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Materials Reliability In Microelectronics Viii
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Book Synopsis Materials Reliability in Microelectronics VIII by : John C. Bravman
Download or read book Materials Reliability in Microelectronics VIII written by John C. Bravman and published by . This book was released on 1998 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Materials Reliability in Microelectronics by :
Download or read book Materials Reliability in Microelectronics written by and published by . This book was released on 1999 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Fracture Mechanics: Applications and Challenges by : M. Fuentes
Download or read book Fracture Mechanics: Applications and Challenges written by M. Fuentes and published by Elsevier. This book was released on 2000-09-13 with total page 275 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains 15 fully peer-reviewed Invited Papers which were presented at the 13th Biennial European Conference on Fracture and is a companion to the CD-ROM http://www.elsevier.com/locate/isbn/008043701xProceedings. The organisers of the ECF 13 opted from the very beginning for an application-orientated conference, and consequently, this book contributes to the understanding of fracture phenomena, and disseminates fracture concepts and their application to the solution of engineering problems to practitioners in a wide range of fields. The fields covered in this book can be broadly classified into: elastic-plastic fracture mechanics, fracture dynamics, fatigue and interactive processes, failure, structural integrity, coatings and materials, with applications to the following industrial sectors: transport, aerospace engineering, civil engineering, pipelines and automotive engineering.
Book Synopsis Reliability of Photonics Materials and Structures by : Ephraim Suhir
Download or read book Reliability of Photonics Materials and Structures written by Ephraim Suhir and published by . This book was released on 1998 with total page 448 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discusses the application of computer-aided and analytical methods and approaches of materials science and engineering mechanics to evaluating and assuring the short-term and long-term reliability of materials and structures in photonics engineering. The main concern is the mechanical reliability of the system and the impact of the mechanical behavior of photonics material and structures on the system's optical performance. The 49 papers cover general problems, strength degradation, fatigue and ageing in the materials, the structural analysis and modelling of the mechanical behavior, high- strength and metallized fibers, performance in harsh environments, and the reliability of devices. Annotation copyrighted by Book News, Inc., Portland, OR
Book Synopsis Diffusion Processes in Advanced Technological Materials by : Devendra Gupta
Download or read book Diffusion Processes in Advanced Technological Materials written by Devendra Gupta and published by Springer Science & Business Media. This book was released on 2013-01-15 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: This new game book for understanding atoms at play aims to document diffusion processes and various other properties operative in advanced technological materials. Diffusion in functional organic chemicals, polymers, granular materials, complex oxides, metallic glasses, and quasi-crystals among other advanced materials is a highly interactive and synergic phenomenon. A large variety of atomic arrangements are possible. Each arrangement affects the performance of these advanced, polycrystalline multiphase materials used in photonics, MEMS, electronics, and other applications of current and developing interest. This book is written by pioneers in industry and academia for engineers, chemists, and physicists in industry and academia at the forefront of today's challenges in nanotechnology, surface science, materials science, and semiconductors.
Book Synopsis Materials Issues in Vacuum Microelectronics: Volume 509 by : Wei Zhu
Download or read book Materials Issues in Vacuum Microelectronics: Volume 509 written by Wei Zhu and published by Mrs Proceedings. This book was released on 1998-08-21 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 31 papers, about half of the symposium's presentations, were selected to provide a representative sampling of the present status of materials used in vacuum microelectronics. They range across all aspects of electron field emission from theory and physical mechanisms to device structure, but many focus on the fabrication, characterization, and modeling of electron emissive materials. The sections cover field-emitter arrays and applications, carbon and wide-bandgap cathodes, and other cathode materials. Reproduced from typescripts. Annotation copyrighted by Book News, Inc., Portland, OR
Book Synopsis Reliability and Failure of Electronic Materials and Devices by : Milton Ohring
Download or read book Reliability and Failure of Electronic Materials and Devices written by Milton Ohring and published by Academic Press. This book was released on 2014-10-14 with total page 759 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Download or read book Research in Progress written by and published by . This book was released on 1991 with total page 274 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Materials and Contact Characterisation VIII by : C.A. Brebbia
Download or read book Materials and Contact Characterisation VIII written by C.A. Brebbia and published by WIT Press. This book was released on 2017-09-20 with total page 421 pages. Available in PDF, EPUB and Kindle. Book excerpt: Material and contact characterisation is a rapidly advancing field that requires the application of a combination of numerical and experimental methods. Including papers from the International Conference on Computational Methods and Experiments in Material and Contact Characterisation this volume presents the latest research in the field.
Book Synopsis III-V and IV-IV Materials and Processing Challenges for Highly Integrated Microelectronics and Optoelectronics: Volume 535 by : S. A. Ringel
Download or read book III-V and IV-IV Materials and Processing Challenges for Highly Integrated Microelectronics and Optoelectronics: Volume 535 written by S. A. Ringel and published by . This book was released on 1999-08-11 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains the proceedings of two symposia - 'Integration of Dissimilar Materials in Micro- and Optoelectronics' and 'III-V and SiGe Group IV Device/IC Processing Challenges for Commercial Applications'. The publication stems from the desire to achieve new levels of device functionality and higher levels of performance via integration of devices based on dissimilar semiconductors, where the constraint of lattice-matching on the breadth of attainable devices can be reduced. It covers fundamental topics germane to integration of a wide range of dissimilar materials spanning wide-bandgap III-V nitrides, III-V/Si integration, II-VI and II-VI/III-V compounds, heterovalent structures, oxides, photonic bandgap structures and others. Topics such as compliancy, dislocation control, selective area growth, bonding methodologies, etc. are featured. It also addresses processing issues in the manufacturing of III-V and Si-based heterostructures for commercial products. Here, the success enjoyed by silicon germanium technology is contrasted by the promise of silicon-carbon alloys which have opportunities and challenges for the new generation of process developers.
Book Synopsis Scientific Basis for Nuclear Waste Management by :
Download or read book Scientific Basis for Nuclear Waste Management written by and published by . This book was released on 1998 with total page 1368 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Ferroelectric Thin Films written by and published by . This book was released on 1998 with total page 800 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book GaN and Related Alloys written by and published by . This book was released on 1999 with total page 1074 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Dynamics in Small Confining Systems IV: Volume 543 by : J. M. Drake
Download or read book Dynamics in Small Confining Systems IV: Volume 543 written by J. M. Drake and published by . This book was released on 1999-07-15 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, the fourth in a series from the Materials Research Society, follows the tradition of earlier volumes in the series and covers a broad range of topics relating to structure and dynamics under geometric restrictions. Emphasis is on methods of probing confined systems, diffusion in porous media, polymers and membranes, dielectric and mechanical relaxation in nanopores, rheology and friction studies of embedded liquids, and properties of dendrimer supermolecules. Participants from many varied disciplines share their points of view on the fundamental questions of how spatial restrictions modify a system to behave significantly different than in bulk, how this difference relates to the molecular properties, and how it can be probed.
Book Synopsis GaN and Related Alloys: Volume 537 by : S. J. Pearton
Download or read book GaN and Related Alloys: Volume 537 written by S. J. Pearton and published by . This book was released on 1999-09-14 with total page 1056 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers the full spectrum of activity in the GaN and related materials arena. These semiconductors are finding applications in full-color displays, high-density information storage, white lighting for outdoor or backlit displays, solar-blind UV detectors, high-power/high-temperature electronics, and covert undersea communications. Progress is been reported in the growth of thick layers on patterned substrates by various methods, leading to lower overall defect concentrations and improved current-voltage and reliability characteristics. The rapidly increasing market for blue/green LEDs is also noted by the entry of a number of new companies to the field. While these emitter technologies continue to be dominated by MOCVD material, there are exciting reports of UV detectors and HFET structures grown by MBE with device performance at least as good as by MOCVD. Topics include: GaN electronic and photonic devices; laser diodes and spectroscopy; electronic devices and processing; quantum dots and processing; novel growth, doping and processing and rare-earth doping and optical emission.
Book Synopsis Texture and Anisotropy by : U. F. Kocks
Download or read book Texture and Anisotropy written by U. F. Kocks and published by Cambridge University Press. This book was released on 2000-08-15 with total page 672 pages. Available in PDF, EPUB and Kindle. Book excerpt: A successful book covering an important area of materials science, now available in paperback.
Book Synopsis Electronic Packaging Materials Science VIII: Volume 390 by : Robert C. Sundahl
Download or read book Electronic Packaging Materials Science VIII: Volume 390 written by Robert C. Sundahl and published by . This book was released on 1995-09-26 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: The dynamic nature of the microelectronics industry, in particular within the area of packaging, requires a continuous updating and revision of priorities. In an effort to communicate these priorities to researchers and engineers in the field, the National Technology Road Map was developed. This proceedings volume, the eighth in a series on electronic packaging, focuses on the materials research, development and processing issues identified in the road map. Topics include: an overview of the National Technology Road Map for Semiconductors; institutional and industrial perspectives; impact on materials needs and materials science issues; and research responses. Technical subtopics include polymers, ceramics, solder and composites.