Models For Wafer Scale Integration Implementation

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Wafer-Level Integrated Systems

Author : Stuart K. Tewksbury
Publisher : Springer Science & Business Media
ISBN 13 : 1461316251
Total Pages : 456 pages
Book Rating : 4.4/5 (613 download)

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Book Synopsis Wafer-Level Integrated Systems by : Stuart K. Tewksbury

Download or read book Wafer-Level Integrated Systems written by Stuart K. Tewksbury and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: From the perspective of complex systems, conventional Ie's can be regarded as "discrete" devices interconnected according to system design objectives imposed at the circuit board level and higher levels in the system implementation hierarchy. However, silicon monolithic circuits have progressed to such complex functions that a transition from a philosophy of integrated circuits (Ie's) to one of integrated sys tems is necessary. Wafer-scale integration has played an important role over the past few years in highlighting the system level issues which will most significantly impact the implementation of complex monolithic systems and system components. Rather than being a revolutionary approach, wafer-scale integration will evolve naturally from VLSI as defect avoidance, fault tolerance and testing are introduced into VLSI circuits. Successful introduction of defect avoidance, for example, relaxes limits imposed by yield and cost on Ie dimensions, allowing the monolithic circuit's area to be chosen according to the natural partitioning of a system into individual functions rather than imposing area limits due to defect densities. The term "wafer level" is perhaps more appropriate than "wafer-scale". A "wafer-level" monolithic system component may have dimensions ranging from conventional yield-limited Ie dimensions to full wafer dimensions. In this sense, "wafer-scale" merely represents the obvious upper practical limit imposed by wafer sizes on the area of monolithic circuits. The transition to monolithic, wafer-level integrated systems will require a mapping of the full range of system design issues onto the design of monolithic circuit.

Wafer Scale Integration

Author : Earl E. Swartzlander Jr.
Publisher : Springer Science & Business Media
ISBN 13 : 1461316219
Total Pages : 515 pages
Book Rating : 4.4/5 (613 download)

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Book Synopsis Wafer Scale Integration by : Earl E. Swartzlander Jr.

Download or read book Wafer Scale Integration written by Earl E. Swartzlander Jr. and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 515 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.

Frontiers of Computing Systems Research

Author : Stuart K. Tewksbury
Publisher : Springer Science & Business Media
ISBN 13 : 1461570328
Total Pages : 381 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Frontiers of Computing Systems Research by : Stuart K. Tewksbury

Download or read book Frontiers of Computing Systems Research written by Stuart K. Tewksbury and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 381 pages. Available in PDF, EPUB and Kindle. Book excerpt: Intended for an interdisciplinary audience involved in computer systems research, this second volume presents technical information on emerging topics in the field.

Electronic Materials Handbook

Author :
Publisher : ASM International
ISBN 13 : 9780871702852
Total Pages : 1234 pages
Book Rating : 4.7/5 (28 download)

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Book Synopsis Electronic Materials Handbook by :

Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

Design of 3D Integrated Circuits and Systems

Author : Rohit Sharma
Publisher : CRC Press
ISBN 13 : 1351831593
Total Pages : 328 pages
Book Rating : 4.3/5 (518 download)

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Book Synopsis Design of 3D Integrated Circuits and Systems by : Rohit Sharma

Download or read book Design of 3D Integrated Circuits and Systems written by Rohit Sharma and published by CRC Press. This book was released on 2018-09-03 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Wafer Scale Integration, III

Author : Mariagiovanna Sami
Publisher : North Holland
ISBN 13 :
Total Pages : 518 pages
Book Rating : 4.:/5 (41 download)

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Book Synopsis Wafer Scale Integration, III by : Mariagiovanna Sami

Download or read book Wafer Scale Integration, III written by Mariagiovanna Sami and published by North Holland. This book was released on 1990 with total page 518 pages. Available in PDF, EPUB and Kindle. Book excerpt: The purpose of this book is to give an up-to-date presentation of architectures and technologies for wafer-scale integration. As such, it is an overview of the work of the leading research centers active in this area, and an outline of expected evolution and progress in the subject. New technological solutions are envisioned; while the use of optical technologies for interconnections promises to overcome one of the main restrictions to architectures on a wafer, the extension of quick-prototyping solutions to the wafer dimension allows the introduction of wafer-scale systems in educational environments as well as in applications where a quick result and limited production would make traditional silicon solutions unacceptable. Regarding architectures and their applications, three different lines of approach can be identified. Evolutive solutions are proposed, mainly concerning array architectures and restructuring techniques. Innovative architectures are presented, several papers dealing with neural nets. There are also architectures designed not just for experimental reasons but for industrial production. Overall, non-numerical applications predominate.

Form Versus Function: Theory and Models for Neuronal Substrates

Author : Mihai Alexandru Petrovici
Publisher : Springer
ISBN 13 : 3319395521
Total Pages : 394 pages
Book Rating : 4.3/5 (193 download)

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Book Synopsis Form Versus Function: Theory and Models for Neuronal Substrates by : Mihai Alexandru Petrovici

Download or read book Form Versus Function: Theory and Models for Neuronal Substrates written by Mihai Alexandru Petrovici and published by Springer. This book was released on 2016-07-19 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis addresses one of the most fundamental challenges for modern science: how can the brain as a network of neurons process information, how can it create and store internal models of our world, and how can it infer conclusions from ambiguous data? The author addresses these questions with the rigorous language of mathematics and theoretical physics, an approach that requires a high degree of abstraction to transfer results of wet lab biology to formal models. The thesis starts with an in-depth description of the state-of-the-art in theoretical neuroscience, which it subsequently uses as a basis to develop several new and original ideas. Throughout the text, the author connects the form and function of neuronal networks. This is done in order to achieve functional performance of biological brains by transferring their form to synthetic electronics substrates, an approach referred to as neuromorphic computing. The obvious aspect that this transfer can never be perfect but necessarily leads to performance differences is substantiated and explored in detail. The author also introduces a novel interpretation of the firing activity of neurons. He proposes a probabilistic interpretation of this activity and shows by means of formal derivations that stochastic neurons can sample from internally stored probability distributions. This is corroborated by the author’s recent findings, which confirm that biological features like the high conductance state of networks enable this mechanism. The author goes on to show that neural sampling can be implemented on synthetic neuromorphic circuits, paving the way for future applications in machine learning and cognitive computing, for example as energy-efficient implementations of deep learning networks. The thesis offers an essential resource for newcomers to the field and an inspiration for scientists working in theoretical neuroscience and the future of computing.

Learning in Energy-Efficient Neuromorphic Computing: Algorithm and Architecture Co-Design

Author : Nan Zheng
Publisher : John Wiley & Sons
ISBN 13 : 1119507383
Total Pages : 296 pages
Book Rating : 4.1/5 (195 download)

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Book Synopsis Learning in Energy-Efficient Neuromorphic Computing: Algorithm and Architecture Co-Design by : Nan Zheng

Download or read book Learning in Energy-Efficient Neuromorphic Computing: Algorithm and Architecture Co-Design written by Nan Zheng and published by John Wiley & Sons. This book was released on 2019-12-31 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explains current co-design and co-optimization methodologies for building hardware neural networks and algorithms for machine learning applications This book focuses on how to build energy-efficient hardware for neural networks with learning capabilities—and provides co-design and co-optimization methodologies for building hardware neural networks that can learn. Presenting a complete picture from high-level algorithm to low-level implementation details, Learning in Energy-Efficient Neuromorphic Computing: Algorithm and Architecture Co-Design also covers many fundamentals and essentials in neural networks (e.g., deep learning), as well as hardware implementation of neural networks. The book begins with an overview of neural networks. It then discusses algorithms for utilizing and training rate-based artificial neural networks. Next comes an introduction to various options for executing neural networks, ranging from general-purpose processors to specialized hardware, from digital accelerator to analog accelerator. A design example on building energy-efficient accelerator for adaptive dynamic programming with neural networks is also presented. An examination of fundamental concepts and popular learning algorithms for spiking neural networks follows that, along with a look at the hardware for spiking neural networks. Then comes a chapter offering readers three design examples (two of which are based on conventional CMOS, and one on emerging nanotechnology) to implement the learning algorithm found in the previous chapter. The book concludes with an outlook on the future of neural network hardware. Includes cross-layer survey of hardware accelerators for neuromorphic algorithms Covers the co-design of architecture and algorithms with emerging devices for much-improved computing efficiency Focuses on the co-design of algorithms and hardware, which is especially critical for using emerging devices, such as traditional memristors or diffusive memristors, for neuromorphic computing Learning in Energy-Efficient Neuromorphic Computing: Algorithm and Architecture Co-Design is an ideal resource for researchers, scientists, software engineers, and hardware engineers dealing with the ever-increasing requirement on power consumption and response time. It is also excellent for teaching and training undergraduate and graduate students about the latest generation neural networks with powerful learning capabilities.

Scientific and Technical Aerospace Reports

Author :
Publisher :
ISBN 13 :
Total Pages : 542 pages
Book Rating : 4.:/5 (319 download)

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Book Synopsis Scientific and Technical Aerospace Reports by :

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 542 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Government Reports Announcements & Index

Author :
Publisher :
ISBN 13 :
Total Pages : 572 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Government Reports Announcements & Index by :

Download or read book Government Reports Announcements & Index written by and published by . This book was released on 1996 with total page 572 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication

Author : Jianfeng Luo
Publisher : Springer Science & Business Media
ISBN 13 : 3662079283
Total Pages : 327 pages
Book Rating : 4.6/5 (62 download)

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Book Synopsis Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication by : Jianfeng Luo

Download or read book Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication written by Jianfeng Luo and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 327 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.

Masters Theses in the Pure and Applied Sciences

Author : Wade H. Shafer
Publisher : Springer Science & Business Media
ISBN 13 : 1468451979
Total Pages : 407 pages
Book Rating : 4.4/5 (684 download)

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Book Synopsis Masters Theses in the Pure and Applied Sciences by : Wade H. Shafer

Download or read book Masters Theses in the Pure and Applied Sciences written by Wade H. Shafer and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 407 pages. Available in PDF, EPUB and Kindle. Book excerpt: Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS) * at Purdue University in 1 957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dissemination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all con cerned if the printing and distribution of the volumes were handled by an interna tional publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Cor poration of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 29 (thesis year 1984) a total of 12,637 theses titles from 23 Canadian and 202 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this important annual reference work. While Volume 29 reports theses submitted in 1984, on occasion, certain univer sities do report theses submitted in previous years but not reported at the time.

ULSI Process Integration 6

Author : C. Claeys
Publisher : The Electrochemical Society
ISBN 13 : 1566777445
Total Pages : 547 pages
Book Rating : 4.5/5 (667 download)

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Book Synopsis ULSI Process Integration 6 by : C. Claeys

Download or read book ULSI Process Integration 6 written by C. Claeys and published by The Electrochemical Society. This book was released on 2009-09 with total page 547 pages. Available in PDF, EPUB and Kindle. Book excerpt: ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).

Foundations of Software Technology and Theoretical Computer Science

Author : M. Joseph
Publisher : Springer Science & Business Media
ISBN 13 : 9783540138839
Total Pages : 484 pages
Book Rating : 4.1/5 (388 download)

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Book Synopsis Foundations of Software Technology and Theoretical Computer Science by : M. Joseph

Download or read book Foundations of Software Technology and Theoretical Computer Science written by M. Joseph and published by Springer Science & Business Media. This book was released on 1984-11 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Neuroscience, computing, performance, and benchmarks: Why it matters to neuroscience how fast we can compute

Author : Felix Schürmann
Publisher : Frontiers Media SA
ISBN 13 : 2832521657
Total Pages : 431 pages
Book Rating : 4.8/5 (325 download)

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Book Synopsis Neuroscience, computing, performance, and benchmarks: Why it matters to neuroscience how fast we can compute by : Felix Schürmann

Download or read book Neuroscience, computing, performance, and benchmarks: Why it matters to neuroscience how fast we can compute written by Felix Schürmann and published by Frontiers Media SA. This book was released on 2023-04-26 with total page 431 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Circuits at the Nanoscale

Author : Krzysztof Iniewski
Publisher : CRC Press
ISBN 13 : 1351834657
Total Pages : 669 pages
Book Rating : 4.3/5 (518 download)

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Book Synopsis Circuits at the Nanoscale by : Krzysztof Iniewski

Download or read book Circuits at the Nanoscale written by Krzysztof Iniewski and published by CRC Press. This book was released on 2018-10-08 with total page 669 pages. Available in PDF, EPUB and Kindle. Book excerpt: Circuits for Emerging Technologies Beyond CMOS New exciting opportunities are abounding in the field of body area networks, wireless communications, data networking, and optical imaging. In response to these developments, top-notch international experts in industry and academia present Circuits at the Nanoscale: Communications, Imaging, and Sensing. This volume, unique in both its scope and its focus, addresses the state-of-the-art in integrated circuit design in the context of emerging systems. A must for anyone serious about circuit design for future technologies, this book discusses emerging materials that can take system performance beyond standard CMOS. These include Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP). Three-dimensional CMOS integration and co-integration with Microelectromechanical (MEMS) technology and radiation sensors are described as well. Topics in the book are divided into comprehensive sections on emerging design techniques, mixed-signal CMOS circuits, circuits for communications, and circuits for imaging and sensing. Dr. Krzysztof Iniewski is a director at CMOS Emerging Technologies, Inc., a consulting company in Vancouver, British Columbia. His current research interests are in VLSI ciruits for medical applications. He has published over 100 research papers in international journals and conferences, and he holds 18 international patents granted in the United States, Canada, France, Germany, and Japan. In this volume, he has assembled the contributions of over 60 world-reknown experts who are at the top of their field in the world of circuit design, advancing the bank of knowledge for all who work in this exciting and burgeoning area.

Event-Based Neuromorphic Systems

Author : Shih-Chii Liu
Publisher : John Wiley & Sons
ISBN 13 : 0470018496
Total Pages : 440 pages
Book Rating : 4.4/5 (7 download)

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Book Synopsis Event-Based Neuromorphic Systems by : Shih-Chii Liu

Download or read book Event-Based Neuromorphic Systems written by Shih-Chii Liu and published by John Wiley & Sons. This book was released on 2015-02-16 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: Neuromorphic electronic engineering takes its inspiration from the functioning of nervous systems to build more power efficient electronic sensors and processors. Event-based neuromorphic systems are inspired by the brain's efficient data-driven communication design, which is key to its quick responses and remarkable capabilities. This cross-disciplinary text establishes how circuit building blocks are combined in architectures to construct complete systems. These include vision and auditory sensors as well as neuronal processing and learning circuits that implement models of nervous systems. Techniques for building multi-chip scalable systems are considered throughout the book, including methods for dealing with transistor mismatch, extensive discussions of communication and interfacing, and making systems that operate in the real world. The book also provides historical context that helps relate the architectures and circuits to each other and that guides readers to the extensive literature. Chapters are written by founding experts and have been extensively edited for overall coherence. This pioneering text is an indispensable resource for practicing neuromorphic electronic engineers, advanced electrical engineering and computer science students and researchers interested in neuromorphic systems. Key features: Summarises the latest design approaches, applications, and future challenges in the field of neuromorphic engineering. Presents examples of practical applications of neuromorphic design principles. Covers address-event communication, retinas, cochleas, locomotion, learning theory, neurons, synapses, floating gate circuits, hardware and software infrastructure, algorithms, and future challenges.