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Microelectronic Reliability Reliability Test And Diagnostics
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Book Synopsis Microelectronics Manufacturing Diagnostics Handbook by : Abraham Landzberg
Download or read book Microelectronics Manufacturing Diagnostics Handbook written by Abraham Landzberg and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 663 pages. Available in PDF, EPUB and Kindle. Book excerpt: The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.
Book Synopsis Influence of Temperature on Microelectronics and System Reliability by : Pradeep Lall
Download or read book Influence of Temperature on Microelectronics and System Reliability written by Pradeep Lall and published by CRC Press. This book was released on 2020-07-09 with total page 327 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Book Synopsis GaAs MMIC Reliability - High Temperature Behavior by : Aris Christou
Download or read book GaAs MMIC Reliability - High Temperature Behavior written by Aris Christou and published by RIAC. This book was released on 2006 with total page 260 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Microelectronic Reliability by : Edward B. Hakim
Download or read book Microelectronic Reliability written by Edward B. Hakim and published by . This book was released on 1989-01-01 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Recent Advances in Microelectronics Reliability by : Willem Dirk van Driel
Download or read book Recent Advances in Microelectronics Reliability written by Willem Dirk van Driel and published by Springer Nature. This book was released on with total page 405 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Quality and Reliability of Technical Systems by : Alessandro Birolini
Download or read book Quality and Reliability of Technical Systems written by Alessandro Birolini and published by Springer Science & Business Media. This book was released on 2013-03-14 with total page 538 pages. Available in PDF, EPUB and Kindle. Book excerpt: High reliability, maintainability, and safety are expected from complex equipment and systems. To build these characteristics into an item, failure rate and failure mode analyses have to be performed early in the design phase, starting at the com ponent level, and have to be supported by a set of design guidelines for reliability and maintainability as well as by extensive design reviews. Before production, qualification tests of prototypes must ensure that quality and reliability targets have been reached. In the production phase, processes and procedures have to be selec ted and monitored to assure the required quality level. For many systems, availabi lity requirements must also be satisfied. In these cases, stochastic processes can be used to investigate and optimize availability, including logistical support. This book presents the state of the art of the methods and procedures necessary for a cost and time effective quality and reliability assurance during the design and production of equipment and systems. It takes into consideration that: 1. Quality and reliability assurance of complex equipment and systems requires that all engineers involved in a project undertake a set of specific activities from the definition to the operating phase, which are performed concurrently to achieve the best performance, quality, and reliability for given cost and time schedule targets.
Book Synopsis Thermal Management of Electronic Systems II by : E. Beyne
Download or read book Thermal Management of Electronic Systems II written by E. Beyne and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.
Book Synopsis Reliability of Organic Compounds in Microelectronics and Optoelectronics by : Willem Dirk van Driel
Download or read book Reliability of Organic Compounds in Microelectronics and Optoelectronics written by Willem Dirk van Driel and published by Springer Nature. This book was released on 2022-01-31 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
Book Synopsis Failure Modes and Mechanisms in Electronic Packages by : P. Singh
Download or read book Failure Modes and Mechanisms in Electronic Packages written by P. Singh and published by Springer Science & Business Media. This book was released on 1997-11-30 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Author :United States. National Aeronautics and Space Administration. Office of Reliability and Quality Assurance Publisher : ISBN 13 : Total Pages :602 pages Book Rating :4.F/5 ( download)
Book Synopsis Reliability Abstracts and Technical Reviews by : United States. National Aeronautics and Space Administration. Office of Reliability and Quality Assurance
Download or read book Reliability Abstracts and Technical Reviews written by United States. National Aeronautics and Space Administration. Office of Reliability and Quality Assurance and published by . This book was released on 1968 with total page 602 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Capacitive and Resistive Electronic Components by : D.S. Campbell
Download or read book Capacitive and Resistive Electronic Components written by D.S. Campbell and published by CRC Press. This book was released on 1994-05-01 with total page 404 pages. Available in PDF, EPUB and Kindle. Book excerpt: This text, though primarily concerned with the properties and structure of resistors and capacitors, also provides a comprehensive general introduction to the electronic properties of materials used in the manufacture of electronic components. Coverage includes the band theory of materials and the conduction mechanisms in metals, dielectrics and other structures. The manufacture, structure and properties of fixed and variable resistors and capacitors are discussed in detail. Also included are non-linear components such as NTC and PTC thermistors, strain gauges, pressure transducers, varistors and sensors. The text concludes with a chapter on the quality and reliability of electronic devices with practical values of field reliability performance quoted.
Book Synopsis Microelectronic Reliability: Reliability, test and diagnostics by : Edward B. Hakim
Download or read book Microelectronic Reliability: Reliability, test and diagnostics written by Edward B. Hakim and published by Artech House Publishers. This book was released on 1989 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: Text/reference spaning the theoretical concepts of reliability models and failure distributions, to GaAs microcircuit processing and test. Provides background on the development of quality assurance and verification procedures. Some of the new changes under development to cope with pressures brought
Book Synopsis Microelectronics Failure Analysis by :
Download or read book Microelectronics Failure Analysis written by and published by ASM International. This book was released on 2004-01-01 with total page 813 pages. Available in PDF, EPUB and Kindle. Book excerpt: For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Author :United States. National Bureau of Standards. Technical Information and Publications Division Publisher : ISBN 13 : Total Pages :844 pages Book Rating :4.3/5 (91 download)
Book Synopsis Catalog of National Bureau of Standards Publications, 1966-1976 by : United States. National Bureau of Standards. Technical Information and Publications Division
Download or read book Catalog of National Bureau of Standards Publications, 1966-1976 written by United States. National Bureau of Standards. Technical Information and Publications Division and published by . This book was released on 1978 with total page 844 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book NBS Special Publication written by and published by . This book was released on 1978 with total page 790 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :United States. National Bureau of Standards. Technical Information and Publications Division Publisher : ISBN 13 : Total Pages :788 pages Book Rating :4.3/5 (91 download)
Book Synopsis Catalog of National Bureau of Standards Publications, 1966-1976: Key word index by : United States. National Bureau of Standards. Technical Information and Publications Division
Download or read book Catalog of National Bureau of Standards Publications, 1966-1976: Key word index written by United States. National Bureau of Standards. Technical Information and Publications Division and published by . This book was released on 1978 with total page 788 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Catalog of National Bureau of Standards Publications, 1966-1976 by : United States. National Bureau of Standards
Download or read book Catalog of National Bureau of Standards Publications, 1966-1976 written by United States. National Bureau of Standards and published by . This book was released on 1978 with total page 788 pages. Available in PDF, EPUB and Kindle. Book excerpt:
