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Author :
Publisher :
ISBN 13 :
Total Pages : 734 pages
Book Rating : 4.F/5 ( download)
Download or read book Dissertation Abstracts International written by and published by . This book was released on 2002 with total page 734 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Electrochemical Society. High Temperature Materials Division
Publisher : The Electrochemical Society
ISBN 13 : 9781566771788
Total Pages : 1686 pages
Book Rating : 4.7/5 (717 download)
Download or read book Chemical Vapor Deposition written by Electrochemical Society. High Temperature Materials Division and published by The Electrochemical Society. This book was released on 1997 with total page 1686 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Cheol Seong Hwang
Publisher : Springer Science & Business Media
ISBN 13 : 146148054X
Total Pages : 266 pages
Book Rating : 4.4/5 (614 download)
Download or read book Atomic Layer Deposition for Semiconductors written by Cheol Seong Hwang and published by Springer Science & Business Media. This book was released on 2013-10-18 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.
Author :
Publisher :
ISBN 13 :
Total Pages : 2540 pages
Book Rating : 4.3/5 (91 download)
Download or read book Chemical Abstracts written by and published by . This book was released on 2002 with total page 2540 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Hugh O. Pierson
Publisher : William Andrew
ISBN 13 :
Total Pages : 376 pages
Book Rating : 4.3/5 (91 download)
Download or read book Handbook of Refractory Carbides and Nitrides written by Hugh O. Pierson and published by William Andrew. This book was released on 1996-12-31 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: The main objective of this book is to: (1) provide a complete review of the structures and properties of refractory carbides and nitrides; (2) provide a thorough assessment of the technology, processing, and equipment and systems used in production and R&D, with emphasis on advanced designs; and (3) identify and describe the applications, particularly new and emerging areas.
Author : Tapan Gupta
Publisher : Springer Science & Business Media
ISBN 13 : 1441900764
Total Pages : 433 pages
Book Rating : 4.4/5 (419 download)
Download or read book Copper Interconnect Technology written by Tapan Gupta and published by Springer Science & Business Media. This book was released on 2010-01-22 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Author : Daniel Dobkin
Publisher : Springer Science & Business Media
ISBN 13 : 9781402012488
Total Pages : 298 pages
Book Rating : 4.0/5 (124 download)
Download or read book Principles of Chemical Vapor Deposition written by Daniel Dobkin and published by Springer Science & Business Media. This book was released on 2003-04-30 with total page 298 pages. Available in PDF, EPUB and Kindle. Book excerpt: Principles of Chemical Vapor Deposition provides a simple introduction to heat and mass transfer, surface and gas phase chemistry, and plasma discharge characteristics. In addition, the book includes discussions of practical films and reactors to help in the development of better processes and equipment. This book will assist workers new to chemical vapor deposition (CVD) to understand CVD reactors and processes and to comprehend and exploit the literature in the field. The book reviews several disparate fields with which many researchers may have only a passing acquaintance, such as heat and mass transfer, discharge physics, and surface chemistry, focusing on key issues relevant to CVD. The book also examines examples of realistic industrial reactors and processes with simplified analysis to demonstrate how to apply the principles to practical situations. The book does not attempt to exhaustively survey the literature or to intimidate the reader with irrelevant mathematical apparatus. This book is as simple as possible while still retaining the essential physics and chemistry. The book is generously illustrated to assist the reader in forming the mental images which are the basis of understanding.
Author : S. P. Murarka
Publisher : Butterworth-Heinemann
ISBN 13 :
Total Pages : 268 pages
Book Rating : 4.3/5 (91 download)
Download or read book Metallization written by S. P. Murarka and published by Butterworth-Heinemann. This book was released on 1993 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: This title covers fundemental concepts, properties and applicabilities of metals and alloys for use in various metallization schemes. Metallizations form the key components on electronic circuits - controlling device properties and providing power and device interconnections with the outside world or with other devices. The recent advent of submicron dimensions and increasingly faster devices in the semiconductor have challenged researchers to keep metallization schemes in line with new demanding requirements.
Author : André Anders
Publisher : Springer Science & Business Media
ISBN 13 : 0387791086
Total Pages : 555 pages
Book Rating : 4.3/5 (877 download)
Download or read book Cathodic Arcs written by André Anders and published by Springer Science & Business Media. This book was released on 2009-07-30 with total page 555 pages. Available in PDF, EPUB and Kindle. Book excerpt: Cathodic arcs are among the longest studied yet least understood objects in science. Plasma-generating, tiny spots appear on the cathode; they are highly dynamic and hard to control. With an approach emphasizing the fractal character of cathode spots, strongly fluctuating plasma properties are described such as the presence of multiply charged ions that move with supersonic velocity. Richly illustrated, the book also deals with practical issues, such as arc source construction, macroparticle removal, and the synthesis of dense, well adherent coatings. The book spans a bridge from plasma physics to coatings technology based on energetic condensation, appealing to scientists, practitioners and graduate students alike.
Author : H. J. Goldschmidt
Publisher : Elsevier
ISBN 13 : 1483225739
Total Pages : 643 pages
Book Rating : 4.4/5 (832 download)
Download or read book Interstitial Alloys written by H. J. Goldschmidt and published by Elsevier. This book was released on 2016-01-22 with total page 643 pages. Available in PDF, EPUB and Kindle. Book excerpt: Interstitial Alloys covers the significant progress in the development and understanding of the principles and applications of interstitial alloys. Interstitial alloy refers to the existence of a pure metal lattice, which the metal-metal atom bond remains the dominant one, and the non-metal atoms are sufficiently small to be accommodated within the metal lattice without, or with only a limited degree of, distortion from metal-type symmetry. This book contains 10 chapters and begins with a brief introduction to the basic principles of interstitial alloys. The next two chapters describe the physical properties of these alloys, along with their behavior in solid solutions. The remaining chapters deal with a specific interstitial alloy, its structure, physico-chemical properties, preparation, and application. This work specifically considers carbide, nitride, boride, silicide, oxide, hydride, and mixed interstitial alloys. This book will be of value to chemists and physicists.
Author : IEEE International Interconnect Technology Conference
Publisher :
ISBN 13 : 9781538643372
Total Pages : pages
Book Rating : 4.6/5 (433 download)
Download or read book 2018 IEEE International Interconnect Technology Conference (IITC) written by IEEE International Interconnect Technology Conference and published by . This book was released on 2018 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Boris Ildusovich Kharisov
Publisher : Springer
ISBN 13 : 3030035050
Total Pages : 798 pages
Book Rating : 4.0/5 (3 download)
Download or read book Carbon Allotropes: Metal-Complex Chemistry, Properties and Applications written by Boris Ildusovich Kharisov and published by Springer. This book was released on 2019-01-02 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a detailed description of metal-complex functionalized carbon allotrope forms, including classic (such as graphite), rare (such as M- or T-carbon), and nanoforms (such as carbon nanotubes, nanodiamonds, etc.). Filling a void in the nanotechnology literature, the book presents chapters generalizing the synthesis, structure, properties, and applications of all known carbon allotropes. Metal-complex composites of carbons are described, along with several examples of their preparation and characterization, soluble metal-complex carbon composites, cost-benefit data, metal complexes as precursors of carbon allotropes, and applications. A lab manual on the synthesis and characterization of carbon allotropes and their metal-complex composites is included. Provides a complete description of all carbon allotropes, both classic and rare, as well as carbon nanostructures and their metal-complex composites; Contains a laboratory manual of experiments on the synthesis and characterization of metal-complex carbon composites; Discusses applications in diverse fields, such as catalysis on supporting materials, water treatment, sensors, drug delivery, and devices.
Author : J. Cortadella
Publisher : Springer Science & Business Media
ISBN 13 : 3642559891
Total Pages : 279 pages
Book Rating : 4.6/5 (425 download)
Download or read book Logic Synthesis for Asynchronous Controllers and Interfaces written by J. Cortadella and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is the result of a long friendship, of a broad international co operation, and of a bold dream. It is the summary of work carried out by the authors, and several other wonderful people, during more than 15 years, across 3 continents, in the course of countless meetings, workshops and discus sions. It shows that neither language nor distance can be an obstacle to close scientific cooperation, when there is unity of goals and true collaboration. When we started, we had very different approaches to handling the mys terious, almost magical world of asynchronous circuits. Some were more theo retical, some were closer to physical reality, some were driven mostly by design needs. In the end, we all shared the same belief that true Electronic Design Automation research must be solidly grounded in formal models, practically minded to avoid excessive complexity, and tested "in the field" in the form of experimental tools. The results are this book, and the CAD tool petrify. The latter can be downloaded and tried by anybody bold (or desperate) enough to tread into the clockless (but not lawless) domain of small-scale asynchronicity. The URL is http://www.lsi. upc. esr j ordic/petrify. We believe that asynchronous circuits are a wonderful object, that aban dons some of the almost militaristic law and order that governs synchronous circuits, to improve in terms of simplicity, energy efficiency and performance.
Author : National Institute of Standards and Technology (U.S.)
Publisher :
ISBN 13 :
Total Pages : 146 pages
Book Rating : 4.:/5 (7 download)
Download or read book National Semiconductor Metrology Program written by National Institute of Standards and Technology (U.S.) and published by . This book was released on 1995 with total page 146 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : C.P. Wong
Publisher : Springer Science & Business Media
ISBN 13 : 1441900403
Total Pages : 761 pages
Book Rating : 4.4/5 (419 download)
Download or read book Nano-Bio- Electronic, Photonic and MEMS Packaging written by C.P. Wong and published by Springer Science & Business Media. This book was released on 2009-12-23 with total page 761 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
Author : Toshiro Doi
Publisher : William Andrew
ISBN 13 : 1437778593
Total Pages : 330 pages
Book Rating : 4.4/5 (377 download)
Download or read book Advances in CMP Polishing Technologies written by Toshiro Doi and published by William Andrew. This book was released on 2011-12-06 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan
Author : Yosi Shacham-Diamand
Publisher : Springer Science & Business Media
ISBN 13 : 0387958681
Total Pages : 545 pages
Book Rating : 4.3/5 (879 download)
Download or read book Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications written by Yosi Shacham-Diamand and published by Springer Science & Business Media. This book was released on 2009-09-19 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
