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Materials Science In Microelectronics I
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Book Synopsis Materials Science in Microelectronics I by : Eugene Machlin
Download or read book Materials Science in Microelectronics I written by Eugene Machlin and published by Elsevier. This book was released on 2010-07-07 with total page 275 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thin films play a key role in the material science of microelectronics, and the subject matter of thin-films divides naturally into two headings: processing / structure relationship, and structure / properties relationship.The first volume of Materials Science in Microelectronics focuses on the first relationship – that between processing and the structure of the thin-film. The state of the thin film's surface during the period that one monolayer exists - before being buried in the next layer – determines the ultimate structure of the thin film, and thus its properties. This volume takes into consideration the following potential influencing factors: crystal defects, void structure, grain structure, interface structure in epitaxial films, the structure of amorphous films, and reaction-induced structure.An ideal text or reference work for students and researchers in material science, who need to learn the basics of thin films.
Book Synopsis Materials Science in Microelectronics II by : Eugene Machlin
Download or read book Materials Science in Microelectronics II written by Eugene Machlin and published by Elsevier. This book was released on 2010-07-07 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: The subject matter of thin-films – which play a key role in microelectronics – divides naturally into two headings: the processing / structure relationship, and the structure / properties relationship. Part II of 'Materials Science in Microelectronics' focuses on the latter of these relationships, examining the effect of structure on the following: •Electrical properties•Magnetic properties•Optical properties•Mechanical properties•Mass transport properties•Interface and junction properties•Defects and properties - Captures the importance of thin films to microelectronic development - Examines the cause / effect relationship of structure on thin film properties
Book Synopsis Electronic Materials Science by : Eugene A. Irene
Download or read book Electronic Materials Science written by Eugene A. Irene and published by John Wiley & Sons. This book was released on 2005-03-25 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: A thorough introduction to fundamental principles andapplications From its beginnings in metallurgy and ceramics, materials sciencenow encompasses such high- tech fields as microelectronics,polymers, biomaterials, and nanotechnology. Electronic MaterialsScience presents the fundamentals of the subject in a detailedfashion for a multidisciplinary audience. Offering a higher-leveltreatment than an undergraduate textbook provides, this textbenefits students and practitioners not only in electronics andoptical materials science, but also in additional cutting-edgefields like polymers and biomaterials. Readers with a basic understanding of physical chemistry or physicswill appreciate the text's sophisticated presentation of today'smaterials science. Instructive derivations of important formulae,usually omitted in an introductory text, are included here. Thisfeature offers a useful glimpse into the foundations of how thediscipline understands such topics as defects, phase equilibria,and mechanical properties. Additionally, concepts such asreciprocal space, electron energy band theory, and thermodynamicsenter the discussion earlier and in a more robust fashion than inother texts. Electronic Materials Science also features: * An orientation towards industry and academia drawn from theauthor's experience in both arenas * Information on applications in semiconductors, optoelectronics,photocells, and nanoelectronics * Problem sets and important references throughout * Flexibility for various pedagogical needs Treating the subject with more depth than any other introductorytext, Electronic Materials Science prepares graduate andupper-level undergraduate students for advanced topics in thediscipline and gives scientists in associated disciplines a clearreview of the field and its leading technologies.
Book Synopsis The Materials Science of Semiconductors by : Angus Rockett
Download or read book The Materials Science of Semiconductors written by Angus Rockett and published by Springer Science & Business Media. This book was released on 2007-11-20 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes semiconductors from a materials science perspective rather than from condensed matter physics or electrical engineering viewpoints. It includes discussion of current approaches to organic materials for electronic devices. It further describes the fundamental aspects of thin film nucleation and growth, and the most common physical and chemical vapor deposition techniques. Examples of the application of the concepts in each chapter to specific problems or situations are included, along with recommended readings and homework problems.
Book Synopsis Microelectronic Materials and Processes by : Roland Levy
Download or read book Microelectronic Materials and Processes written by Roland Levy and published by Springer Science & Business Media. This book was released on 1989-01-31 with total page 1006 pages. Available in PDF, EPUB and Kindle. Book excerpt: The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.
Book Synopsis Microelectronic Materials by : C.R.M. Grovenor
Download or read book Microelectronic Materials written by C.R.M. Grovenor and published by CRC Press. This book was released on 1989-01-01 with total page 560 pages. Available in PDF, EPUB and Kindle. Book excerpt: This practical book shows how an understanding of structure, thermodynamics, and electrical properties can explain some of the choices of materials used in microelectronics, and can assist in the design of new materials for specific applications. It emphasizes the importance of the phase chemistry of semiconductor and metal systems for ensuring the long-term stability of new devices. The book discusses single-crystal and polycrystalline silicon, aluminium- and gold-based metallisation schemes, packaging semiconductor devices, failure analysis, and the suitability of various materials for optoelectronic devices and solar cells. It has been designed for senior undergraduates, graduates, and researchers in physics, electronic engineering, and materials science.
Book Synopsis Dielectric Films for Advanced Microelectronics by : Mikhail Baklanov
Download or read book Dielectric Films for Advanced Microelectronics written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2007-04-04 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
Book Synopsis Flexible Electronics by : William S. Wong
Download or read book Flexible Electronics written by William S. Wong and published by Springer. This book was released on 2009-04-28 with total page 462 pages. Available in PDF, EPUB and Kindle. Book excerpt: This excellent volume covers a range of materials used for flexible electronics, including semiconductors, dielectrics, and metals. The functional integration of these different materials is treated as well. Fundamental issues for both organic and inorganic materials systems are included. A corresponding overview of technological applications, based on each materials system, is presented to give both the non-specialist and the researcher in the field relevant information on the status of the flexible electronics area.
Book Synopsis Microelectronics to Nanoelectronics by : Anupama B. Kaul
Download or read book Microelectronics to Nanoelectronics written by Anupama B. Kaul and published by CRC Press. This book was released on 2017-12-19 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: Composed of contributions from top experts, Microelectronics to Nanoelectronics: Materials, Devices and Manufacturability offers a detailed overview of important recent scientific and technological developments in the rapidly evolving nanoelectronics arena. Under the editorial guidance and technical expertise of noted materials scientist Anupama B. Kaul of California Institute of Technology’s Jet Propulsion Lab, this book captures the ascent of microelectronics into the nanoscale realm. It addresses a wide variety of important scientific and technological issues in nanoelectronics research and development. The book also showcases some key application areas of micro-electro-mechanical-systems (MEMS) that have reached the commercial realm. Capitalizing on Dr. Kaul’s considerable technical experience with micro- and nanotechnologies and her extensive research in prestigious academic and industrial labs, the book offers a fresh perspective on application-driven research in micro- and nanoelectronics, including MEMS. Chapters explore how rapid developments in this area are transitioning from the lab to the market, where new and exciting materials, devices, and manufacturing technologies are revolutionizing the electronics industry. Although many micro- and nanotechnologies still face major scientific and technological challenges and remain within the realm of academic research labs, rapid advances in this area have led to the recent emergence of new applications and markets. This handbook encapsulates that exciting recent progress by providing high-quality content contributed by international experts from academia, leading industrial institutions—such as Hewlett-Packard—and government laboratories including the U.S. Department of Energy’s Sandia National Laboratory. Offering something for everyone, from students to scientists to entrepreneurs, this book showcases the broad spectrum of cutting-edge technologies that show significant promise for electronics and related applications in which nanotechnology plays a key role.
Book Synopsis Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging by : Ephraim Suhir
Download or read book Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Book Synopsis Nanotechnology for Microelectronics and Photonics by : Raúl José Martín-Palma
Download or read book Nanotechnology for Microelectronics and Photonics written by Raúl José Martín-Palma and published by Elsevier. This book was released on 2017-06-01 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanotechnology for Microelectronics and Photonics, Second Edition has been thoroughly revised, expanded, and updated. The aim of the book is to present the most recent advances in the field of nanomaterials, as well as the devices being developed for novel nanoelectronics and nanophotonic systems. It covers the many novel nanoscale applications in microelectronics and photonics that have been developed in recent years. Looking to the future, the book suggests what other applications are currently in development and may become feasible within the next few decades based on novel materials such as graphene, nanotubes, and organic semiconductors. In addition, the inclusion of new chapters and new sections to keep up with the latest developments in this rapidly-evolving field makes Nanotechnology for Microelectronics and Photonics, Second Edition an invaluable reference to research and industrial scientists looking for a guide on how nanostructured materials and nanoscale devices are used in microelectronics, optoelectronics, and photonics today and in future developments. - Presents the fundamental scientific principles that explain the novel properties and applications of nanostructured materials in the quantum frontier - Offers clear and concise coverage of how nanotechnology is currently used in the areas of microelectronics, optoelectronics, and photonics, as well as future proposed devices - Includes nearly a hundred problems along with helpful hints and full solutions for more than half of them
Book Synopsis Die-Attach Materials for High Temperature Applications in Microelectronics Packaging by : Kim S. Siow
Download or read book Die-Attach Materials for High Temperature Applications in Microelectronics Packaging written by Kim S. Siow and published by Springer. This book was released on 2019-01-29 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Book Synopsis Applied Materials Science by : Deborah D. L. Chung
Download or read book Applied Materials Science written by Deborah D. L. Chung and published by CRC Press. This book was released on 2001-06-13 with total page 253 pages. Available in PDF, EPUB and Kindle. Book excerpt: Materials are the foundation of technology. As such, most universities provide engineering undergraduates with the fundamental concepts of materials science, including crystal structures, imperfections, phase diagrams, materials processing, and materials properties. Few, however, offer the practical, applications-oriented background that their stud
Book Synopsis Chemical Mechanical Planarization of Microelectronic Materials by : Joseph M. Steigerwald
Download or read book Chemical Mechanical Planarization of Microelectronic Materials written by Joseph M. Steigerwald and published by John Wiley & Sons. This book was released on 2008-09-26 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.
Book Synopsis Materials Science and Engineering for the 1990s by : National Research Council
Download or read book Materials Science and Engineering for the 1990s written by National Research Council and published by National Academies Press. This book was released on 1989-02-01 with total page 322 pages. Available in PDF, EPUB and Kindle. Book excerpt: Materials science and engineering (MSE) contributes to our everyday lives by making possible technologies ranging from the automobiles we drive to the lasers our physicians use. Materials Science and Engineering for the 1990s charts the impact of MSE on the private and public sectors and identifies the research that must be conducted to help America remain competitive in the world arena. The authors discuss what current and future resources would be needed to conduct this research, as well as the role that industry, the federal government, and universities should play in this endeavor.
Book Synopsis PVD for Microelectronics: Sputter Desposition to Semiconductor Manufacturing by :
Download or read book PVD for Microelectronics: Sputter Desposition to Semiconductor Manufacturing written by and published by Elsevier. This book was released on 1998-10-29 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physics of Thin Films is one of the longest running continuing series in thin film science, consisting of 25 volumes since 1963. The series contains quality studies of the properties of various thin films materials and systems.In order to be able to reflect the development of today's science and to cover all modern aspects of thin films, the series, starting with Volume 20, has moved beyond the basic physics of thin films. It now addresses the most important aspects of both inorganic and organic thin films, in both their theoretical as well as technological aspects. Therefore, in order to reflect the modern technology-oriented problems, the title has been slightly modified from Physics of Thin Films to Thin Films.This volume, part of the Thin Films Series, has been wholly written by two authors instead of showcasing several edited manuscripts.
Book Synopsis Microelectronic Materials and Processes by : R.A. Levy
Download or read book Microelectronic Materials and Processes written by R.A. Levy and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 992 pages. Available in PDF, EPUB and Kindle. Book excerpt: The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.
