Interconnect Technology Conference 1998 Proceedings Of The Ieee 1998 International

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Handbook of Semiconductor Manufacturing Technology

Author : Yoshio Nishi
Publisher : CRC Press
ISBN 13 : 1420017667
Total Pages : 1720 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis Handbook of Semiconductor Manufacturing Technology by : Yoshio Nishi

Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Advanced Interconnects for ULSI Technology

Author : Mikhail Baklanov
Publisher : John Wiley & Sons
ISBN 13 : 1119966868
Total Pages : 616 pages
Book Rating : 4.1/5 (199 download)

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Book Synopsis Advanced Interconnects for ULSI Technology by : Mikhail Baklanov

Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-02-17 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Istfa 2001

Author : ASM International
Publisher : ASM International
ISBN 13 : 1615030859
Total Pages : 456 pages
Book Rating : 4.6/5 (15 download)

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Book Synopsis Istfa 2001 by : ASM International

Download or read book Istfa 2001 written by ASM International and published by ASM International. This book was released on 2001-01-01 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Interlayer Dielectrics for Semiconductor Technologies

Author : Shyam P Muraka
Publisher : Elsevier
ISBN 13 : 0080521959
Total Pages : 459 pages
Book Rating : 4.0/5 (85 download)

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Book Synopsis Interlayer Dielectrics for Semiconductor Technologies by : Shyam P Muraka

Download or read book Interlayer Dielectrics for Semiconductor Technologies written by Shyam P Muraka and published by Elsevier. This book was released on 2003-10-13 with total page 459 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor technologies are moving at such a fast pace that new materials are needed in all types of application. Manipulating the materials and their properties at atomic dimensions has become a must. This book presents the case of interlayer dielectrics materials whilst considering these challenges. Interlayer Dielectrics for Semiconductor Technologies cover the science, properties and applications of dielectrics, their preparation, patterning, reliability and characterisation, followed by the discussion of different materials including those with high dielctric constants and those useful for waveguide applications in optical communications on the chip and the package.* Brings together for the FIRST time the science and technology of interlayer deilectrics materials, in one volume* written by renowned experts in the field* Provides an up-to-date starting point in this young research field.

Electromigration in ULSI Interconnections

Author : Cher Ming Tan
Publisher : World Scientific
ISBN 13 : 9814273333
Total Pages : 312 pages
Book Rating : 4.8/5 (142 download)

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Book Synopsis Electromigration in ULSI Interconnections by : Cher Ming Tan

Download or read book Electromigration in ULSI Interconnections written by Cher Ming Tan and published by World Scientific. This book was released on 2010 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electromigration in ULSI Interconnections provides a comprehensive description of the electro migration in integrated circuits. It is intended for both beginner and advanced readers on electro migration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electro migration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electro migration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electro migration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained. The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electro migration are presented in a concise and rigorous manner.Methods of numerical modeling for the interconnect electro migration and their applications to the understanding of electro migration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electro migration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electro migration are outlined and discussed.

Area Array Interconnection Handbook

Author : Karl J. Puttlitz
Publisher : Springer Science & Business Media
ISBN 13 : 1461513898
Total Pages : 1250 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Area Array Interconnection Handbook by : Karl J. Puttlitz

Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.

Coding And Cryptology - Proceedings Of The First International Workshop

Author : Huaxiong Wang
Publisher : World Scientific
ISBN 13 : 9814470597
Total Pages : 288 pages
Book Rating : 4.8/5 (144 download)

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Book Synopsis Coding And Cryptology - Proceedings Of The First International Workshop by : Huaxiong Wang

Download or read book Coding And Cryptology - Proceedings Of The First International Workshop written by Huaxiong Wang and published by World Scientific. This book was released on 2008-07-16 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt: Over the past years, the rapid growth of the Internet and World Wide Web has provided great opportunities for online commercial activities, business transactions and government services over open computer and communication networks. However, such developments are only possible if communications can be conducted in a secure and reliable manner. The mathematical theory and practice of coding theory and cryptology underpin the provision of effective security and reliability for data communication, processing and storage. Theoretical and practical advances in these fields are therefore a key factor in facilitating the growth of data communications and data networks.The aim of the International Workshop on Coding and Cryptology 2007 was to bring together experts from coding theory, cryptology and their related areas for a fruitful exchange of ideas in order to stimulate further research and collaboration among mathematicians, computer scientists, practical cryptographers and engineers. This post-proceedings of the workshop consists of 20 selected papers on a wide range of topics in coding theory and cryptology, including theory, techniques, applications, and practical experiences. They cover significant advances in these areas and contain very useful surveys.

ESD

Author : Steven H. Voldman
Publisher : John Wiley & Sons
ISBN 13 : 0470012900
Total Pages : 420 pages
Book Rating : 4.4/5 (7 download)

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Book Synopsis ESD by : Steven H. Voldman

Download or read book ESD written by Steven H. Voldman and published by John Wiley & Sons. This book was released on 2005-12-13 with total page 420 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume is the first in a series of three books addressing Electrostatic Discharge (ESD) physics, devices, circuits and design across the full range of integrated circuit technologies. ESD Physics and Devices provides a concise treatment of the ESD phenomenon and the physics of devices operating under ESD conditions. Voldman presents an accessible introduction to the field for engineers and researchers requiring a solid grounding in this important area. The book contains advanced CMOS, Silicon On Insulator, Silicon Germanium, and Silicon Germanium Carbon. In addition it also addresses ESD in advanced CMOS with discussions on shallow trench isolation (STI), Copper and Low K materials. Provides a clear understanding of ESD device physics and the fundamentals of ESD phenomena. Analyses the behaviour of semiconductor devices under ESD conditions. Addresses the growing awareness of the problems resulting from ESD phenomena in advanced integrated circuits. Covers ESD testing, failure criteria and scaling theory for CMOS, SOI (silicon on insulator), BiCMOS and BiCMOS SiGe (Silicon Germanium) technologies for the first time. Discusses the design and development implications of ESD in semiconductor technologies. An invaluable reference for EMC non-specialist engineers and researchers working in the fields of IC and transistor design. Also, suitable for researchers and advanced students in the fields of device/circuit modelling and semiconductor reliability.

Handbook of Optoelectronics

Author : John P. Dakin
Publisher : CRC Press
ISBN 13 : 1351595601
Total Pages : 444 pages
Book Rating : 4.3/5 (515 download)

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Book Synopsis Handbook of Optoelectronics by : John P. Dakin

Download or read book Handbook of Optoelectronics written by John P. Dakin and published by CRC Press. This book was released on 2017-10-05 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Optoelectronics offers a self-contained reference from the basic science and light sources to devices and modern applications across the entire spectrum of disciplines utilizing optoelectronic technologies. This second edition gives a complete update of the original work with a focus on systems and applications. Volume I covers the details of optoelectronic devices and techniques including semiconductor lasers, optical detectors and receivers, optical fiber devices, modulators, amplifiers, integrated optics, LEDs, and engineered optical materials with brand new chapters on silicon photonics, nanophotonics, and graphene optoelectronics. Volume II addresses the underlying system technologies enabling state-of-the-art communications, imaging, displays, sensing, data processing, energy conversion, and actuation. Volume III is brand new to this edition, focusing on applications in infrastructure, transport, security, surveillance, environmental monitoring, military, industrial, oil and gas, energy generation and distribution, medicine, and free space. No other resource in the field comes close to its breadth and depth, with contributions from leading industrial and academic institutions around the world. Whether used as a reference, research tool, or broad-based introduction to the field, the Handbook offers everything you need to get started. John P. Dakin, PhD, is professor (emeritus) at the Optoelectronics Research Centre, University of Southampton, UK. Robert G. W. Brown, PhD, is chief executive officer of the American Institute of Physics and an adjunct full professor in the Beckman Laser Institute and Medical Clinic at the University of California, Irvine.

Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology

Author : Luciano Lavagno
Publisher : CRC Press
ISBN 13 : 1482254611
Total Pages : 798 pages
Book Rating : 4.4/5 (822 download)

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Book Synopsis Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology by : Luciano Lavagno

Download or read book Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology written by Luciano Lavagno and published by CRC Press. This book was released on 2017-02-03 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.

Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics

Author :
Publisher :
ISBN 13 :
Total Pages : 624 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics by :

Download or read book Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics written by and published by . This book was released on 2001 with total page 624 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Atomic Layer Deposition for Semiconductors

Author : Cheol Seong Hwang
Publisher : Springer Science & Business Media
ISBN 13 : 146148054X
Total Pages : 266 pages
Book Rating : 4.4/5 (614 download)

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Book Synopsis Atomic Layer Deposition for Semiconductors by : Cheol Seong Hwang

Download or read book Atomic Layer Deposition for Semiconductors written by Cheol Seong Hwang and published by Springer Science & Business Media. This book was released on 2013-10-18 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.

Multi-Net Optimization of VLSI Interconnect

Author : Konstantin Moiseev
Publisher : Springer
ISBN 13 : 1461408210
Total Pages : 245 pages
Book Rating : 4.4/5 (614 download)

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Book Synopsis Multi-Net Optimization of VLSI Interconnect by : Konstantin Moiseev

Download or read book Multi-Net Optimization of VLSI Interconnect written by Konstantin Moiseev and published by Springer. This book was released on 2014-11-07 with total page 245 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.

Materials for Information Technology

Author : Ehrenfried Zschech
Publisher : Springer Science & Business Media
ISBN 13 : 1846282357
Total Pages : 498 pages
Book Rating : 4.8/5 (462 download)

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Book Synopsis Materials for Information Technology by : Ehrenfried Zschech

Download or read book Materials for Information Technology written by Ehrenfried Zschech and published by Springer Science & Business Media. This book was released on 2006-07-02 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.

Model Reduction for Circuit Simulation

Author : Peter Benner
Publisher : Springer Science & Business Media
ISBN 13 : 940070089X
Total Pages : 317 pages
Book Rating : 4.4/5 (7 download)

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Book Synopsis Model Reduction for Circuit Simulation by : Peter Benner

Download or read book Model Reduction for Circuit Simulation written by Peter Benner and published by Springer Science & Business Media. This book was released on 2011-03-25 with total page 317 pages. Available in PDF, EPUB and Kindle. Book excerpt: Simulation based on mathematical models plays a major role in computer aided design of integrated circuits (ICs). Decreasing structure sizes, increasing packing densities and driving frequencies require the use of refined mathematical models, and to take into account secondary, parasitic effects. This leads to very high dimensional problems which nowadays require simulation times too large for the short time-to-market demands in industry. Modern Model Order Reduction (MOR) techniques present a way out of this dilemma in providing surrogate models which keep the main characteristics of the device while requiring a significantly lower simulation time than the full model. With Model Reduction for Circuit Simulation we survey the state of the art in the challenging research field of MOR for ICs, and also address its future research directions. Special emphasis is taken on aspects stemming from miniturisations to the nano scale. Contributions cover complexity reduction using e.g., balanced truncation, Krylov-techniques or POD approaches. For semiconductor applications a focus is on generalising current techniques to differential-algebraic equations, on including design parameters, on preserving stability, and on including nonlinearity by means of piecewise linearisations along solution trajectories (TPWL) and interpolation techniques for nonlinear parts. Furthermore the influence of interconnects and power grids on the physical properties of the device is considered, and also top-down system design approaches in which detailed block descriptions are combined with behavioral models. Further topics consider MOR and the combination of approaches from optimisation and statistics, and the inclusion of PDE models with emphasis on MOR for the resulting partial differential algebraic systems. The methods which currently are being developed have also relevance in other application areas such as mechanical multibody systems, and systems arising in chemistry and to biology. The current number of books in the area of MOR for ICs is very limited, so that this volume helps to fill a gap in providing the state of the art material, and to stimulate further research in this area of MOR. Model Reduction for Circuit Simulation also reflects and documents the vivid interaction between three active research projects in this area, namely the EU-Marie Curie Action ToK project O-MOORE-NICE (members in Belgium, The Netherlands and Germany), the EU-Marie Curie Action RTN-project COMSON (members in The Netherlands, Italy, Germany, and Romania), and the German federal project System reduction in nano-electronics (SyreNe).

Handbook of Signal Processing Systems

Author : Shuvra S. Bhattacharyya
Publisher : Springer Science & Business Media
ISBN 13 : 1441963456
Total Pages : 1099 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis Handbook of Signal Processing Systems by : Shuvra S. Bhattacharyya

Download or read book Handbook of Signal Processing Systems written by Shuvra S. Bhattacharyya and published by Springer Science & Business Media. This book was released on 2010-09-10 with total page 1099 pages. Available in PDF, EPUB and Kindle. Book excerpt: It gives me immense pleasure to introduce this timely handbook to the research/- velopment communities in the ?eld of signal processing systems (SPS). This is the ?rst of its kind and represents state-of-the-arts coverage of research in this ?eld. The driving force behind information technologies (IT) hinges critically upon the major advances in both component integration and system integration. The major breakthrough for the former is undoubtedly the invention of IC in the 50’s by Jack S. Kilby, the Nobel Prize Laureate in Physics 2000. In an integrated circuit, all components were made of the same semiconductor material. Beginning with the pocket calculator in 1964, there have been many increasingly complex applications followed. In fact, processing gates and memory storage on a chip have since then grown at an exponential rate, following Moore’s Law. (Moore himself admitted that Moore’s Law had turned out to be more accurate, longer lasting and deeper in impact than he ever imagined. ) With greater device integration, various signal processing systems have been realized for many killer IT applications. Further breakthroughs in computer sciences and Internet technologies have also catalyzed large-scale system integration. All these have led to today’s IT revolution which has profound impacts on our lifestyle and overall prospect of humanity. (It is hard to imagine life today without mobiles or Internets!) The success of SPS requires a well-concerted integrated approach from mul- ple disciplines, such as device, design, and application.

3D Microelectronic Packaging

Author : Yan Li
Publisher : Springer
ISBN 13 : 3319445863
Total Pages : 465 pages
Book Rating : 4.3/5 (194 download)

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Book Synopsis 3D Microelectronic Packaging by : Yan Li

Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer. This book was released on 2017-01-20 with total page 465 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.