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Integrated Circuit Design Fabrication And Test
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Book Synopsis Integrated Circuit Test Engineering by : Ian A. Grout
Download or read book Integrated Circuit Test Engineering written by Ian A. Grout and published by Springer Science & Business Media. This book was released on 2005-08-22 with total page 396 pages. Available in PDF, EPUB and Kindle. Book excerpt: Using the book and the software provided with it, the reader can build his/her own tester arrangement to investigate key aspects of analog-, digital- and mixed system circuits Plan of attack based on traditional testing, circuit design and circuit manufacture allows the reader to appreciate a testing regime from the point of view of all the participating interests Worked examples based on theoretical bookwork, practical experimentation and simulation exercises teach the reader how to test circuits thoroughly and effectively
Book Synopsis Integrated Circuit Design, Fabrication, and Test by : Peter Shepherd
Download or read book Integrated Circuit Design, Fabrication, and Test written by Peter Shepherd and published by McGraw-Hill Professional Publishing. This book was released on 1996 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt: All aspects of chip realization for both digital and analog circuits are covered. Electronics engineers are shown how to choose appropriate technololgy and circuit architecture, and plan the IC design. They'll gain expert information on power consaiderations, the advantages and disadvantages of each IC architecture, and aspects of design for testability.
Book Synopsis Three-Dimensional Integrated Circuit Design by : Vasilis F. Pavlidis
Download or read book Three-Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Book Synopsis Digital Integrated Circuit Design by : Hubert Kaeslin
Download or read book Digital Integrated Circuit Design written by Hubert Kaeslin and published by Cambridge University Press. This book was released on 2008-04-28 with total page 878 pages. Available in PDF, EPUB and Kindle. Book excerpt: This practical, tool-independent guide to designing digital circuits takes a unique, top-down approach, reflecting the nature of the design process in industry. Starting with architecture design, the book comprehensively explains the why and how of digital circuit design, using the physics designers need to know, and no more.
Book Synopsis III-V Integrated Circuit Fabrication Technology by : Shiban Tiku
Download or read book III-V Integrated Circuit Fabrication Technology written by Shiban Tiku and published by CRC Press. This book was released on 2016-04-27 with total page 706 pages. Available in PDF, EPUB and Kindle. Book excerpt: GaAs processing has reached a mature stage. New semiconductor compounds are emerging that will dominate future materials and device research, although the processing techniques used for GaAs will still remain relevant. This book covers all aspects of the current state of the art of III-V processing, with emphasis on HBTs. It is aimed at practicing
Book Synopsis Integrated Circuit Quality and Reliability by : Eugene R. Hnatek
Download or read book Integrated Circuit Quality and Reliability written by Eugene R. Hnatek and published by CRC Press. This book was released on 2018-10-03 with total page 809 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.
Book Synopsis Digital Integrated Circuits by : John E. Ayers
Download or read book Digital Integrated Circuits written by John E. Ayers and published by CRC Press. This book was released on 2018-09-03 with total page 468 pages. Available in PDF, EPUB and Kindle. Book excerpt: Exponential improvement in functionality and performance of digital integrated circuits has revolutionized the way we live and work. The continued scaling down of MOS transistors has broadened the scope of use for circuit technology to the point that texts on the topic are generally lacking after a few years. The second edition of Digital Integrated Circuits: Analysis and Design focuses on timeless principles with a modern interdisciplinary view that will serve integrated circuits engineers from all disciplines for years to come. Providing a revised instructional reference for engineers involved with Very Large Scale Integrated Circuit design and fabrication, this book delves into the dramatic advances in the field, including new applications and changes in the physics of operation made possible by relentless miniaturization. This book was conceived in the versatile spirit of the field to bridge a void that had existed between books on transistor electronics and those covering VLSI design and fabrication as a separate topic. Like the first edition, this volume is a crucial link for integrated circuit engineers and those studying the field, supplying the cross-disciplinary connections they require for guidance in more advanced work. For pedagogical reasons, the author uses SPICE level 1 computer simulation models but introduces BSIM models that are indispensable for VLSI design. This enables users to develop a strong and intuitive sense of device and circuit design by drawing direct connections between the hand analysis and the SPICE models. With four new chapters, more than 200 new illustrations, numerous worked examples, case studies, and support provided on a dynamic website, this text significantly expands concepts presented in the first edition.
Book Synopsis Integrated Circuits by : Peter Shepherd
Download or read book Integrated Circuits written by Peter Shepherd and published by Bloomsbury Publishing. This book was released on 1996-11-11 with total page 239 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated circuits have revolutionised the world of electronics and the associated areas of computing and communication. In past years the tasks of designing, manufacturing and testing these types of circuit were restricted to a few specialist engineers. However, within recent years the proliferation of computer tools and affordable access to IC manufacturing foundries has resulted in a substantial increase in the number of people designing ICs for the first time, both in universities and colleges and in industry. This book introduces the reader to all aspects of IC design, manufacture and testing with a minimum of mathematics, but with relevant examples at each stage. It examines the overall design strategies, the engineering trade-offs and the advantages, disadvantages and optimum applications of each available technology.
Book Synopsis Integrated Circuit Test Engineering by : Ian A. Grout
Download or read book Integrated Circuit Test Engineering written by Ian A. Grout and published by Springer Science & Business Media. This book was released on 2005-12-08 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt: Using the book and the software provided with it, the reader can build his/her own tester arrangement to investigate key aspects of analog-, digital- and mixed system circuits Plan of attack based on traditional testing, circuit design and circuit manufacture allows the reader to appreciate a testing regime from the point of view of all the participating interests Worked examples based on theoretical bookwork, practical experimentation and simulation exercises teach the reader how to test circuits thoroughly and effectively
Book Synopsis Single Flux Quantum Integrated Circuit Design by : Gleb Krylov
Download or read book Single Flux Quantum Integrated Circuit Design written by Gleb Krylov and published by Springer Nature. This book was released on 2021-10-09 with total page 252 pages. Available in PDF, EPUB and Kindle. Book excerpt: High efficiency, large scale, stationary computing systems – supercomputers and data centers – are becoming increasingly important due to the movement of data storage and processing onto remote cloud servers. This book is dedicated to a technology particularly appropriate for this application – superconductive electronics, in particular, rapid single flux quantum circuits. The primary purpose of this book is to introduce and systematize recent developments in superconductive electronics into a cohesive whole to support the further development of large scale computing systems. A brief background into the physics of superconductivity and the operation of common superconductive devices is provided, followed by an introduction into different superconductive logic families, including the logic gates, interconnect, and bias current distribution. Synchronization, fabrication, and electronic design automation methodologies are presented, reviewing both widely established concepts and techniques as well as recent approaches. Issues related to memory, synchronization, bias networks, and testability are described, and models, circuits, algorithms, and design methodologies are discussed and placed in context. The aim of this book is to provide insight and engineering intuition into the design of large scale digital superconductive circuits and systems.
Book Synopsis Digital Integrated Circuit Design Using Verilog and Systemverilog by : Ronald W. Mehler
Download or read book Digital Integrated Circuit Design Using Verilog and Systemverilog written by Ronald W. Mehler and published by Elsevier. This book was released on 2014-09-30 with total page 466 pages. Available in PDF, EPUB and Kindle. Book excerpt: For those with a basic understanding of digital design, this book teaches the essential skills to design digital integrated circuits using Verilog and the relevant extensions of SystemVerilog. In addition to covering the syntax of Verilog and SystemVerilog, the author provides an appreciation of design challenges and solutions for producing working circuits. The book covers not only the syntax and limitations of HDL coding, but deals extensively with design problems such as partitioning and synchronization, helping you to produce designs that are not only logically correct, but will actually work when turned into physical circuits. Throughout the book, many small examples are used to validate concepts and demonstrate how to apply design skills. This book takes readers who have already learned the fundamentals of digital design to the point where they can produce working circuits using modern design methodologies. It clearly explains what is useful for circuit design and what parts of the languages are only software, providing a non-theoretical, practical guide to robust, reliable and optimized hardware design and development. - Produce working hardware: Covers not only syntax, but also provides design know-how, addressing problems such as synchronization and partitioning to produce working solutions - Usable examples: Numerous small examples throughout the book demonstrate concepts in an easy-to-grasp manner - Essential knowledge: Covers the vital design topics of synchronization, essential for producing working silicon; asynchronous interfacing techniques; and design techniques for circuit optimization, including partitioning
Book Synopsis High-speed Integrated Circuit Technology by : Mark J. W. Rodwell
Download or read book High-speed Integrated Circuit Technology written by Mark J. W. Rodwell and published by World Scientific. This book was released on 2001 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book reviews the state of the art of very high speed digital integrated circuits. Commercial applications are in fiber optic transmission systems operating at 10, 40, and 100 Gb/s, while the military application is ADCs and DACs for microwave radar. The book contains detailed descriptions of the design, fabrication, and performance of wideband Si/SiGe-, GaAs-, and InP-based bipolar transistors. The analysis, design, and performance of high speed CMOS, silicon bipolar, and III-V digital ICs are presented in detail, with emphasis on application in optical fiber transmission and mixed signal ICs. The underlying physics and circuit design of rapid single flux quantum (RSFQ) superconducting logic circuits are reviewed, and there is extensive coverage of recent integrated circuit results in this technology.
Book Synopsis Microelectronic Test Structures for CMOS Technology by :
Download or read book Microelectronic Test Structures for CMOS Technology written by and published by . This book was released on 2011-08-26 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Fundamentals of Semiconductor Manufacturing and Process Control by : Gary S. May
Download or read book Fundamentals of Semiconductor Manufacturing and Process Control written by Gary S. May and published by John Wiley & Sons. This book was released on 2006-05-26 with total page 428 pages. Available in PDF, EPUB and Kindle. Book excerpt: A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.
Book Synopsis ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis by : ASM International
Download or read book ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2018-12-01 with total page 593 pages. Available in PDF, EPUB and Kindle. Book excerpt: The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Download or read book Labs on Chip written by Eugenio Iannone and published by CRC Press. This book was released on 2018-09-03 with total page 1143 pages. Available in PDF, EPUB and Kindle. Book excerpt: Labs on Chip: Principles, Design and Technology provides a complete reference for the complex field of labs on chip in biotechnology. Merging three main areas— fluid dynamics, monolithic micro- and nanotechnology, and out-of-equilibrium biochemistry—this text integrates coverage of technology issues with strong theoretical explanations of design techniques. Analyzing each subject from basic principles to relevant applications, this book: Describes the biochemical elements required to work on labs on chip Discusses fabrication, microfluidic, and electronic and optical detection techniques Addresses planar technologies, polymer microfabrication, and process scalability to huge volumes Presents a global view of current lab-on-chip research and development Devotes an entire chapter to labs on chip for genetics Summarizing in one source the different technical competencies required, Labs on Chip: Principles, Design and Technology offers valuable guidance for the lab-on-chip design decision-making process, while exploring essential elements of labs on chip useful both to the professional who wants to approach a new field and to the specialist who wants to gain a broader perspective.
Book Synopsis Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces by : Beth Keser
Download or read book Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces written by Beth Keser and published by John Wiley & Sons. This book was released on 2021-12-29 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
