Microsystem Based On Sip Technology

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MicroSystem Based on SiP Technology

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Author : Suny Li
Publisher : Springer Nature
ISBN 13 : 9811900833
Total Pages : 867 pages
Book Rating : 4.8/5 (119 download)

Book Synopsis MicroSystem Based on SiP Technology by : Suny Li

Download or read book MicroSystem Based on SiP Technology written by Suny Li and published by Springer Nature. This book was released on 2022-05-28 with total page 867 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si3P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification. Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance for the research and development of SiP projects. This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case. Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.

Introduction to Microsystem Packaging Technology

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Author : Yufeng Jin
Publisher : CRC Press
ISBN 13 : 1439865973
Total Pages : 232 pages
Book Rating : 4.4/5 (398 download)

Book Synopsis Introduction to Microsystem Packaging Technology by : Yufeng Jin

Download or read book Introduction to Microsystem Packaging Technology written by Yufeng Jin and published by CRC Press. This book was released on 2017-12-19 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.

MicroSystem Based on SiP Technology

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Author : Suny Li
Publisher :
ISBN 13 : 9789811900846
Total Pages : 0 pages
Book Rating : 4.9/5 (8 download)

Book Synopsis MicroSystem Based on SiP Technology by : Suny Li

Download or read book MicroSystem Based on SiP Technology written by Suny Li and published by . This book was released on 2022 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si3P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification. Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance for the research and development of SiP projects. This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case. Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.

A Fresh Concept of Software-resemblant Hardware to Leap to 6G and Future Networks

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Author : Jacopo Iannacci
Publisher : CRC Press
ISBN 13 : 104008527X
Total Pages : 125 pages
Book Rating : 4.0/5 (4 download)

Book Synopsis A Fresh Concept of Software-resemblant Hardware to Leap to 6G and Future Networks by : Jacopo Iannacci

Download or read book A Fresh Concept of Software-resemblant Hardware to Leap to 6G and Future Networks written by Jacopo Iannacci and published by CRC Press. This book was released on 2024-04-01 with total page 125 pages. Available in PDF, EPUB and Kindle. Book excerpt: For a decade, with the uptake of 4G, we have become accustomed to the relentless increase in data and services on the move. The deployment of 5G is advancing crucial key performance indicators (KPIs), along with quality of service (QoS). Setting the horizon to 2030 and later, 6G will take the KPIs to numbers 100–1000 times better than 5G. Yet, the actual disruption of 6G and future networks (FN) will take place following other unprecedented paths. Artificial intelligence (AI) will be exploited in a threadlike fashion, at any level of the network physical infrastructure. This will introduce, to date unknown features, like self-sustaining, self-evolution and high-resilience of small portions of the infrastructure, pioneering the concept of a network of networks. Each segment of the infrastructure will bear a high degree of independence, while working at the same time as a whole, in full orchestration with the rest of the network. Given such a scenario, this book claims that the established and currently in use paradigms for the design and development of hardware–software (HW–SW) systems, are not appropriate to address the challenges of 6G and, further ahead, of FN. In response, unprecedented design approaches are suggested, relying on a fresh reinterpretation of the standard concept of HW, with specific attention to the network edge and edge intelligence (EI). This work develops some conceptual tools that may help address the technical challenges resulting from the intricate scenario sketched above. Within the mentioned HW reconceptualization, a pivotal role is forecasted for microtechnologies and nanotechnologies, intended with a broad meaning, which embraces, among others, devices, systems (MEMS/NEMS) and materials.

Control Technologies for Emerging Micro and Nanoscale Systems

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Author : Evangelos Eleftheriou
Publisher : Springer
ISBN 13 : 3642221734
Total Pages : 300 pages
Book Rating : 4.6/5 (422 download)

Book Synopsis Control Technologies for Emerging Micro and Nanoscale Systems by : Evangelos Eleftheriou

Download or read book Control Technologies for Emerging Micro and Nanoscale Systems written by Evangelos Eleftheriou and published by Springer. This book was released on 2011-07-15 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book comprises a selection of the presentations made at the “Workshop on Dynamics and Control of Micro and Nanoscale Systems” held at IBM Research – Zurich, Switzerland, on the 10th and 11th of December 2009. The aim of the workshop was to bring together some of the leading researchers in the field of dynamics and control of micro- and nanoscale systems. It proved an excellent forum for discussing new ideas and approaches.

Active Array Antennas for High Resolution Microwave Imaging Radar

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Author : Jiaguo Lu
Publisher : Springer Nature
ISBN 13 : 9819914752
Total Pages : 455 pages
Book Rating : 4.8/5 (199 download)

Book Synopsis Active Array Antennas for High Resolution Microwave Imaging Radar by : Jiaguo Lu

Download or read book Active Array Antennas for High Resolution Microwave Imaging Radar written by Jiaguo Lu and published by Springer Nature. This book was released on 2023-05-04 with total page 455 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights the application of active array antennas in high-resolution microwave imaging radar systems. It introduces the basic principles, analytical methods, and performance parameters of active array antennas to achieve low profile, high efficiency, and lightweight. The book systematically elaborates the architecture, analysis, and engineering practice to achieve wideband, multi-band, multi-polarization, and common aperture in active array antennas. It explores hotspot technologies of digital array antennas, microwave photonic array antennas, and active packaging antennas. By presenting over 300 illustrations and diagrams, including schematic diagrams, block diagrams, relation diagrams, and breakdown drawings, the book enables a thorough understanding of the antenna array microsystem as the advanced phase of active array antennas and the direction of future R&D. The book is a good reference source for researchers and engineers interested in the engineering and implementation of microwave imaging radar systems and antenna technology.

Advances in Information Technology Research and Application: 2012 Edition

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Author :
Publisher : ScholarlyEditions
ISBN 13 : 1464990506
Total Pages : 5246 pages
Book Rating : 4.4/5 (649 download)

Book Synopsis Advances in Information Technology Research and Application: 2012 Edition by :

Download or read book Advances in Information Technology Research and Application: 2012 Edition written by and published by ScholarlyEditions. This book was released on 2012-12-26 with total page 5246 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Information Technology Research and Application / 2012 Edition is a ScholarlyEditions™ eBook that delivers timely, authoritative, and comprehensive information about Information Technology. The editors have built Advances in Information Technology Research and Application / 2012 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Information Technology in this eBook to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Advances in Information Technology Research and Application / 2012 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.

VLSI-SoC: Design Methodologies for SoC and SiP

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Author : Christian Piguet
Publisher : Springer Science & Business Media
ISBN 13 : 3642122663
Total Pages : 297 pages
Book Rating : 4.6/5 (421 download)

Book Synopsis VLSI-SoC: Design Methodologies for SoC and SiP by : Christian Piguet

Download or read book VLSI-SoC: Design Methodologies for SoC and SiP written by Christian Piguet and published by Springer Science & Business Media. This book was released on 2010-04-06 with total page 297 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains extended and revised versions of the best papers that were p- sented during the 16th edition of the IFIP/IEEE WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 16th conference was held at the Grand Hotel of Rhodes Island, Greece (October 13–15, 2008). Previous conferences have taken place in Edinburgh, Trondheim, V- couver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt, Perth, Nice and Atlanta. VLSI-SoC 2008 was the 16th in a series of international conferences sponsored by IFIP TC 10 Working Group 10.5 and IEEE CEDA that explores the state of the art and the new developments in the field of VLSI systems and their designs. The purpose of the conference was to provide a forum to exchange ideas and to present industrial and research results in the fields of VLSI/ULSI systems, embedded systems and - croelectronic design and test.

Micro-Assembly Technologies and Applications

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Author : Sandra Koelemeijer
Publisher : Springer
ISBN 13 : 038777405X
Total Pages : 400 pages
Book Rating : 4.3/5 (877 download)

Book Synopsis Micro-Assembly Technologies and Applications by : Sandra Koelemeijer

Download or read book Micro-Assembly Technologies and Applications written by Sandra Koelemeijer and published by Springer. This book was released on 2008-03-12 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro-assembly is a key enabling technology for cost effective manufacture of new generations of complex micro products. It is also a critical technology for retaining mdustrial capabilities in high labour cost areas such as Europe since up to 80% of the production cost in some industries is attributed directly to assembly processes. With the continuous trend for product miniaturisation, the scientific and technologi cal developments in micro-assembly are expected to have a significant long-term economic, demographic and social impact. A distinctive feature of the process is that surface forces are often dominant over gravity forces, which determines a number of specific technical challenges. Critical areas which are currently being addressed include development of assembly systems with high positional accuracy, micro gripping methods that take into ac count the adhesive surface forces, high precision micro-feeding techniques and mi cro-joining processes. Micro-assembly has developed rapidly over the last few years and all the pre dictions are that it will remain a critical technology for high value products in a number of key sectors such as healthcare, communications, defence and aerospace. The key challenge is to match the significant technological developments with a new generation of micro products that will establish firmly micro-assembly as a core manufacturing process.

Techniques and System Design of Radar Active Jamming

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Author : Guangfu Tang
Publisher : Springer Nature
ISBN 13 : 9811999449
Total Pages : 370 pages
Book Rating : 4.8/5 (119 download)

Book Synopsis Techniques and System Design of Radar Active Jamming by : Guangfu Tang

Download or read book Techniques and System Design of Radar Active Jamming written by Guangfu Tang and published by Springer Nature. This book was released on 2023-02-20 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book serves as a handbook for radar active jamming system designers, in which design principles and methods are introduced in detail. The book starts from the basic concept and then discusses requirements analysis, type selection, key indicators description, and design methods of radar active jamming system and each subsystem step by step. The content is expressed in an intelligible way, and hence, it is easy to follow even for beginners in this area. Since the authors of this book are all experts and have designed plenty of real systems, their book certainly helps new engineers deal with different kinds of problems encountered while designing a radar active jamming system.

Microelectronics Technology and Devices

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Author :
Publisher : The Electrochemical Society
ISBN 13 : 9781566774260
Total Pages : 574 pages
Book Rating : 4.7/5 (742 download)

Book Synopsis Microelectronics Technology and Devices by :

Download or read book Microelectronics Technology and Devices written by and published by The Electrochemical Society. This book was released on 2005 with total page 574 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Ambient Intelligence with Microsystems

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Author : Kieran Delaney
Publisher : Springer Science & Business Media
ISBN 13 : 0387462643
Total Pages : 419 pages
Book Rating : 4.3/5 (874 download)

Book Synopsis Ambient Intelligence with Microsystems by : Kieran Delaney

Download or read book Ambient Intelligence with Microsystems written by Kieran Delaney and published by Springer Science & Business Media. This book was released on 2008-10-17 with total page 419 pages. Available in PDF, EPUB and Kindle. Book excerpt: Augmented Materials and Smart Objects investigates the issues required to ensure technology platforms capable of being seamlessly integrated into everyday objects. In particular, it deals with the requirements for integrated computation and MEMs sensors, system-in-a-package solutions, and multi-chip modules. On top of this, the publication’s 500 pages cover the impact of the trend towards embedded microelectronic electronics sub-systems, novel assembly techniques for autonomous MEMs sensors, and practical performance issues that are key to the AmI concept.

Silicon Photonics III

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Author : Lorenzo Pavesi
Publisher : Springer Science & Business Media
ISBN 13 : 3642105033
Total Pages : 540 pages
Book Rating : 4.6/5 (421 download)

Book Synopsis Silicon Photonics III by : Lorenzo Pavesi

Download or read book Silicon Photonics III written by Lorenzo Pavesi and published by Springer Science & Business Media. This book was released on 2016-01-08 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is volume III of a series of books on silicon photonics. It reports on the development of fully integrated systems where many different photonics component are integrated together to build complex circuits. This is the demonstration of the fully potentiality of silicon photonics. It contains a number of chapters written by engineers and scientists of the main companies, research centers and universities active in the field. It can be of use for all those persons interested to know the potentialities and the recent applications of silicon photonics both in microelectronics, telecommunication and consumer electronics market.

Information Society Technologies

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Author :
Publisher :
ISBN 13 :
Total Pages : 68 pages
Book Rating : 4.:/5 (318 download)

Book Synopsis Information Society Technologies by :

Download or read book Information Society Technologies written by and published by . This book was released on 2001 with total page 68 pages. Available in PDF, EPUB and Kindle. Book excerpt:

3D and Circuit Integration of MEMS

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Author : Masayoshi Esashi
Publisher : John Wiley & Sons
ISBN 13 : 3527823255
Total Pages : 528 pages
Book Rating : 4.5/5 (278 download)

Book Synopsis 3D and Circuit Integration of MEMS by : Masayoshi Esashi

Download or read book 3D and Circuit Integration of MEMS written by Masayoshi Esashi and published by John Wiley & Sons. This book was released on 2021-03-16 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.

Fundamentals of Microsystems Packaging

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Author : Rao Tummala
Publisher : McGraw Hill Professional
ISBN 13 : 0071500596
Total Pages : 979 pages
Book Rating : 4.0/5 (715 download)

Book Synopsis Fundamentals of Microsystems Packaging by : Rao Tummala

Download or read book Fundamentals of Microsystems Packaging written by Rao Tummala and published by McGraw Hill Professional. This book was released on 2001-05-08 with total page 979 pages. Available in PDF, EPUB and Kindle. Book excerpt: LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing

Materials Science of Microelectromechanical Systems (MEMS) Devices

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Author :
Publisher :
ISBN 13 :
Total Pages : 344 pages
Book Rating : 4.3/5 (91 download)

Book Synopsis Materials Science of Microelectromechanical Systems (MEMS) Devices by :

Download or read book Materials Science of Microelectromechanical Systems (MEMS) Devices written by and published by . This book was released on 2001 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: