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Author : T. M. Lu
Publisher :
ISBN 13 : 9781558992849
Total Pages : 288 pages
Book Rating : 4.9/5 (928 download)
Download or read book Low-Dielectric Constant Materials-Synthesis and Applications in Microelectronics written by T. M. Lu and published by . This book was released on 1995 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Paul S. Ho
Publisher : Springer Science & Business Media
ISBN 13 : 3642559085
Total Pages : 323 pages
Book Rating : 4.6/5 (425 download)
Download or read book Low Dielectric Constant Materials for IC Applications written by Paul S. Ho and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 323 pages. Available in PDF, EPUB and Kindle. Book excerpt: Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for
Author :
Publisher :
ISBN 13 :
Total Pages : 330 pages
Book Rating : 4.3/5 (91 download)
Download or read book Low-dielectric Constant Materials written by and published by . This book was released on 1999 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Toh-Ming Lu
Publisher :
ISBN 13 :
Total Pages : 312 pages
Book Rating : 4.:/5 (318 download)
Download or read book Low-dielectric Constant Materials-- Synthesis and Applications in Microelectronics written by Toh-Ming Lu and published by . This book was released on 1995 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Hari Singh Nalwa
Publisher : Elsevier
ISBN 13 : 0080533531
Total Pages : 562 pages
Book Rating : 4.0/5 (85 download)
Download or read book Handbook of Low and High Dielectric Constant Materials and Their Applications, Two-Volume Set written by Hari Singh Nalwa and published by Elsevier. This book was released on 1999-09-07 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recent developments in microelectronics technologies have created a great demand for interlayer dielectric materials with a very low dielectric constant. They will play a crucial role in the future generation of IC devices (VLSI/UISI and high speed IC packaging). Considerable efforts have been made to develop new low as well as high dielectric constant materials for applications in electronics industries. Besides achieving either low or high dielectric constants, other materials' properties such as good processability, high mechanical strength, high thermal and environmental stability, low thermal expansion, low current leakage, low moisture absorption, corrosion resistant, etc., are of equal importance. Many chemical and physical strategies have been employed to get desired dielectric materials with high performance. This is a rapidly growing field of science--both in novel materials and their applications to future packing technologies. The experimental data on inorganic and organic materials having low or high dielectric constant remail scattered in the literature. It is timely, therfore, to consolidate the current knowledge on low and high dielectric constant materials into a sigle reference source. Handbook of Low and High Dielectric Constant Materials and Their Applications is aimed at bringing together under a sigle cover (in two volumes) all low and high dielectric constant materials currently studied in academic and industrial research covering all spects of inorgani an organic materials from their synthetic chemistry, processing techniques, physics, structure-property relationship to applications in IC devices. This book will summarize the current status of the field covering important scientific developments made over the past decade with contributions from internationally recognized experts from all over the world. Fully cross-referenced, this book has clear, precise, and wide appeal as an essential reference source for all those interested in low and high dielectric constant material.
Author : Yoshio Nishi
Publisher : CRC Press
ISBN 13 : 9780824787837
Total Pages : 1186 pages
Book Rating : 4.7/5 (878 download)
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2000-08-09 with total page 1186 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Handbook of Semiconductor Manufacturing Technology describes the individual processes and manufacturing control, support, and infrastructure technologies of silicon-based integrated-circuit manufacturing, many of which are also applicable for building devices on other semiconductor substrates. Discussing ion implantation, rapid thermal processing, photomask fabrication, chip testing, and plasma etching, the editors explore current and anticipated equipment, devices, materials, and practices of silicon-based manufacturing. The book includes a foreword by Jack S. Kilby, cowinner of the Nobel Prize in Physics 2000 "for his part in the invention of the integrated circuit."
Author : Carlye Case
Publisher :
ISBN 13 :
Total Pages : 320 pages
Book Rating : 4.:/5 (318 download)
Download or read book Low-Dielectric Constant Materials III: Volume 476 written by Carlye Case and published by . This book was released on 1997 with total page 320 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Howard Huff
Publisher : Springer Science & Business Media
ISBN 13 : 3540264620
Total Pages : 723 pages
Book Rating : 4.5/5 (42 download)
Download or read book High Dielectric Constant Materials written by Howard Huff and published by Springer Science & Business Media. This book was released on 2005-11-02 with total page 723 pages. Available in PDF, EPUB and Kindle. Book excerpt: Issues relating to the high-K gate dielectric are among the greatest challenges for the evolving International Technology Roadmap for Semiconductors (ITRS). More than just an historical overview, this book will assess previous and present approaches related to scaling the gate dielectric and their impact, along with the creative directions and forthcoming challenges that will define the future of gate dielectric scaling technology.
Author : John Hummel
Publisher : Cambridge University Press
ISBN 13 : 9781558994720
Total Pages : 0 pages
Book Rating : 4.9/5 (947 download)
Download or read book Low-Dielectric Constant Materials V: Volume 565 written by John Hummel and published by Cambridge University Press. This book was released on 2000-01-12 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Interest in developing low-dielectric constant materials is driven by requirements from the microelectronics sector to improve performance in interconnections by reducing parasitic capacitance and cross talk. The continuing increase in density of semiconductor devices is becoming limited by the dielectric properties of the insulator which threatens to slow the rate of productivity. The requirement for dielectric constant is rapidly approaching an e value of 2.0, with continued improvement sought even below this level to maintain this progression, commonly known as Moore's Law. Synthetic methods of obtaining materials in this range are addressed in this book. The materials solution to the interconnect problem - changing the insulator to lower the dielectric constant from 4.0, the e of silicon dioxide - introduces a host of reliability concerns, as well as changes to the process of manufacturing semiconductor devices. Topics include: porous films - organic and inorganic; porous films - organic/low-k integration; low-k integration; low-k/advanced interconnect; low-dielectric constant materials and applications in microelectronics and low-k film property/integration.
Author : Theodore M. Besmann
Publisher : The Electrochemical Society
ISBN 13 : 9781566771559
Total Pages : 922 pages
Book Rating : 4.7/5 (715 download)
Download or read book Proceedings of the Thirteenth International Conference on Chemical Vapor Deposition written by Theodore M. Besmann and published by The Electrochemical Society. This book was released on 1996 with total page 922 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Sunggyu Lee
Publisher : CRC Press
ISBN 13 : 1351237683
Total Pages : 3338 pages
Book Rating : 4.3/5 (512 download)
Download or read book Encyclopedia of Chemical Processing (Online) written by Sunggyu Lee and published by CRC Press. This book was released on 2005-11-01 with total page 3338 pages. Available in PDF, EPUB and Kindle. Book excerpt: This second edition Encyclopedia supplies nearly 350 gold standard articles on the methods, practices, products, and standards influencing the chemical industries. It offers expertly written articles on technologies at the forefront of the field to maximize and enhance the research and production phases of current and emerging chemical manufacturing practices and techniques. This collecting of information is of vital interest to chemical, polymer, electrical, mechanical, and civil engineers, as well as chemists and chemical researchers. A complete reconceptualization of the classic reference series the Encyclopedia of Chemical Processing and Design, whose first volume published in 1976, this resource offers extensive A-Z treatment of the subject in five simultaneously published volumes, with comprehensive indexing of all five volumes in the back matter of each tome. It includes material on the design of key unit operations involved with chemical processes; the design, unit operation, and integration of reactors and separation systems; process system peripherals such as pumps, valves, and controllers; analytical techniques and equipment; and pilot plant design and scale-up criteria. This reference contains well-researched sections on automation, equipment, design and simulation, reliability and maintenance, separations technologies, and energy and environmental issues. Authoritative contributions cover chemical processing equipment, engineered systems, and laboratory apparatus currently utilized in the field. It also presents expert overviews on key engineering science topics in property predictions, measurements and analysis, novel materials and devices, and emerging chemical fields. ALSO AVAILABLE ONLINE This Taylor & Francis encyclopedia is also available through online subscription, offering a variety of extra benefits for both researchers, students, and librarians, including: Citation tracking and alerts Active reference linking Saved searches and marked lists HTML and PDF format options Contact Taylor and Francis for more information or to inquire about subscription options and print/online combination packages. US: (Tel) 1.888.318.2367; (E-mail) [email protected] International: (Tel) +44 (0) 20 7017 6062; (E-mail) [email protected]
Author : Christopher Lyle Borst
Publisher : Springer Science & Business Media
ISBN 13 : 1461511658
Total Pages : 235 pages
Book Rating : 4.4/5 (615 download)
Download or read book Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses written by Christopher Lyle Borst and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 235 pages. Available in PDF, EPUB and Kindle. Book excerpt: As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.
Author : William D. Brown
Publisher : The Electrochemical Society
ISBN 13 : 9781566771979
Total Pages : 384 pages
Book Rating : 4.7/5 (719 download)
Download or read book Dielectric Material Integration for Microelectronics written by William D. Brown and published by The Electrochemical Society. This book was released on 1998 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : André Lagendijk
Publisher :
ISBN 13 :
Total Pages : 224 pages
Book Rating : 4.:/5 (318 download)
Download or read book Low-Dielectric Constant Materials II: Volume 443 written by André Lagendijk and published by . This book was released on 1997-08-19 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: Low-dielectric constant materials are needed to improve the performance and speed of future integrated circuits. In fact, the diversity of contributors to this book is testimony to the global significance of the topic to the future of semiconductor manufacturing. Presentations include those by semiconductor equipment manufacturers and chemical source suppliers, academia from six countries, four government laboratories and five major device manufacturers. Approaches to designing and implementing reduction in dielectric constant for intermetal dielectric materials are featured and range from the evolution of silicon dioxide to fluorinated silicate glass, to the use of inorganic/organic polymers and spin-on-material, to fluorinated diamond-like carbon and nanoporous silica. The book also addresses the practical aspects of the use of low-dielectric constant materials such as chemical mechanical polishing of these materials and optimization of wiring delays in devices utilizing low-k material.
Author : Hari Singh Nalwa
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (742 download)
Download or read book Handbook of Low and High Dielectric Constant Materials and Their Applications, Two-Volume Set written by Hari Singh Nalwa and published by . This book was released on 1999 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : K. M. Nair
Publisher : John Wiley & Sons
ISBN 13 : 1118408179
Total Pages : 323 pages
Book Rating : 4.1/5 (184 download)
Download or read book Advances in Dielectric Materials and Electronic Devices written by K. M. Nair and published by John Wiley & Sons. This book was released on 2012-04-11 with total page 323 pages. Available in PDF, EPUB and Kindle. Book excerpt: This proceedings contains papers presented at the Advanced Dielectric Materials: Design, Preparation, Processing and Applications; and Advanced Dielectrics for Wireless Communications symposia. Topics include design of material, materials synthesis and processing, processing-microstructure-property relationship, multilayer device materials, thin and thick films, device applications, low temperature co-fired ceramics (LTCC)for multilayer devices, microwave dielectric materials and much more.
Author : Mark J. Lododa
Publisher : The Electrochemical Society
ISBN 13 : 9781566772709
Total Pages : 262 pages
Book Rating : 4.7/5 (727 download)
Download or read book Low and High Dielectric Constant Materials written by Mark J. Lododa and published by The Electrochemical Society. This book was released on 2000 with total page 262 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contains papers from a May 2000 symposium, representing the state of the art in areas of dielectric materials science and process integration. Papers are arranged in sections on low and high dielectric constant materials, covering topics such as ammonia plasma passivation effects on properties of post-CMP low-k HSQ, characterization of ashing effects on low-k dielectric films, and electron beam curing of thin film polymer dielectrics. Other subjects include characterization of high-k dielectrics using the non-contact surface charge profiler method, and processing effects and electrical evaluation of ZrO2 formed by RTP oxidation of Zr. Loboda is affiliated with Dow Corning Corporation. c. Book News Inc.
