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Physical Design Of Electronic Systems Integrated Device And Connection Technology
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Book Synopsis Physical Design of Electronic Systems: Integrated device and connection technology by : Bell Telephone Laboratories
Download or read book Physical Design of Electronic Systems: Integrated device and connection technology written by Bell Telephone Laboratories and published by . This book was released on 1970 with total page 764 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Introduction to Electromagnetic Compatibility by : Clayton R. Paul
Download or read book Introduction to Electromagnetic Compatibility written by Clayton R. Paul and published by John Wiley & Sons. This book was released on 2022-10-11 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt: INTRODUCTION TO ELECTROMAGNETIC COMPATIBILITY The revised new edition of the classic textbook is an essential resource for anyone working with today’s advancements in both digital and analog devices, communications systems, as well as power/energy generation and distribution. Introduction to Electromagnetic Compatibility provides thorough coverage of the techniques and methodologies used to design and analyze electronic systems that function acceptably in their electromagnetic environment. Assuming no prior familiarity with electromagnetic compatibility, this user-friendly textbook first explains fundamental EMC concepts and technologies before moving on to more advanced topics in EMC system design. This third edition reflects the results of an extensive detailed review of the entire second edition, embracing and maintaining the content that has “stood the test of time”, such as from the theory of electromagnetic phenomena and associated mathematics, to the practical background information on U.S. and international regulatory requirements. In addition to converting Dr. Paul’s original SPICE exercises to contemporary utilization of LTSPICE, there is new chapter material on antenna modeling and simulation. This edition will continue to provide invaluable information on computer modeling for EMC, circuit board and system-level EMC design, EMC test practices, EMC measurement procedures and equipment, and more such as: Features fully-worked examples, topic reviews, self-assessment questions, end-of-chapter exercises, and numerous high-quality images and illustrations Contains useful appendices of phasor analysis methods, electromagnetic field equations and waves. The ideal textbook for university courses on EMC, Introduction to Electromagnetic Compatibility, Third Edition is also an invaluable reference for practicing electrical engineers dealing with interference issues or those wanting to learn more about electromagnetic compatibility to become better product designers.
Book Synopsis Physical Design of Electronic Systems. by :
Download or read book Physical Design of Electronic Systems. written by and published by . This book was released on 1970 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Three-Dimensional Integrated Circuit Design by : Vasilis F. Pavlidis
Download or read book Three-Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Book Synopsis Electromagnetic Compatibility Handbook by : Kenneth L. Kaiser
Download or read book Electromagnetic Compatibility Handbook written by Kenneth L. Kaiser and published by CRC Press. This book was released on 2004-09-29 with total page 2714 pages. Available in PDF, EPUB and Kindle. Book excerpt: As the number of electrical devices in use continues to grow, so do the challenges of ensuring the electromagnetic compatibility (EMC) of products and systems. Fortunately, engineers have at their disposal an array of approximations, models, and rules-of-thumb to help them meet those challenges. Unfortunately, the number of these tools and guidelines is overwhelming, and worse still is the thought of investigating their origins and confirming their results. The Electromagnetic Compatibility Handbook is an unprecedented compilation of the many approximations, guidelines, models, and rules-of-thumb used in EMC analyses, complete with their sources and their limitations. The book presents these in an efficient question-and-answer format and incorporates an extremely comprehensive set of tables and figures. The author has either derived from basic principles or obtained and verified from their original sources all of the expressions in the tables. Mathcad was used to generate most of the plots and solve many of the equations, and the author includes the Mathcad programs for many of these so users can clearly see the variable assignments, assumptions, and equations. Designed to be of long-lasting value to engineers, researchers, and students, the Electromagnetic Compatibility Handbook is ideal both for quick reference and as a textbook for upper-level and graduate electrical engineering courses.
Book Synopsis Fundamentals of Layout Design for Electronic Circuits by : Jens Lienig
Download or read book Fundamentals of Layout Design for Electronic Circuits written by Jens Lienig and published by Springer Nature. This book was released on 2020-03-19 with total page 319 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers the fundamental knowledge of layout design from the ground up, addressing both physical design, as generally applied to digital circuits, and analog layout. Such knowledge provides the critical awareness and insights a layout designer must possess to convert a structural description produced during circuit design into the physical layout used for IC/PCB fabrication. The book introduces the technological know-how to transform silicon into functional devices, to understand the technology for which a layout is targeted (Chap. 2). Using this core technology knowledge as the foundation, subsequent chapters delve deeper into specific constraints and aspects of physical design, such as interfaces, design rules and libraries (Chap. 3), design flows and models (Chap. 4), design steps (Chap. 5), analog design specifics (Chap. 6), and finally reliability measures (Chap. 7). Besides serving as a textbook for engineering students, this book is a foundational reference for today’s circuit designers. For Slides and Other Information: https://www.ifte.de/books/pd/index.html
Book Synopsis Systems Approach to Engineering Design by : P. H. Sydenham
Download or read book Systems Approach to Engineering Design written by P. H. Sydenham and published by Artech House. This book was released on 2004 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: This guide empowers small teams with systems engineering techniques that once were the exclusive domain of large organizations employing hundreds of engineers to develop complex, tightly integrated systems designs.
Book Synopsis Transmission Lines, Matching, and Crosstalk by : Kenneth L. Kaiser
Download or read book Transmission Lines, Matching, and Crosstalk written by Kenneth L. Kaiser and published by CRC Press. This book was released on 2005-09-20 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: In chapters culled from the popular and critically acclaimed Electromagnetic Compatibility Handbook, Transmission Lines, Matching, and Crosstalk provides a tightly focused, convenient, and affordable reference for those interested primarily in this subset of topics. Author Kenneth L. Kaiser demystifies transmission lines, matching, and crosstalk and explains the source and limitations of the approximations, guidelines, models, and rules-of-thumb used in this field. The material is presented in a unique question-and-answer format that gets straight to the heart of each topic. The book includes numerous examples and uses Mathcad to generate all of the figures and many solutions to equations. In many cases, the entire Mathcad program is provided.
Author :Library of Congress. Copyright Office Publisher :Copyright Office, Library of Congress ISBN 13 : Total Pages :1040 pages Book Rating :4.F/5 ( download)
Book Synopsis Catalog of Copyright Entries. Third Series by : Library of Congress. Copyright Office
Download or read book Catalog of Copyright Entries. Third Series written by Library of Congress. Copyright Office and published by Copyright Office, Library of Congress. This book was released on 1973 with total page 1040 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis VLSI Physical Design: From Graph Partitioning to Timing Closure by : Andrew B. Kahng
Download or read book VLSI Physical Design: From Graph Partitioning to Timing Closure written by Andrew B. Kahng and published by Springer Science & Business Media. This book was released on 2011-01-27 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: Design and optimization of integrated circuits are essential to the creation of new semiconductor chips, and physical optimizations are becoming more prominent as a result of semiconductor scaling. Modern chip design has become so complex that it is largely performed by specialized software, which is frequently updated to address advances in semiconductor technologies and increased problem complexities. A user of such software needs a high-level understanding of the underlying mathematical models and algorithms. On the other hand, a developer of such software must have a keen understanding of computer science aspects, including algorithmic performance bottlenecks and how various algorithms operate and interact. "VLSI Physical Design: From Graph Partitioning to Timing Closure" introduces and compares algorithms that are used during the physical design phase of integrated-circuit design, wherein a geometric chip layout is produced starting from an abstract circuit design. The emphasis is on essential and fundamental techniques, ranging from hypergraph partitioning and circuit placement to timing closure.
Book Synopsis Electromagnetic Shielding by : Kenneth L. Kaiser
Download or read book Electromagnetic Shielding written by Kenneth L. Kaiser and published by CRC Press. This book was released on 2005-09-13 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt: In chapters culled from popular and critically acclaimed Electromagnetic Compatibility Handbook, Electromagnetic Shielding provides a tightly focused, convenient, and affordable reference for those interested primarily in this subset of topics. Author Kenneth L. Kaiser demystifies shielding and explains the source and limitations of the approximations, guidelines, models, and rules-of-thumb used in this field. The material is presented in a unique question-and-answer format that gets straight to the heart of each topic. The book includes numerous examples and uses Mathcad to generate all of the figures and many solutions to equations. In many cases, the entire Mathcad program is provided.
Download or read book Choice written by and published by . This book was released on 1971 with total page 786 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book AGARD Lecture Series written by and published by . This book was released on 1970 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electromagnetic Compatibility Engineering by : Henry W. Ott
Download or read book Electromagnetic Compatibility Engineering written by Henry W. Ott and published by John Wiley & Sons. This book was released on 2011-09-20 with total page 883 pages. Available in PDF, EPUB and Kindle. Book excerpt: Praise for Noise Reduction Techniques IN electronic systems "Henry Ott has literally 'written the book' on the subject of EMC. . . . He not only knows the subject, but has the rare ability to communicate that knowledge to others." —EE Times Electromagnetic Compatibility Engineering is a completely revised, expanded, and updated version of Henry Ott's popular book Noise Reduction Techniques in Electronic Systems. It reflects the most recent developments in the field of electromagnetic compatibility (EMC) and noise reduction¿and their practical applications to the design of analog and digital circuits in computer, home entertainment, medical, telecom, industrial process control, and automotive equipment, as well as military and aerospace systems. While maintaining and updating the core information—such as cabling, grounding, filtering, shielding, digital circuit grounding and layout, and ESD—that made the previous book such a wide success, this new book includes additional coverage of: Equipment/systems grounding Switching power supplies and variable-speed motor drives Digital circuit power distribution and decoupling PCB layout and stack-up Mixed-signal PCB layout RF and transient immunity Power line disturbances Precompliance EMC measurements New appendices on dipole antennae, the theory of partial inductance, and the ten most common EMC problems The concepts presented are applicable to analog and digital circuits operating from below audio frequencies to those in the GHz range. Throughout the book, an emphasis is placed on cost-effective EMC designs, with the amount and complexity of mathematics kept to the strictest minimum. Complemented with over 250 problems with answers, Electromagnetic Compatibility Engineering equips readers with the knowledge needed to design electronic equipment that is compatible with the electromagnetic environment and compliant with national and international EMC regulations. It is an essential resource for practicing engineers who face EMC and regulatory compliance issues and an ideal textbook for EE courses at the advanced undergraduate and graduate levels.
Book Synopsis Through-Silicon Vias for 3D Integration by : John Lau
Download or read book Through-Silicon Vias for 3D Integration written by John Lau and published by McGraw Hill Professional. This book was released on 2012-09-20 with total page 514 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems. Coverage includes: Nanotechnology and 3D integration for the semiconductor industry TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing TSVs: mechanical, thermal, and electrical behaviors Thin-wafer strength measurement Wafer thinning and thin-wafer handling Microbumping, assembly, and reliability Microbump electromigration Transient liquid-phase bonding: C2C, C2W, and W2W 2.5D IC integration with interposers 3D IC integration with interposers Thermal management of 3D IC integration 3D IC packaging
Book Synopsis Bell Laboratories Record by : Bell Telephone Laboratories
Download or read book Bell Laboratories Record written by Bell Telephone Laboratories and published by . This book was released on 1976 with total page 378 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Joining of Advanced and Specialty Materials VII by : T. J. Lienert
Download or read book Joining of Advanced and Specialty Materials VII written by T. J. Lienert and published by ASM International(OH). This book was released on 2005 with total page 234 pages. Available in PDF, EPUB and Kindle. Book excerpt:
