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Author : IEEE
Publisher :
ISBN 13 :
Total Pages : 210 pages
Book Rating : 4.3/5 (91 download)
Download or read book Multi-Chip Module Conference written by IEEE and published by . This book was released on 1992 with total page 210 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book IEEE multi-chip module conference ... written by and published by . This book was released on 1997 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Institute of Electrical and Electronics Engineers, Inc. Staff
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (131 download)
Download or read book Multi-Chip Module Conference (MCMC-95 written by Institute of Electrical and Electronics Engineers, Inc. Staff and published by . This book was released on 1995 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 : 9780818655609
Total Pages : 0 pages
Book Rating : 4.6/5 (556 download)
Download or read book Multi-chip Module Conference written by and published by . This book was released on 1994 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Yervant Zorian
Publisher : Springer Science & Business Media
ISBN 13 : 1461561078
Total Pages : 161 pages
Book Rating : 4.4/5 (615 download)
Download or read book Multi-Chip Module Test Strategies written by Yervant Zorian and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt: MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
Author : Institute of Electrical and Electronics Engineers, Inc. Staff
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (131 download)
Download or read book Multi-Chip Module Conference (MCMC-94 written by Institute of Electrical and Electronics Engineers, Inc. Staff and published by . This book was released on 1994 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Institute of Electrical and Electronics Engineers, Inc. Staff
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (131 download)
Download or read book Multi-Chip Module Conference (MCMC-92 written by Institute of Electrical and Electronics Engineers, Inc. Staff and published by . This book was released on 1992 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : IEEE Circuits and Systems Society
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (829 download)
Download or read book Proceedings written by IEEE Circuits and Systems Society and published by . This book was released on 1997 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 400 pages
Book Rating : 4.3/5 (91 download)
Download or read book Proceedings written by and published by . This book was released on 1997 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Mysore Sriram
Publisher : Springer Science & Business Media
ISBN 13 : 1461526825
Total Pages : 205 pages
Book Rating : 4.4/5 (615 download)
Download or read book Physical Design for Multichip Modules written by Mysore Sriram and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 205 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.
Author : IEEE Computer Society
Publisher : IEEE Computer Society
ISBN 13 : 9780818677892
Total Pages : 171 pages
Book Rating : 4.6/5 (778 download)
Download or read book Proceedings, 1997 IEEE Multi-Chip Module Conference written by IEEE Computer Society and published by IEEE Computer Society. This book was released on 1997-01-01 with total page 171 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Institute of Electrical and Electronics Engineers, Inc. Staff
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (131 download)
Download or read book Multi-Chip Module Conference, 1996 IEEE (MCMC-96 written by Institute of Electrical and Electronics Engineers, Inc. Staff and published by . This book was released on 1996 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Peter A. Sandborn
Publisher : Springer Science & Business Media
ISBN 13 : 1475748418
Total Pages : 270 pages
Book Rating : 4.4/5 (757 download)
Download or read book Conceptual Design of Multichip Modules and Systems written by Peter A. Sandborn and published by Springer Science & Business Media. This book was released on 2013-03-14 with total page 270 pages. Available in PDF, EPUB and Kindle. Book excerpt: Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.
Author : IEEE Computer Society Staff
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (131 download)
Download or read book Multi-Chip Module Conference, 1997 IEEE (MCMC-97). written by IEEE Computer Society Staff and published by . This book was released on 1997 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 : 9780818677915
Total Pages : 171 pages
Book Rating : 4.6/5 (779 download)
Download or read book Proceedings, 1997 IEEE Multi-Chip Module Conference written by and published by . This book was released on 1997 with total page 171 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Institute of Electrical and Electronics Engineers, Inc. Staff
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (131 download)
Download or read book IEEE Multi-Chip Module Conference, 1993 written by Institute of Electrical and Electronics Engineers, Inc. Staff and published by . This book was released on 1993 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : John H. Lau
Publisher : Springer Science & Business Media
ISBN 13 : 9780442014414
Total Pages : 584 pages
Book Rating : 4.0/5 (144 download)
Download or read book Chip On Board written by John H. Lau and published by Springer Science & Business Media. This book was released on 1994-06-30 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
