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Author :
Publisher :
ISBN 13 :
Total Pages : 256 pages
Book Rating : 4.3/5 (91 download)
Download or read book Materials, Integration and Packaging Issues for High-frequency Devices written by and published by . This book was released on 2003 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : P. Muralt
Publisher : Cambridge University Press
ISBN 13 : 9781558997219
Total Pages : 0 pages
Book Rating : 4.9/5 (972 download)
Download or read book Materials, Integration and Packaging Issues for High-Frequency Devices: Volume 783 written by P. Muralt and published by Cambridge University Press. This book was released on 2004-04-05 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, first published in 2004, focuses on the materials technologies that are key to the advancement of high-frequency devices. The competition for better-performing mobile phones is the main driving factor in this field. In mobile phones, passive components constitute 70-90% of the number of components, volume, and costs. The spirit of the volume is to bring together scientists in the processing, characterization, packaging, device design and applications of passive devices, to gain insight into the various paths along which technology of passive components is progressing. Topics include: improvements in low-temperature co-fired ceramics; microstructure - property relationships in perovskites for new materials compositions, with lower firing temperatures, for microwave dielectrics with high-quality factors; tunable ferroelectrics allowing low-cost solutions for frequency tuning and phase shifters; new integration platforms and packaging concepts; embedded capacitors; integration of RF switches based on MEMS technology; bulk acoustic wave resonators and above-chip integration.
Author : Yong S. Cho
Publisher :
ISBN 13 : 9781558997813
Total Pages : 270 pages
Book Rating : 4.9/5 (978 download)
Download or read book Materials, Integration and Packaging Issues for High-frequency Devices II written by Yong S. Cho and published by . This book was released on 2005-01-01 with total page 270 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : James E. Morris
Publisher : Springer Science & Business Media
ISBN 13 : 0387473262
Total Pages : 553 pages
Book Rating : 4.3/5 (874 download)
Download or read book Nanopackaging written by James E. Morris and published by Springer Science & Business Media. This book was released on 2008-12-30 with total page 553 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Author : Jeremy A. Theil
Publisher :
ISBN 13 :
Total Pages : 192 pages
Book Rating : 4.3/5 (91 download)
Download or read book Materials, Integration and Technology for Monolithic Instruments: Volume 869 written by Jeremy A. Theil and published by . This book was released on 2005-07-28 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Chuan Seng Tan
Publisher : Springer Science & Business Media
ISBN 13 : 0387765344
Total Pages : 365 pages
Book Rating : 4.3/5 (877 download)
Download or read book Wafer Level 3-D ICs Process Technology written by Chuan Seng Tan and published by Springer Science & Business Media. This book was released on 2009-06-29 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Author : Debatosh Guha
Publisher : John Wiley & Sons
ISBN 13 : 1119972981
Total Pages : 512 pages
Book Rating : 4.1/5 (199 download)
Download or read book Microstrip and Printed Antennas written by Debatosh Guha and published by John Wiley & Sons. This book was released on 2011-02-02 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on new techniques, analysis, applications and future trends of microstrip and printed antenna technologies, with particular emphasis to recent advances from the last decade Attention is given to fundamental concepts and techniques, their practical applications and the future scope of developments. Several topics, essayed as individual chapters include reconfigurable antenna, ultra-wideband (UWB) antenna, reflectarrays, antennas for RFID systems and also those for body area networks. Also included are antennas using metamaterials and defected ground structures (DGSs). Essential aspects including advanced design, analysis and optimization techniques based on the recent developments have also been addressed. Key Features: Addresses emerging hot topics of research and applications in microstrip and printed antennas Considers the fundamental concepts, techniques, applications and future scope of such technologies Discusses modern applications such as wireless base station to mobile handset, satellite earth station to airborne communication systems, radio frequency identification (RFID) to body area networks, etc. Contributions from highly regarded experts and pioneers from the US, Europe and Asia This book provides a reference for R&D researchers, professors, practicing engineers, and scientists working in these fields. Graduate students studying/working on related subjects will find this book as a comprehensive literature for understanding the present and future trends in microstrip and printed antennas.
Author : Yosi Shacham-Diamand
Publisher : Springer Science & Business Media
ISBN 13 : 0387958681
Total Pages : 545 pages
Book Rating : 4.3/5 (879 download)
Download or read book Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications written by Yosi Shacham-Diamand and published by Springer Science & Business Media. This book was released on 2009-09-19 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Author : Satyen Mukherjee
Publisher : Springer Science & Business Media
ISBN 13 : 1402041985
Total Pages : 480 pages
Book Rating : 4.4/5 (2 download)
Download or read book AmIware written by Satyen Mukherjee and published by Springer Science & Business Media. This book was released on 2006-06-29 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ambient Intelligence is one of the new paradigms in the development of information and communication technology, which has attracted much attention over the past years. The aim is the to integrate technology into people environment in such a way that it improves their daily lives in terms of well-being, creativity, and productivity. Ambient Intelligence is a multidisciplinary concept, which heavily builds on a number of fundamental breakthroughs that have been achieved in the development of new hardware concepts over the past years. New insights in nano and micro electronics, packaging and interconnection technology, large-area electronics, energy scavenging devices, wireless sensors, low power electronics and computing platforms enable the realization of the heaven of ambient intelligence by overcoming the hell of physics. Based on contributions from leading technical experts, this book presents a number of key topics on novel hardware developments, thus providing the reader a good insight into the physical basis of ambient intelligence. It also indicates key research challenges that must be addressed in the future.
Author : Winston O. Soboyejo
Publisher : CRC Press
ISBN 13 : 1420017462
Total Pages : 526 pages
Book Rating : 4.4/5 (2 download)
Download or read book Advanced Structural Materials written by Winston O. Soboyejo and published by CRC Press. This book was released on 2006-12-21 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: A snapshot of the central ideas used to control fracture properties of engineered structural metallic materials, Advanced Structural Materials: Properties, Design Optimization, and Applications illustrates the critical role that advanced structural metallic materials play in aerospace, biomedical, automotive, sporting goods, and other indust
Author : Yung-cheng Lee
Publisher : World Scientific
ISBN 13 : 9813229373
Total Pages : 363 pages
Book Rating : 4.8/5 (132 download)
Download or read book Mems Packaging written by Yung-cheng Lee and published by World Scientific. This book was released on 2018-01-03 with total page 363 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
Author : Yangyuan Wang
Publisher : Springer Nature
ISBN 13 : 9819928362
Total Pages : 2006 pages
Book Rating : 4.8/5 (199 download)
Download or read book Handbook of Integrated Circuit Industry written by Yangyuan Wang and published by Springer Nature. This book was released on 2023-12-29 with total page 2006 pages. Available in PDF, EPUB and Kindle. Book excerpt: Written by hundreds experts who have made contributions to both enterprise and academics research, these excellent reference books provide all necessary knowledge of the whole industrial chain of integrated circuits, and cover topics related to the technology evolution trends, fabrication, applications, new materials, equipment, economy, investment, and industrial developments of integrated circuits. Especially, the coverage is broad in scope and deep enough for all kind of readers being interested in integrated circuit industry. Remarkable data collection, update marketing evaluation, enough working knowledge of integrated circuit fabrication, clear and accessible category of integrated circuit products, and good equipment insight explanation, etc. can make general readers build up a clear overview about the whole integrated circuit industry. This encyclopedia is designed as a reference book for scientists and engineers actively involved in integrated circuit research and development field. In addition, this book provides enough guide lines and knowledges to benefit enterprisers being interested in integrated circuit industry.
Author : Yufeng Jin
Publisher : CRC Press
ISBN 13 : 1439865973
Total Pages : 232 pages
Book Rating : 4.4/5 (398 download)
Download or read book Introduction to Microsystem Packaging Technology written by Yufeng Jin and published by CRC Press. This book was released on 2017-12-19 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
Author : R. J. Carter
Publisher :
ISBN 13 :
Total Pages : 432 pages
Book Rating : 4.:/5 (318 download)
Download or read book Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics - 2004 written by R. J. Carter and published by . This book was released on 2004-09 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
Author : W.-P. Dow
Publisher : The Electrochemical Society
ISBN 13 : 1607688549
Total Pages : 57 pages
Book Rating : 4.6/5 (76 download)
Download or read book Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB written by W.-P. Dow and published by The Electrochemical Society. This book was released on 2018-09-21 with total page 57 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Evgeni Gusev
Publisher : Springer
ISBN 13 : 9048138078
Total Pages : 310 pages
Book Rating : 4.0/5 (481 download)
Download or read book Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators written by Evgeni Gusev and published by Springer. This book was released on 2010-03-03 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: A NATO Advanced Research Workshop (ARW) entitled “Advanced Materials and Technologies for Micro/Nano Devices, Sensors and Actuators” was held in St. Petersburg, Russia, from June 29 to July 2, 2009. The main goal of the Workshop was to examine (at a fundamental level) the very complex scientific issues that pertain to the use of micro- and nano-electromechanical systems (MEMS and NEMS), devices and technologies in next generation commercial and defen- related applications. Micro- and nano-electromechanical systems represent rather broad and diverse technological areas, such as optical systems (micromirrors, waveguides, optical sensors, integrated subsystems), life sciences and lab equipment (micropumps, membranes, lab-on-chip, membranes, microfluidics), sensors (bio-sensors, chemical sensors, gas-phase sensors, sensors integrated with electronics) and RF applications for signal transmission (variable capacitors, tunable filters and antennas, switches, resonators). From a scientific viewpoint, this is a very multi-disciplinary field, including micro- and nano-mechanics (such as stresses in structural materials), electronic effects (e. g. charge transfer), general electrostatics, materials science, surface chemistry, interface science, (nano)tribology, and optics. It is obvious that in order to overcome the problems surrounding next-generation MEMS/NEMS devices and applications it is necessary to tackle them from different angles: theoreticians need to speak with mechanical engineers, and device engineers and modelers to listen to surface physicists. It was therefore one of the main objectives of the workshop to bring together a multidisciplinary team of distinguished researchers.
Author :
Publisher :
ISBN 13 :
Total Pages : 760 pages
Book Rating : 4.3/5 (91 download)
Download or read book Amorphous and Nanocrystalline Silicon Science and Technology ... written by and published by . This book was released on 2005 with total page 760 pages. Available in PDF, EPUB and Kindle. Book excerpt:
