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Author :
Publisher :
ISBN 13 :
Total Pages : 380 pages
Book Rating : 4.E/5 ( download)
Download or read book International Hybrid Microelectronics Symposium written by and published by . This book was released on 1970 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Richard A. Rikoski
Publisher : Wiley-Interscience
ISBN 13 :
Total Pages : 256 pages
Book Rating : 4.3/5 (91 download)
Download or read book Hybrid Microelectronic Circuits: the Thick Film written by Richard A. Rikoski and published by Wiley-Interscience. This book was released on 1973 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Publisher : ASM International
ISBN 13 : 9780871702852
Total Pages : 1234 pages
Book Rating : 4.7/5 (28 download)
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
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ISBN 13 :
Total Pages : 684 pages
Book Rating : 4.:/5 (31 download)
Download or read book Proceedings of the ... International Microelectronics Symposium written by and published by . This book was released on 1983 with total page 684 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 :
Total Pages : 838 pages
Book Rating : 4.F/5 ( download)
Download or read book Future Energy Conferences and Symposia written by and published by . This book was released on 1989 with total page 838 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Raj P. Chhabra
Publisher : CRC Press
ISBN 13 : 149871529X
Total Pages : 1649 pages
Book Rating : 4.4/5 (987 download)
Download or read book CRC Handbook of Thermal Engineering written by Raj P. Chhabra and published by CRC Press. This book was released on 2017-11-08 with total page 1649 pages. Available in PDF, EPUB and Kindle. Book excerpt: The CRC Handbook of Thermal Engineering, Second Edition, is a fully updated version of this respected reference work, with chapters written by leading experts. Its first part covers basic concepts, equations and principles of thermodynamics, heat transfer, and fluid dynamics. Following that is detailed coverage of major application areas, such as bioengineering, energy-efficient building systems, traditional and renewable energy sources, food processing, and aerospace heat transfer topics. The latest numerical and computational tools, microscale and nanoscale engineering, and new complex-structured materials are also presented. Designed for easy reference, this new edition is a must-have volume for engineers and researchers around the globe.
Author : V.R.K. Murthy
Publisher : Springer Science & Business Media
ISBN 13 : 3662087405
Total Pages : 263 pages
Book Rating : 4.6/5 (62 download)
Download or read book Microwave Materials written by V.R.K. Murthy and published by Springer Science & Business Media. This book was released on 2013-03-14 with total page 263 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solid State Materials have been gaining importance in recent times especially in the context of devices which can provide necessary infrastructure and flexibility for various human endeavours. In this context, microwave materials have a unique place especially in various device applications as well as in communication networks. Various technological developments are taking place in fine-tuning these materials for specific applicatio"ns and in fixed band frequencies. Though the science and technology of these materials has reached an advanced stage, systematic attempts are still lacking in bringing all available information in a single source. The present. volume is a modest attempt in this direction, though it cannot be considered to be the one that satisfies completely desired components and information required. The editors have enlisted certain articles of interest in this area, especially those dealing with measurement techniques, chapters dealing with materials like Ferrites, YIGs, Radome and high Tc superconducting materials which are of current interest. The editors are fully aware that the coverages are not comprehensive either in scope or in depth. The purpose of this volume is only to acquaint oneself of certain aspects of a fast developing field. The editors will be grateful for any comments or suggestions in this endeavour. V. R. K. MURTHY S. SUNDARAM B. VISWANATHAN Contents Preface v 1. Materials and Processes in Microwave Integrated Circuits Fabrication 1 T. Rs. Reddy 2. Materials and Technology for Microwave Integrated Circuits 30 Bharathi Bhat and Shiban K. Koul 3.
Author : Jennie S. Hwang
Publisher : Springer Science & Business Media
ISBN 13 : 9401160503
Total Pages : 461 pages
Book Rating : 4.4/5 (11 download)
Download or read book Solder Paste in Electronics Packaging written by Jennie S. Hwang and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 461 pages. Available in PDF, EPUB and Kindle. Book excerpt: One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.
Author : Philippe Cognard
Publisher : Elsevier
ISBN 13 : 0080534090
Total Pages : 511 pages
Book Rating : 4.0/5 (85 download)
Download or read book Handbook of Adhesives and Sealants written by Philippe Cognard and published by Elsevier. This book was released on 2005-07-14 with total page 511 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Adhesives and Sealants is the most comprehensive Adhesives and Sealants Handbook ever published, with the cooperation of around 35 authors from all over the world – each one a specialist in their field. It will include 80 chapters dealing with general information, theory of bonding and sealing, design of bonding parts, technical characteristics, chemistry, types of adhesives, application, equipment, controls, standards etc. Industrial applications such as automotive, aeronautics, building and civil engineering, electronics, packaging, wood, furniture, metals, plastics and composites, textiles, footwear etc. - Over 1,000 real-life examples illustrate the do's and don'ts of using adhesives - Every scientific and technical issue concerning every chemical type in every industry - Designed to help solve problems quickly, the content is structured to allow readers to navigate this comprehensive resource in 4 different ways
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ISBN 13 :
Total Pages : 1298 pages
Book Rating : 4.E/5 ( download)
Download or read book Nuclear Science Abstracts written by and published by . This book was released on 1974 with total page 1298 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 :
Total Pages : 612 pages
Book Rating : 4.F/5 ( download)
Download or read book Proceedings of the ... International Symposium on Microelectronics written by and published by . This book was released on 1985 with total page 612 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Pradeep Lall
Publisher : CRC Press
ISBN 13 : 0429605595
Total Pages : 332 pages
Book Rating : 4.4/5 (296 download)
Download or read book Influence of Temperature on Microelectronics and System Reliability written by Pradeep Lall and published by CRC Press. This book was released on 2020-07-09 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
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ISBN 13 :
Total Pages : 88 pages
Book Rating : 4.:/5 (3 download)
Download or read book NBS Technical Note written by and published by . This book was released on 1973-11 with total page 88 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Michael Pecht
Publisher : CRC Press
ISBN 13 : 1351829971
Total Pages : 910 pages
Book Rating : 4.3/5 (518 download)
Download or read book Handbook of Electronic Package Design written by Michael Pecht and published by CRC Press. This book was released on 2018-10-24 with total page 910 pages. Available in PDF, EPUB and Kindle. Book excerpt: Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Author : Richard Crowson
Publisher : CRC Press
ISBN 13 : 1420003666
Total Pages : 169 pages
Book Rating : 4.4/5 (2 download)
Download or read book Assembly Processes written by Richard Crowson and published by CRC Press. This book was released on 2006-01-13 with total page 169 pages. Available in PDF, EPUB and Kindle. Book excerpt: Today's fast-paced manufacturing culture demands a handbook that provides how-to, no-holds-barred, no-frills information. Completely revised and updated, the Handbook of Manufacturing Engineering is now presented in four volumes. Keeping the same general format as the first edition, this second edition not only provides more information but makes i
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ISBN 13 :
Total Pages : 888 pages
Book Rating : 4.3/5 (91 download)
Download or read book Microcircuit Reliability Bibliography written by and published by . This book was released on 1974 with total page 888 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : John Lau
Publisher : Springer Science & Business Media
ISBN 13 : 1468477676
Total Pages : 904 pages
Book Rating : 4.4/5 (684 download)
Download or read book Thermal Stress and Strain in Microelectronics Packaging written by John Lau and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 904 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.
