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Monolithic Integration Of Electronics And Mems In 6h Silicon Carbide For Use In Harsh Environment Applications
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Book Synopsis Monolithic Integration of Electronics and MEMS in 6H Silicon Carbide for Use in Harsh Environment Applications by : Eskinder Hailu
Download or read book Monolithic Integration of Electronics and MEMS in 6H Silicon Carbide for Use in Harsh Environment Applications written by Eskinder Hailu and published by . This book was released on 2003 with total page 482 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Silicon Carbide Microsystems for Harsh Environments by : Muthu Wijesundara
Download or read book Silicon Carbide Microsystems for Harsh Environments written by Muthu Wijesundara and published by Springer Science & Business Media. This book was released on 2011-05-17 with total page 247 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon Carbide Microsystems for Harsh Environments reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments, technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation. The authors use the SiC technology platform suite the model platform for developing harsh environment microsystems and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods towards system level integration of components and key challenges are evaluated and discussed based on the current state of SiC materials processing and device technology. Issues such as temperature mismatch, process compatibility and temperature stability of individual components and how these issues manifest when building the system receive thorough investigation. The material covered not only reviews the state-of-the-art MEMS devices, provides a framework for the joining of electronics and MEMS along with packaging into usable harsh-environment-ready sensor modules.
Book Synopsis Silicon Carbide Microelectromechanical Systems for Harsh Environments by : Rebecca Cheung
Download or read book Silicon Carbide Microelectromechanical Systems for Harsh Environments written by Rebecca Cheung and published by World Scientific. This book was released on 2006 with total page 193 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique book describes the science and technology of silicon carbide (SiC) microelectromechanical systems (MEMS), from the creation of SiC material to the formation of final system, through various expert contributions by several leading key figures in the field. The book contains high-quality up-to-date scientific information concerning SiC MEMS for harsh environments summarized concisely for students, academics, engineers and researchers in the field of SiC MEMS.This is the only book that addresses in a comprehensive manner the main advantages of SiC as a MEMS material for applications in high temperature and harsh environments, as well as approaches to the relevant technologies, with a view progressing towards the final product.
Book Synopsis MEMS and Microstructures in Aerospace Applications by : Robert Osiander
Download or read book MEMS and Microstructures in Aerospace Applications written by Robert Osiander and published by CRC Press. This book was released on 2018-10-03 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: The promise of MEMS for aerospace applications has been germinating for years, and current advances bring the field to the very cusp of fruition. Reliability is chief among the challenges limiting the deployment of MEMS technologies in space, as the requirement of zero failure during the mission is quite stringent for this burgeoning field. MEMS and Microstructures in Aerospace Applications provides all the necessary tools to overcome these obstacles and take MEMS from the lab bench to beyond the exosphere. The book begins with an overview of MEMS development and provides several demonstrations of past and current examples of MEMS in space. From this platform, the discussion builds to fabrication technologies; the effect of space environmental factors on MEMS devices; and micro technologies for space systems, instrumentation, communications, thermal control, guidance navigation and control, and propulsion. Subsequent chapters explore factors common to all of the described systems, such as MEMS packaging, handling and contamination control, material selection for specific applications, reliability practices for design and application, and assurance practices. Edited and contributed by an outstanding team of leading experts from industry, academia, and national laboratories, MEMS and Microstructures in Aerospace Applications illuminates the path toward qualifying and integrating MEMS devices and instruments into future space missions and developing innovative satellite systems.
Book Synopsis Dissertation Abstracts International by :
Download or read book Dissertation Abstracts International written by and published by . This book was released on 2003 with total page 812 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Sensor Systems Simulations by : Willem Dirk van Driel
Download or read book Sensor Systems Simulations written by Willem Dirk van Driel and published by Springer. This book was released on 2019-06-18 with total page 457 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes for readers various technical outcomes from the EU-project IoSense. The authors discuss sensor integration, including LEDs, dust sensors, LIDAR for automotive driving and 8 more, demonstrating their use in simulations for the design and fabrication of sensor systems. Readers will benefit from the coverage of topics such as sensor technologies for both discrete and integrated innovative sensor devices, suitable for high volume production, electrical, mechanical, security and software resources for integration of sensor system components into IoT systems and IoT-enabling systems, and IoT sensor system reliability. Describes from component to system level simulation, how to use the available simulation techniques for reaching a proper design with good performance; Explains how to use simulation techniques such as Finite Elements, Multi-body, Dynamic, stochastics and many more in the virtual design of sensor systems; Demonstrates the integration of several sensor solutions (thermal, dust, occupancy, distance, awareness and more) into large-scale system solutions in several industrial domains (Lighting, automotive, transport and more); Includes state-of-the-art simulation techniques, both multi-scale and multi-physics, for use in the electronic industry.
Book Synopsis Thermoelectrical Effect in SiC for High-Temperature MEMS Sensors by : Toan Dinh
Download or read book Thermoelectrical Effect in SiC for High-Temperature MEMS Sensors written by Toan Dinh and published by Springer. This book was released on 2018-10-05 with total page 122 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the fundamentals of the thermoelectrical effect in silicon carbide (SiC), including the thermoresistive, thermoelectric, thermocapacitive and thermoelectronic effects. It summarizes the growth of SiC, its properties and fabrication processes for SiC devices and introduces the thermoelectrical sensing theories in different SiC morphologies and polytypes. Further, it reviews the recent advances in the characterization of the thermoelectrical effect in SiC at high temperatures. Discussing several desirable features of thermoelectrical SiC sensors and recent developments in these sensors, the book provides useful guidance on developing high sensitivity and linearity, fast-response SiC sensing devices based on thermoelectrical effects.
Author :Cornelius T. Leondes Publisher :Springer Science & Business Media ISBN 13 :0387257861 Total Pages :2142 pages Book Rating :4.3/5 (872 download)
Download or read book Mems/Nems written by Cornelius T. Leondes and published by Springer Science & Business Media. This book was released on 2007-10-08 with total page 2142 pages. Available in PDF, EPUB and Kindle. Book excerpt: This significant and uniquely comprehensive five-volume reference is a valuable source for research workers, practitioners, computer scientists, students, and technologists. It covers all of the major topics within the subject and offers a comprehensive treatment of MEMS design, fabrication techniques, and manufacturing methods. It also includes current medical applications of MEMS technology and provides applications of MEMS to opto-electronic devices. It is clearly written, self-contained, and accessible, with helpful standard features including an introduction, summary, extensive figures and design examples with comprehensive reference lists.
Book Synopsis Fabrication and Characterization of 4H-SiC MEMS for Harsh Environments and MoS2 for Chemical Sensing by : Allen Vincent Lim
Download or read book Fabrication and Characterization of 4H-SiC MEMS for Harsh Environments and MoS2 for Chemical Sensing written by Allen Vincent Lim and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis American Doctoral Dissertations by :
Download or read book American Doctoral Dissertations written by and published by . This book was released on 2002 with total page 776 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Silicon Carbide MEMS Devices for Harsh Environments by : Andrew Ryan Atwell
Download or read book Silicon Carbide MEMS Devices for Harsh Environments written by Andrew Ryan Atwell and published by . This book was released on 2002 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Extreme Environment Electronics by : John D. Cressler
Download or read book Extreme Environment Electronics written by John D. Cressler and published by CRC Press. This book was released on 2017-12-19 with total page 1041 pages. Available in PDF, EPUB and Kindle. Book excerpt: Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.
Book Synopsis Modularly Integrated MEMS Technology by : Marie-Ange Naida Eyoum
Download or read book Modularly Integrated MEMS Technology written by Marie-Ange Naida Eyoum and published by . This book was released on 2006 with total page 157 pages. Available in PDF, EPUB and Kindle. Book excerpt: Process design, development and integration to fabricate reliable MEMS devices on top of VLSI-CMOS electronics without damaging the underlying circuitry have been investigated throughout this dissertation. Experimental and theoretical results that utilize two "Post-CMOS" integration approaches will be presented.
Book Synopsis MEMS and MOEMS Technology and Applications by : P. Rai-Choudhury
Download or read book MEMS and MOEMS Technology and Applications written by P. Rai-Choudhury and published by SPIE Press. This book was released on 2000 with total page 544 pages. Available in PDF, EPUB and Kindle. Book excerpt: The silicon age that led the computer revolution has significantly changed the world. The next 30 years will see the incorporation of new types of functionality onto the chip-structures that will enable the chip to reason, to sense, to act and to communicate. Micromachining technologies offer a wide range of possibilities for active and passive devices. Recent developments have produced sensors, actuators and optical systems. Many of these technologies are based on surface micromachining, which has evolved from silicon integrated circuit technology. This book is written by experts in the field. It contains useful details in design and processing and can be utilized as a reference book or as a textbook.
Book Synopsis Microelectromechanical Systems by : National Research Council
Download or read book Microelectromechanical Systems written by National Research Council and published by National Academies Press. This book was released on 1998-01-01 with total page 76 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectromenchanical systems (MEMS) is a revolutionary field that adapts for new uses a technology already optimized to accomplish a specific set of objectives. The silicon-based integrated circuits process is so highly refined it can produce millions of electrical elements on a single chip and define their critical dimensions to tolerances of 100-billionths of a meter. The MEMS revolution harnesses the integrated circuitry know-how to build working microsystems from micromechanical and microelectronic elements. MEMS is a multidisciplinary field involving challenges and opportunites for electrical, mechanical, chemical, and biomedical engineering as well as physics, biology, and chemistry. As MEMS begin to permeate more and more industrial procedures, society as a whole will be strongly affected because MEMS provide a new design technology that could rivalâ€"perhaps surpassâ€"the societal impact of integrated circuits.
Book Synopsis Post-processing Techniques for Integrated MEMS by : Sherif Sedky
Download or read book Post-processing Techniques for Integrated MEMS written by Sherif Sedky and published by Artech House Publishers. This book was released on 2006 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: This groundbreaking resource presents cutting-edge post-processing techniques for the monolithic integration of MEMS. You learn how to select MEMS structural layers that can be processed on top of standard pre-fabricated electronics and will optimize the performance and reliability of the MEMS device. Supported with over 240 illustrations, the book details a modular integration process that won't modify the electronics fabrication process or impose any limitation for optimizing the physical properties of the MEMS structural layers.
Book Synopsis Poly-SiGe for MEMS-above-CMOS Sensors by : Pilar Gonzalez Ruiz
Download or read book Poly-SiGe for MEMS-above-CMOS Sensors written by Pilar Gonzalez Ruiz and published by Springer. This book was released on 2013-07-30 with total page 199 pages. Available in PDF, EPUB and Kindle. Book excerpt: Polycrystalline SiGe has emerged as a promising MEMS (Microelectromechanical Systems) structural material since it provides the desired mechanical properties at lower temperatures compared to poly-Si, allowing the direct post-processing on top of CMOS. This CMOS-MEMS monolithic integration can lead to more compact MEMS with improved performance. The potential of poly-SiGe for MEMS above-aluminum-backend CMOS integration has already been demonstrated. However, aggressive interconnect scaling has led to the replacement of the traditional aluminum metallization by copper (Cu) metallization, due to its lower resistivity and improved reliability. Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of poly-SiGe with post-processing above the advanced CMOS technology nodes through the successful fabrication of an integrated poly-SiGe piezoresistive pressure sensor, directly fabricated above 0.13 m Cu-backend CMOS. Furthermore, this book presents the first detailed investigation on the influence of deposition conditions, germanium content and doping concentration on the electrical and piezoresistive properties of boron-doped poly-SiGe. The development of a CMOS-compatible process flow, with special attention to the sealing method, is also described. Piezoresistive pressure sensors with different areas and piezoresistor designs were fabricated and tested. Together with the piezoresistive pressure sensors, also functional capacitive pressure sensors were successfully fabricated on the same wafer, proving the versatility of poly-SiGe for MEMS sensor applications. Finally, a detailed analysis of the MEMS processing impact on the underlying CMOS circuit is also presented.
