EPUB and Kindle. Book excerpt: The main reason for the premature breakdown of today's electronic products (computers, cars, tools, appliances, etc.) is the failure of the components used to build these products. Today professionals are looking for effective ways to minimize the degradation of electronic components to help ensure longer-lasting, more technically sound products and systems. This practical book offers engineers specific guidance on how to design more reliable components and build more reliable electronic systems. Professionals learn how to optimize a virtual component prototype, accurately monitor product reliability during the entire production process, and add the burn-in and selection procedures that are the most appropriate for the intended applications. Moreover, the book helps system designers ensure that all components are correctly applied, margins are adequate, wear-out failure modes are prevented during the expected duration of life, and system interfaces cannot lead to failure.

Silicon Carbide, Volume 2

Author : Peter Friedrichs
Publisher : John Wiley & Sons
ISBN 13 : 9783527629084
Total Pages : 520 pages
Book Rating : 4.6/5 (29 download)

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Book Synopsis Silicon Carbide, Volume 2 by : Peter Friedrichs

Download or read book Silicon Carbide, Volume 2 written by Peter Friedrichs and published by John Wiley & Sons. This book was released on 2011-04-08 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon Carbide - this easy to manufacture compound of silicon and carbon is said to be THE emerging material for applications in electronics. High thermal conductivity, high electric field breakdown strength and high maximum current density make it most promising for high-powered semiconductor devices. Apart from applications in power electronics, sensors, and NEMS, SiC has recently gained new interest as a substrate material for the manufacture of controlled graphene. SiC and graphene research is oriented towards end markets and has high impact on areas of rapidly growing interest like electric vehicles. This volume is devoted to high power devices products and their challenges in industrial application. Readers will benefit from reports on development and reliability aspects of Schottky barrier diodes, advantages of SiC power MOSFETs, or SiC sensors. The authors discuss MEMS and NEMS as SiC-based electronics for automotive industry as well as SiC-based circuit elements for high temperature applications, and the application of transistors in PV-inverters. The list of contributors reads like a "Who's Who" of the SiC community, strongly benefiting from collaborations between research institutions and enterprises active in SiC crystal growth and device development. Among the former are CREE Inc. and Fraunhofer ISE, while the industry is represented by Toshiba, Nissan, Infineon, NASA, Naval Research Lab, and Rensselaer Polytechnic Institute, to name but a few.

Harsh Environment Electronics

Author : Ahmed Sharif
Publisher : John Wiley & Sons
ISBN 13 : 3527813993
Total Pages : 400 pages
Book Rating : 4.5/5 (278 download)

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Book Synopsis Harsh Environment Electronics by : Ahmed Sharif

Download or read book Harsh Environment Electronics written by Ahmed Sharif and published by John Wiley & Sons. This book was released on 2019-03-19 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.

Proceedings of the 2023 9th International Conference on Advances in Energy Resources and Environment Engineering (ICAESEE 2023)

Author : Abd El-Fatah Abomohra
Publisher : Springer Nature
ISBN 13 : 9464634154
Total Pages : 890 pages
Book Rating : 4.4/5 (646 download)

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Book Synopsis Proceedings of the 2023 9th International Conference on Advances in Energy Resources and Environment Engineering (ICAESEE 2023) by : Abd El-Fatah Abomohra

Download or read book Proceedings of the 2023 9th International Conference on Advances in Energy Resources and Environment Engineering (ICAESEE 2023) written by Abd El-Fatah Abomohra and published by Springer Nature. This book was released on 2024 with total page 890 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Extreme Environment Electronics

Author : John D. Cressler
Publisher : CRC Press
ISBN 13 : 143987431X
Total Pages : 1041 pages
Book Rating : 4.4/5 (398 download)

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Book Synopsis Extreme Environment Electronics by : John D. Cressler

Download or read book Extreme Environment Electronics written by John D. Cressler and published by CRC Press. This book was released on 2017-12-19 with total page 1041 pages. Available in PDF, EPUB and Kindle. Book excerpt: Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Author : Ephraim Suhir
Publisher : Springer Science & Business Media
ISBN 13 : 0387329897
Total Pages : 1471 pages
Book Rating : 4.3/5 (873 download)

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Book Synopsis Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging by : Ephraim Suhir

Download or read book Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Lead-free Electronics

Author : Sanka Ganesan
Publisher : John Wiley & Sons
ISBN 13 : 0470007796
Total Pages : 796 pages
Book Rating : 4.4/5 (7 download)

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Book Synopsis Lead-free Electronics by : Sanka Ganesan

Download or read book Lead-free Electronics written by Sanka Ganesan and published by John Wiley & Sons. This book was released on 2006-03-31 with total page 796 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: * Complying with state legislation * Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues * Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement * Implementing cost effective manufacturing and testing * Reducing risks due to tin whiskers * Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries * Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects * Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach. With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.