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Integrated Package Ic And System Design
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Download or read book System-in-Package written by Lei He and published by Now Publishers Inc. This book was released on 2011-06-20 with total page 93 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surveys the electrical and layout perspectives of System-in-Package, the system integration technology that has emerged as a required technology to reduce the system board space and height in addition to the overall time-to-market and design cost of consumer electronics products such as those of cell phones, audio/video players and digital cameras.
Book Synopsis 3D IC Integration and Packaging by : John H. Lau
Download or read book 3D IC Integration and Packaging written by John H. Lau and published by McGraw Hill Professional. This book was released on 2015-07-06 with total page 481 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.3D IC Integration and Packaging covers:• 3D integration for semiconductor IC packaging• Through-silicon vias modeling and testing• Stress sensors for thin-wafer handling and strength measurement• Package substrate technologies• Microbump fabrication, assembly, and reliability• 3D Si integration• 2.5D/3D IC integration• 3D IC integration with passive interposer• Thermal management of 2.5D/3D IC integration• Embedded 3D hybrid integration• 3D LED and IC integration• 3D MEMS and IC integration• 3D CMOS image sensors and IC integration• PoP, chip-to-chip interconnects, and embedded fan-out WLP
Book Synopsis Integrated Circuit Packaging, Assembly and Interconnections by : William Greig
Download or read book Integrated Circuit Packaging, Assembly and Interconnections written by William Greig and published by Springer Science & Business Media. This book was released on 2007-04-24 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Book Synopsis Three-Dimensional Integrated Circuit Design by : Yuan Xie
Download or read book Three-Dimensional Integrated Circuit Design written by Yuan Xie and published by Springer Science & Business Media. This book was released on 2009-12-02 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).
Book Synopsis Three Dimensional System Integration by : Antonis Papanikolaou
Download or read book Three Dimensional System Integration written by Antonis Papanikolaou and published by Springer Science & Business Media. This book was released on 2010-12-07 with total page 251 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Book Synopsis Electronic Design Automation for IC System Design, Verification, and Testing by : Luciano Lavagno
Download or read book Electronic Design Automation for IC System Design, Verification, and Testing written by Luciano Lavagno and published by CRC Press. This book was released on 2017-12-19 with total page 644 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC System Design, Verification, and Testing thoroughly examines system-level design, microarchitectural design, logic verification, and testing. Chapters contributed by leading experts authoritatively discuss processor modeling and design tools, using performance metrics to select microprocessor cores for integrated circuit (IC) designs, design and verification languages, digital simulation, hardware acceleration and emulation, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on high-level synthesis, system-on-chip (SoC) block-based design, and back-annotating system-level models Offering improved depth and modernity, Electronic Design Automation for IC System Design, Verification, and Testing provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Book Synopsis Variation-Aware Design of Custom Integrated Circuits: A Hands-on Field Guide by : Trent McConaghy
Download or read book Variation-Aware Design of Custom Integrated Circuits: A Hands-on Field Guide written by Trent McConaghy and published by Springer Science & Business Media. This book was released on 2012-09-28 with total page 198 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book targets custom IC designers who are encountering variation issues in their designs, especially for modern process nodes at 45nm and below, such as statistical process variations, environmental variations, and layout effects. It teaches them the state-of-the-art in Variation-Aware Design tools, which help the designer to analyze quickly the variation effects, identify the problems, and fix the problems. Furthermore, this book describes the algorithms and algorithm behavior/performance/limitations, which is of use to designers considering these tools, designers using these tools, CAD researchers, and CAD managers.
Download or read book System on Package written by Rao Tummala and published by McGraw Hill Professional. This book was released on 2007-07-22 with total page 807 pages. Available in PDF, EPUB and Kindle. Book excerpt: System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Book Synopsis Digital Integrated Circuit Design Using Verilog and Systemverilog by : Ronald W. Mehler
Download or read book Digital Integrated Circuit Design Using Verilog and Systemverilog written by Ronald W. Mehler and published by Elsevier. This book was released on 2014-09-30 with total page 466 pages. Available in PDF, EPUB and Kindle. Book excerpt: For those with a basic understanding of digital design, this book teaches the essential skills to design digital integrated circuits using Verilog and the relevant extensions of SystemVerilog. In addition to covering the syntax of Verilog and SystemVerilog, the author provides an appreciation of design challenges and solutions for producing working circuits. The book covers not only the syntax and limitations of HDL coding, but deals extensively with design problems such as partitioning and synchronization, helping you to produce designs that are not only logically correct, but will actually work when turned into physical circuits. Throughout the book, many small examples are used to validate concepts and demonstrate how to apply design skills. This book takes readers who have already learned the fundamentals of digital design to the point where they can produce working circuits using modern design methodologies. It clearly explains what is useful for circuit design and what parts of the languages are only software, providing a non-theoretical, practical guide to robust, reliable and optimized hardware design and development. - Produce working hardware: Covers not only syntax, but also provides design know-how, addressing problems such as synchronization and partitioning to produce working solutions - Usable examples: Numerous small examples throughout the book demonstrate concepts in an easy-to-grasp manner - Essential knowledge: Covers the vital design topics of synchronization, essential for producing working silicon; asynchronous interfacing techniques; and design techniques for circuit optimization, including partitioning
Book Synopsis Integrated Circuit Test Engineering by : Ian A. Grout
Download or read book Integrated Circuit Test Engineering written by Ian A. Grout and published by Springer Science & Business Media. This book was released on 2005-08-22 with total page 396 pages. Available in PDF, EPUB and Kindle. Book excerpt: Using the book and the software provided with it, the reader can build his/her own tester arrangement to investigate key aspects of analog-, digital- and mixed system circuits Plan of attack based on traditional testing, circuit design and circuit manufacture allows the reader to appreciate a testing regime from the point of view of all the participating interests Worked examples based on theoretical bookwork, practical experimentation and simulation exercises teach the reader how to test circuits thoroughly and effectively
Book Synopsis Power Electronic Packaging by : Yong Liu
Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Download or read book Mobile Health written by Sasan Adibi and published by Springer. This book was released on 2015-02-18 with total page 1160 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers a comprehensive report on the technological aspects of Mobile Health (mHealth) and discusses the main challenges and future directions in the field. It is divided into eight parts: (1) preventive and curative medicine; (2) remote health monitoring; (3) interoperability; (4) framework, architecture, and software/hardware systems; (5) cloud applications; (6) radio technologies and applications; (7) communication networks and systems; and (8) security and privacy mechanisms. The first two parts cover sensor-based and bedside systems for remotely monitoring patients’ health condition, which aim at preventing the development of health problems and managing the prognosis of acute and chronic diseases. The related chapters discuss how new sensing and wireless technologies can offer accurate and cost-effective means for monitoring and evaluating behavior of individuals with dementia and psychiatric disorders, such as wandering behavior and sleep impairments. The following two parts focus on architectures and higher level systems, and on the challenges associated with their interoperability and scalability, two important aspects that stand in the way of the widespread deployment of mHealth systems. The remaining parts focus on telecommunication support systems for mHealth, including radio technologies, communication and cloud networks, and secure health-related applications and systems. All in all, the book offers a snapshot of the state-of-art in mHealth systems, and addresses the needs of a multidisciplinary audience, including engineers, computer scientists, healthcare providers, and medical professionals, working in both academia and the industry, as well as stakeholders at government agencies and non-profit organizations.
Book Synopsis Combinatorial Algorithms for Integrated Circuit Layout by :
Download or read book Combinatorial Algorithms for Integrated Circuit Layout written by and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 715 pages. Available in PDF, EPUB and Kindle. Book excerpt: The last decade has brought explosive growth in the technology for manufac turing integrated circuits. Integrated circuits with several hundred thousand transistors are now commonplace. This manufacturing capability, combined with the economic benefits of large electronic systems, is forcing a revolution in the design of these systems and providing a challenge to those people in terested in integrated system design. Modern circuits are too complex for an individual to comprehend completely. Managing tremendous complexity and automating the design process have become crucial issues. Two groups are interested in dealing with complexity and in developing algorithms to automate the design process. One group is composed of practi tioners in computer-aided design (CAD) who develop computer programs to aid the circuit-design process. The second group is made up of computer scientists and mathemati'::~l\ns who are interested in the design and analysis of efficient combinatorial aJ::,orithms. These two groups have developed separate bodies of literature and, until recently, have had relatively little interaction. An obstacle to bringing these two groups together is the lack of books that discuss issues of importance to both groups in the same context. There are many instances when a familiarity with the literature of the other group would be beneficial. Some practitioners could use known theoretical results to improve their "cut and try" heuristics. In other cases, theoreticians have published impractical or highly abstracted toy formulations, thinking that the latter are important for circuit layout.
Book Synopsis Extreme Low-Power Mixed Signal IC Design by : Armin Tajalli
Download or read book Extreme Low-Power Mixed Signal IC Design written by Armin Tajalli and published by Springer Science & Business Media. This book was released on 2010-09-14 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: Design exibility and power consumption in addition to the cost, have always been the most important issues in design of integrated circuits (ICs), and are the main concerns of this research, as well. Energy Consumptions: Power dissipation (P ) and energy consumption are - diss pecially importantwhen there is a limited amountof power budgetor limited source of energy. Very common examples are portable systems where the battery life time depends on system power consumption. Many different techniques have been - veloped to reduce or manage the circuit power consumption in this type of systems. Ultra-low power (ULP) applications are another examples where power dissipation is the primary design issue. In such applications, the power budget is so restricted that very special circuit and system level design techniquesare needed to satisfy the requirements. Circuits employed in applications such as wireless sensor networks (WSN), wearable battery powered systems [1], and implantable circuits for biol- ical applications need to consume very low amount of power such that the entire system can survive for a very long time without the need for changingor recharging battery[2–4]. Using newpowersupplytechniquessuchas energyharvesting[5]and printable batteries [6], is another reason for reducing power dissipation. Devel- ing special design techniques for implementing low power circuits [7–9], as well as dynamic power management (DPM) schemes [10] are the two main approaches to control the system power consumption. Design Flexibility: Design exibility is the other important issue in modern in- grated systems.
Book Synopsis Material-Integrated Intelligent Systems by : Stefan Bosse
Download or read book Material-Integrated Intelligent Systems written by Stefan Bosse and published by John Wiley & Sons. This book was released on 2017-11-23 with total page 700 pages. Available in PDF, EPUB and Kindle. Book excerpt: Combining different perspectives from materials science, engineering, and computer science, this reference provides a unified view of the various aspects necessary for the successful realization of intelligent systems. The editors and authors are from academia and research institutions with close ties to industry, and are thus able to offer first-hand information here. They adopt a unique, three-tiered approach such that readers can gain basic, intermediate, and advanced topical knowledge. The technology section of the book is divided into chapters covering the basics of sensor integration in materials, the challenges associated with this approach, data processing, evaluation, and validation, as well as methods for achieving an autonomous energy supply. The applications part then goes on to showcase typical scenarios where material-integrated intelligent systems are already in use, such as for structural health monitoring and smart textiles.
Book Synopsis Handbook of 3D Integration, Volume 4 by : Paul D. Franzon
Download or read book Handbook of 3D Integration, Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-05-06 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Book Synopsis EDA for IC System Design, Verification, and Testing by : Louis Scheffer
Download or read book EDA for IC System Design, Verification, and Testing written by Louis Scheffer and published by CRC Press. This book was released on 2018-10-03 with total page 593 pages. Available in PDF, EPUB and Kindle. Book excerpt: Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The first volume, EDA for IC System Design, Verification, and Testing, thoroughly examines system-level design, microarchitectural design, logical verification, and testing. Chapters contributed by leading experts authoritatively discuss processor modeling and design tools, using performance metrics to select microprocessor cores for IC designs, design and verification languages, digital simulation, hardware acceleration and emulation, and much more. Save on the complete set.
